United States
Securities and Exchange Commission
Form 6-K
Report of Foreign Private Issuer
Pursuant to Rule 13a-16 or 15d-16 of
the Securities Exchange Act of 1934
For the month of July, 2005
Commission File Number 000-29103
STATS CHIPPAC LTD.
Not Applicable
(Translation of registrant’s name into English)
Republic of Singapore
(Jurisdiction of incorporation or organization)
10 Ang Mo Kio Street 65
#05-17/20 TechPoint
Singapore 569059
(65) 6824-7888
(Address of principal executive offices)
Indicate by check mark whether the registrant files or will file annual reports under cover Form 20-F or Form 40-F.
Form 20-Fþ Form 40-Fo
Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934.
Yeso Noþ
If “Yes” is marked, indicate below the file number assigned to the registrant in connection with Rule 12g3-2(b). Not applicable.
This report on Form 6-K shall be deemed to be incorporated by reference in the prospectus included in the Registration Statements on Form F-3/S-3 (file numbers 333-119705 and 333-119705-1) of STATS ChipPAC Ltd. and STATS ChipPAC, Inc. and to be a part thereof from the date on which this report is furnished, to the extent not superseded by documents or reports subsequently filed or furnished.
SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.
STATS ChipPAC Ltd. | ||||
By: | /s/ Tan Lay Koon | |||
Name: | Tan Lay Koon | |||
Title: | President & Chief Executive Officer | |||
Date: | July 11, 2005 | |||
By: | /s/ Michael G. Potter | |||
Name: | Michael G. Potter | |||
Title: | Chief Financial Officer | |||
Date:: | July 11, 2005 |
FOR IMMEDIATE RELEASE
CORPORATE RELEASE
STATS ChipPAC Ltd. Announces Offering Of Senior Notes
Singapore and United States — July 11, 2005 — STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” — NNM: STTS and SGX: STATSChP), a leading independent semiconductor test and advanced packaging service provider, announced today that, subject to market conditions, it intends to offer in a private offering up to US$150 million in aggregate principal amount of senior notes due 2010. The senior notes will be guaranteed by all of STATS ChipPAC’s wholly owned subsidiaries, other than those subsidiaries organized under the laws of the People’s Republic of China and South Korea. Approval in-principle has been obtained for the listing and quotation of the senior notes on the Singapore Exchange.
The terms of the notes will be confirmed upon pricing of the offering. The Company intends to use approximately $99.0 million of the net proceeds to repay certain of its short-term borrowings. These short-term borrowings were drawn down by the Company to finance part of the redemption of its 1.75% convertible notes due 2007 on March 18, 2005. The Company intends to use the remaining net proceeds from the offering for general corporate purposes.
The senior notes will be offered in the United States only to qualified institutional buyers pursuant to Rule 144A under the Securities Act of 1933, as amended, and outside the United States only to non-U.S. persons under Regulation S of the Securities Act of 1933.
The senior notes to be offered have not been registered under the Securities Act of 1933 or any state securities laws and may not be offered or sold in the United States absent registration or an applicable exemption from the registration requirements of the Securities Act of 1933 and applicable state laws.
This press release shall not constitute an offer to sell or a solicitation of an offer to purchase any of the new senior notes, and shall not constitute an offer, solicitation, or sale in any state or jurisdiction in which such offer, solicitation or sale would be unlawful.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. (“STATS ChipPAC” or “the Company” — NNM: STTS and SGX: STATSChP), is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions. A trusted partner and supplier to leading semiconductor companies worldwide, STATS ChipPAC provides fully integrated, multi-site, end-to-end assembly and testing solutions that bring products to market faster. Our customers are some of the largest wafer foundries, integrated device manufacturers (IDMs) and fabless companies in the United States, Europe and Asia. STATS ChipPAC is a leader in mixed signal testing and advanced packaging technology for semiconductors used in diverse end market applications including communications, power, digital consumer and computing. With advanced process technology capabilities and a global manufacturing presence spanning Singapore, South Korea, China, Malaysia and Taiwan, STATS ChipPAC has a reputation for providing dependable, high quality test and packaging solutions. The Company’s customer support offices are centered in the United States (California’s Silicon Valley, Arizona, Texas, Massachusetts, Florida, Colorado and North Carolina). Our offices outside the United States are located in the Netherlands, United Kingdom, China, Singapore, Japan, Taiwan, South Korea and Malaysia. STATS ChipPAC’s facilities include those of its subsidiary, Winstek Semiconductor Corporation in Hsinchu Valley, Taiwan. These facilities offer new product introduction support, pre-production wafer sort, final test, packaging and other high volume preparatory services. Together with our research and development centers in Singapore and South Korea as well as test facilities in the United States, this forms a global network providing dedicated test engineering development and product engineering support for customers from design to volume production. STATS ChipPAC is listed on both the Nasdaq National Market and The Singapore Exchange. In addition, STATS ChipPAC is also listed on the Morgan Stanley Capital International (MSCI) Index and the Straits Times Industrial Index. Further information is available atwww.statschippac.com. Information contained in this website does not constitute a part of this corporate release.
Forward-looking statements
Certain statements in this press release including statements regarding STATS ChipPAC’s present intention to use a portion of the net proceeds to repay certain of its short-term borrowings, are forward-looking statements that involve a number of risks and uncertainties. Among the risks and uncertainties that could cause actual results to differ materially is a risk that the market conditions may not support an offer of securities on terms acceptable to STATS ChipPAC or at all. We undertake no obligation to publicly update or revise any forward-looking statements, whether as a result of new information, future events or otherwise. Unless otherwise specified, references to “US$” are to the lawful currency of the United States of America.
Singapore Contact :
Elaine Ang
Manager, Investor Relations & Corporate Communications
Tel : (65) 6824 7705, Fax : (65) 6720 7826
email : elaine.ang@statschippac.com
US Contacts :
Drew Davies | Lisa Lavin | |
Director, Investor Relations | Marcom Manager | |
Tel : (408) 586 0608, Fax : (408) 586 0652 | Tel : (208) 939 3104, Fax : (208) 939 4817 | |
email : drew.davies@statschippac.com | email : lisa.lavin@statschippac.com | |
The Ruth Group | ||
David Pasquale — Executive Vice President | ||
Tel : (646) 536 7006 | ||
email : dpasquale@theruthgroup.com |