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Filing tables
Filing exhibits
- S-1/A IPO registration
- 3.3.1 Amendment No. 1 to the Amended and Restated Bylaws
- 10.6.1 Waiver and General Release Agreement
- 10.6.2 Second Waiver and General Release Agreement
- 10.6.3 Third Waiver Agreement
- 10.10 Contract
- 10.11 Short-term Loan Contract
- 10.12 Credit Line Contract
- 10.21 Employment Contract B2B Chips, LTD. and Lei Xia
- 10.23 Employment Contract B2B Chips, LTD. and Li De Hai
- 10.24 Guarantee Agreement
- 10.25 Lock-up Agreement
- 10.26 2008 Stock Plan
- 10.27 Contract of Mortgage of Maximum Amount
- 10.28 Contract of Guarantee of Maximum Amount
- 10.29 Contract of Guarantee of Maximum Amount
- 10.30 Equity Transferring Agreement
- 10.31 Equity Transferring Agreement
- 21.1 Subsidiaries of the Registrant
- 23.1 EX-23.1
- CORRESP Corresp
SIHI similar filings
External links