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Filing tables
Filing exhibits
- S-1/A IPO registration
- 3.3.1 Amendment No. 1 to the Amended and Restated Bylaws
- 10.6.1 Waiver and General Release Agreement
- 10.6.2 Second Waiver and General Release Agreement
- 10.6.3 Third Waiver Agreement
- 10.10 Contract
- 10.11 Short-term Loan Contract
- 10.12 Credit Line Contract
- 10.21 Employment Contract B2B Chips, LTD. and Lei Xia
- 10.23 Employment Contract B2B Chips, LTD. and Li De Hai
- 10.24 Guarantee Agreement
- 10.25 Lock-up Agreement
- 10.26 2008 Stock Plan
- 10.27 Contract of Mortgage of Maximum Amount
- 10.28 Contract of Guarantee of Maximum Amount
- 10.29 Contract of Guarantee of Maximum Amount
- 10.30 Equity Transferring Agreement
- 10.31 Equity Transferring Agreement
- 21.1 Subsidiaries of the Registrant
- 23.1 EX-23.1
- CORRESP Corresp
SIHI similar filings
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EXHIBIT 10.31
Equity Transferring Agreement
Party A (Assignor): SinoHub Technology (Hong Kong) Ltd.
Party B (Assignee): B2B Chips Ltd.
Party A and Party B do hereby agree on equity transferring issue as following:
Party A agrees to sell its whole equity registered under SinoHub HK Technology Ltd. to Party B at the price of HK$10,000. Upon the completion of the equity transfer, Party B shall be liable for all the rights and obligations of Party A, and all the tax return and documents, profiles, corporate chops, etc. shall be transferred to Party A.
Upon the signature of both parties on this Agreement, Party B shall set about the relative issues concerning the equity transfer, and Party A shall assist with all the procedures without reserve.
Party A: SinoHub Technology (Hong Kong) Ltd. | Party B: B2B Chips Ltd. |
Legal representative: /s/Henry T. Cochran | Legal representative: /s/Willa Li |
April 10, 2008 | April 10, 2008 |