CEO Message to Our Shareholders 2005 was a year of great execution at ASML. We reinforced our leadership in technology, lead time and value of ownership. Market share by revenue grew to 58 percent from 52 percent in 2004. Net profit increased by 32 percent to EUR 311 million and total cash increased by 55 percent to EUR 1.9 billion versus last year. ASML also strengthened its potential for significant growth and profitability in future years. Great execution in 2005 In 2005, the overall semiconductor equipment market decreased by nine percent; however, ASML sales increased by three percent to EUR 2.5 billion. According to the latest data reported by Semiconductor Equipment and Materials International, an industry organization, we estimate ASML market share by revenue at 58 percent in 2005 from 52 percent in 2004, marking our fourth year in a row as market leader. Seventeen of the top 20 semiconductor manufacturers ranked by capital expenditure are now customers of ASML. In total, ASML gained 12 new customers in 2005, including our sixth customer in Japan. We expanded our share of the memory market in Taiwan, shipping 300-mm tools to two new customers. We have 13 immersion tools delivered to date, including tools shipped to customers in Japan. Our production lead time, the time from customer order to delivery of volume manufacturing tools, was reduced by 20 percent. This translates into higher competitiveness for our customers who can ramp leading edge technology faster and achieve more production flexibility. It also means less inventory and further efficiency gains for ASML, by lowering costs and contributing to cash generation. In the second half of 2005, we proved that ASML can deliver strong profit at the low end of the semiconductor industry cycle. Gross margin for the year increased to 38.5 percent, up 1.8 points year to year. Operating margin rose to 17.8 percent, up 2.4 points. Net income grew to 12.3 percent, up 2.7 points. ASML ended 2005 at its net cash target of EUR 1.0 billion (total cash and equivalents minus convertible subordinated bonds). | | We installed the XT:1400 at a customer fabrication facility in three weeks, our fastest installation of a new product. It began producing 3,000 300-mm wafers per day, eight weeks after installation, a record level of productivity. Our 300th TWINSCAN system shipped in May. Customer acceptance has made TWINSCAN the industry's leading edge platform of choice for semiconductor lithography. Among our installed base of over 2,700 steppers and scanners throughout Asia, Europe and the United States, there are now 376 TWINSCAN systems installed in 54 facilities worldwide.
In 2005, ASML introduced new models for mid- and non-critical chip layers at 365- and 248-nm wavelengths. The new TWINSCAN XT:400 and new XT:760 systems extend ASML's competitiveness in high volume applications. These products widen our reach in the semiconductor lithography equipment market. We also reinforced our lead in advanced technology by announcing the TWINSCAN XT:1700i, the industry's highest numerical aperture (NA) immersion tool for 45-nm circuit line width. In December, ASML presented the first-ever images of 45-nm semiconductor structures produced by this tool. We will start volume production ramp of this newest tool in Q2 2006, positioning ASML as the leader in the 45-nm race for 300-mm high volume wafer fabrication. ASML showed further industry leadership with Extreme Ultra Violet (EUV) lithography technology: the world's first EUV alpha tools will ship in 2006 to research centers in Albany, New York and Leuven, Belgium. EUV achievements offer a solution for 32-nm circuit line width and below, ensuring the continuation of Moore's law for a significant time frame. |