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New words:
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Removed:
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Filing tables
Filing exhibits
- 20-F Annual report (foreign)
- 4.6 EX-4.6 Second Amendment to Immunity Agreement Dated September 19, 2006 Amending the Immunity Agreement Dated October 18, 1996, As Amended April 22, 2003
- 4.24 EX-4.24 Supplemental Subsidiary Guarantee Agreement Dated As of September 18, 2007 with Respect to the 6.75% Senior Notes Due 2011
- 4.28 EX-4.28 Supplemental Subsidiary Guarantee Agreement Dated As of September 18, 2007 with Repect to the 7.5% Senior Notes Due 2010
- 4.31 EX-4.31 Stats Chippac LTD. Employee Share Purchase Plan 2004
- 4.37 EX-4.37 Letter Amendment to Terms and Conditions of Appointment of Tan Lay Koon As President and Chief Executive Officer of Stats Chippac LTD. Dated October 26, 2007
- 4.48 EX-4.48 Agreement for the Sale and Purchase of Assets Dated April 23, 2007 by and Between Schott Advanced Packaging Singapore Pte LTD. and Stats Chippac LTD.
- 4.49 EX-4.49 Asset Sale and Purchase Agreement Dated May 21, 2007 Among Stats Chippac Malaysia SDN BHD and Ningbo Mingxin Microelectronics Co. LTD. and Daheng New Epoch Technology, Inc.
- 4.50 EX-4.50 Asset Purchase Agreement Dated As of July 25, 2007, Among Stats Chippac (Thailand) Limited, Stats Chippac LTD., Lsi (Thai) LTD. and Lsi Corporation
- 4.51 EX-4.51 Amendment NO.1 Dated October 2, 2007, to Asset Purchase Agreement, Dated As of July 25, 2007, Among Stats Chippac (Thailand) Limited, Stats Chippac LTD., Lsi (Thai) LTD. and Lsi Corporation
- 4.52 EX-4.52 Promissory Note, Dated October 2, 2007 Issued by Stats Chippac (Thailand) Limited
- 4.53 EX-4.53 US$50,000,000 Uncommitted Facility Agreement Dated November 23, 2007 by and Between Bank of America, N.a., Singapore Branch and Stats Chippac LTD.
- 8.1 EX-8.1 List of Subsidiaries
- 12.1 EX-12.1 Certification by the Chief Executive Officer Pursuant to 17 CFR 240. 15D-14(A), As Adopted Pursuant to Section 302 of the Sarbanes-oxley Act of 2002
- 12.2 EX-12.2 Certification by the Chief Financial Officer Pursuant to 17 CFR 240. 15D-14(A), As Adopted Pursuant to Section 302 of the Sarbanes-oxley Act of 2002
- 13.1 EX-13.1 Certification by the Chief Executive Officer Pursuant to 18 U.s.c. Section 1350, As Adopted Pursuant to Section 906 of the Sarbanes-oxley Act of 2002
- 13.2 EX-13.2 Certification by the Chief Financial Officer Pursuant to 18 U.s.c. Section 1350, As Adopted Pursuant to Section 906 of the Sarbanes-oxley Act of 2002
- 15.1 EX-15.1 Consent of Pricewaterhouse Coopers, Singapore, Independent Registered Public Accounting Firm
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EXHIBIT 8.1
SUBSIDIARIES OF STATS CHIPPAC LTD.
STATS ChipPAC Test Services, Inc.
Jurisdiction of Incorporation: Delaware, United States
Jurisdiction of Incorporation: Delaware, United States
STATS ChipPAC Taiwan Semiconductor Corporation
(formerly known as Winstek Semiconductor Corporation)
Jurisdiction of Incorporation: Taiwan, Republic of China
(formerly known as Winstek Semiconductor Corporation)
Jurisdiction of Incorporation: Taiwan, Republic of China
STATS Holdings Limited
Jurisdiction of Incorporation: British Virgin Islands
Jurisdiction of Incorporation: British Virgin Islands
STATS ChipPAC Test Services (Shanghai) Co., Ltd.
Jurisdiction of Incorporation: Shanghai, People’s Republic of China
Jurisdiction of Incorporation: Shanghai, People’s Republic of China
STATS ChipPAC, Inc.
Jurisdiction of Incorporation: Delaware, United States
Jurisdiction of Incorporation: Delaware, United States
STATS ChipPAC (Barbados) Ltd.
Jurisdiction of Incorporation: Barbados
Jurisdiction of Incorporation: Barbados
ChipPAC International Company Limited
Jurisdiction of Incorporation: British Virgin Islands
Jurisdiction of Incorporation: British Virgin Islands
STATS ChipPAC (BVI) Limited
Jurisdiction of Incorporation: British Virgin Islands
Jurisdiction of Incorporation: British Virgin Islands
ChipPAC Luxembourg S.a.R.L.
Jurisdiction of Incorporation: Luxembourg
Jurisdiction of Incorporation: Luxembourg
ChipPAC Liquidity Management Hungary Limited Liability Company
Jurisdiction of Incorporation: Hungary
Jurisdiction of Incorporation: Hungary
STATS ChipPAC Shanghai Co., Ltd.
Jurisdiction of Incorporation: Shanghai, People’s Republic of China
Jurisdiction of Incorporation: Shanghai, People’s Republic of China
STATS ChipPAC Korea Ltd.
Jurisdiction of Incorporation: The Republic of Korea
Jurisdiction of Incorporation: The Republic of Korea
STATS ChipPAC Malaysia Sdn. Bhd.
Jurisdiction of Incorporation: Malaysia
Jurisdiction of Incorporation: Malaysia
STATS ChipPAC Semiconductor Shanghai Co., Ltd.
Jurisdiction of Incorporation: Shanghai, People’s Republic of China
Jurisdiction of Incorporation: Shanghai, People’s Republic of China
STATS ChipPAC Taiwan Co., Ltd.
Jurisdiction of Incorporation: Taiwan, Republic of China
Jurisdiction of Incorporation: Taiwan, Republic of China
STATS ChipPAC (Thailand) Limited
Jurisdiction of Incorporation: Kingdom of Thailand
Jurisdiction of Incorporation: Kingdom of Thailand