1619 patents
Page 36 of 81
Utility
Fluid heating component, fluid heating component complex, and manufacturing method of fluid heating component
4 Jan 22
A fluid heating component including: a porous body made of ceramics and formed with through channels through which a fluid passes, and a conductive coating layer disposed on a through channel surface of at least a part of each through channel, wherein the conductive coating layer is electrically connected, and is continuous.
Hironori Takahashi, Hiroki Ishida
Filed: 8 Mar 19
Utility
Metal Member and Production Method Therefor
30 Dec 21
A metal member includes a metal substrate, a first intermediate plating layer, a second intermediate plating layer, and a precious metal plating layer.
Shigeru YOSHIMURA
Filed: 10 Sep 21
Utility
Ground Substrate and Method for Producing Same
30 Dec 21
Provided is a base substrate including an orientation layer used for crystal growth of a nitride or oxide of a Group 13 element, in which a front surface on a side used for the crystal growth of the orientation layer is composed of a material having a corundum-type crystal structure having an a-axis length and/or c-axis length larger than that of sapphire, the orientation layer contains a material selected from the group consisting of α-Cr2O3, α-Fe2O3, α-Ti2O3, α-V2O3, and α-Rh2O3, or a solid solution containing two or more selected from the group consisting of α-Al2O3, α-Cr2O3, α-Fe2O3, α-Ti2O3, α-V2O3, and α-Rh2O3, and a half width of an X-ray rocking curve of a (104) plane of the corundum-type crystal structure is 500 arcsec. or less.
Morimichi WATANABE, Jun YOSHIKAWA
Filed: 7 Sep 21
Utility
Ground Substrate and Method for Producing Same
30 Dec 21
Provided is a base substrate including an orientation layer used for crystal growth of a nitride or oxide of a Group 13 element.
Morimichi WATANABE, Jun YOSHIKAWA
Filed: 7 Sep 21
Utility
Semiconductor Film
30 Dec 21
Provided is a semiconductor film having a corundum-type crystal structure composed of α-Ga2O3 or an α-Ga2O3 solid solution, and an impurity concentration and/or a heterogeneous phase amount differ between a front surface and a rear surface of the semiconductor film.
Morimichi WATANABE, Hiroshi FUKUI
Filed: 7 Sep 21
Utility
Solid Electrolyte and Method for Producing Solid Electrolyte
30 Dec 21
Provided is a solid electrolyte which is identified as 3LiOH.Li2SO4 by diffractometry.
Reona MIYAZAKI, Harunobu ONISHI, Satoshi OZAKI, Toshihiro YOSHIDA, Yuji KATSUDA, Yosuke SATO, En YAGI
Filed: 10 Sep 21
Utility
All-solid-state Secondary Battery
30 Dec 21
Provided is an all-solid-state secondary battery including a solid electrolyte which is identified as 3LiOH.Li2SO4 by X-ray diffraction.
Harunobu ONISHI, Satoshi OZAKI, Toshihiro YOSHIDA, Yuji KATSUDA, Yosuke SATO, En YAGI
Filed: 10 Sep 21
Utility
Method for producing silicon carbide sintered body
28 Dec 21
A method for producing a silicon carbide sintered body, comprising adding water to a raw material mixture containing silicon carbide powder, at least one binder, and optionally at least one carbon source other than the silicon carbide and the at least one binder, and subjecting the raw material mixture to kneading, molding, and drying in this order, to obtain a dried body; heating the dried body to remove organic substances from the dried body to obtain a degreased body; and firing the degreased body in an inert atmosphere to obtain a silicon carbide sintered body.
Hiroki Ishida, Hironori Takahashi
Filed: 28 Mar 18
Utility
Lithium composite oxide sintered body plate
28 Dec 21
Provided is a lithium complex oxide sintered plate for use in a positive electrode of a lithium secondary battery.
Yukinobu Yura, Shigeki Okada
Filed: 5 Aug 19
Utility
Lithium titanate sintered plate
28 Dec 21
Provided is a lithium titanate sintered plate for use in a negative electrode of a lithium secondary battery.
Yukinobu Yura, Shigeki Okada, Nobuyuki Kobayashi
Filed: 8 Nov 19
Utility
Electrochemical cell including cathode with main phase of perovskite oxide and second phase of SrSO4 and (Co, Fe)3O4
28 Dec 21
The electrochemical cell according to the present invention has an anode, a cathode, and a solid electrolyte layer disposed between the anode and the cathode.
Makoto Ohmori, Shinji Fujisaki, Takashi Ryu
Filed: 12 Mar 19
Utility
LDH separator and zinc secondary battery
28 Dec 21
Provided is an LDH separator including a porous substrate and a layered double hydroxide (LDH) that fills up pores of the porous substrate.
Sho Yamamoto, Naoko Inukai, Shohei Yokoyama
Filed: 2 Mar 21
Utility
Electrostatic Chuck
23 Dec 21
An electrostatic chuck includes a ceramic base, a ceramic dielectric layer, an electrostatic electrode, and a ceramic insulating layer.
Hiroshi TAKEBAYASHI, Kenichiro AIKAWA, Tatsuya KUNO
Filed: 31 Aug 21
Utility
Wafer Placement Table
23 Dec 21
A wafer placement table includes: an electrostatic chuck that is a ceramic sintered body in which an electrode for electrostatic adsorption is embedded; a cooling member which is bonded to a surface on an opposite side of a wafer placement surface of the electrostatic chuck, and cools the electrostatic chuck; a hole for power supply terminal, the hole penetrating the cooling member in a thickness direction; and a power supply terminal which is bonded to the electrode for electrostatic adsorption from the surface on the opposite side of the wafer placement surface of the electrostatic chuck, and is inserted in the hole for power supply terminal.
Kenichiro AIKAWA, Hiroshi TAKEBAYASHI, Tatsuya KUNO
Filed: 3 Sep 21
Utility
Electric heating type support and exhaust gas purifying device
21 Dec 21
An electric heating support includes a honeycomb structure having an outer peripheral wall and interior porous partition walls defining a plurality of cells forming a flow path.
Naoya Takase, Shinya Yoshida, Kimihisa Kaneko
Filed: 24 Feb 20
Utility
Sensor element and gas sensor
21 Dec 21
A sensor element 101 includes an element main body 101a that includes oxygen ion-conductive solid electrolyte layers (1 to 6), and a porous protective layer 90 that covers at least part of the element main body 101a.
Atsushi Watanabe, Takashi Suzuki, Shuichi Ozawa, Hirohito Kiyota, Satoko Moriyama, Shiho Iwai
Filed: 27 Mar 17
Utility
Member for semiconductor manufacturing apparatus and method for producing the same
21 Dec 21
A method for producing a member for a semiconductor manufacturing apparatus includes (a) a step of providing an electrostatic chuck, a supporting substrate, and a metal bonding material, the electrostatic chuck being made of a ceramic and having a form of a flat plate, the supporting substrate including a composite material having a difference in linear thermal expansion coefficient at 40 to 570° C. from the ceramic of 0.2×10−6/K or less in absolute value, and (b) a step of interposing the metal bonding material between a concave face of the supporting substrate and a face of the electrostatic chuck opposite to a wafer mounting face, and thermocompression bonding the supporting substrate and the electrostatic chuck at a predetermined temperature to deform the electrostatic chuck to the shape of the concave face.
Hiroshi Takebayashi
Filed: 29 Sep 17
Utility
Honeycomb Structure and Exhaust Gas Purifying Device
16 Dec 21
A pillar shaped honeycomb structure, including: an outer peripheral wall; and a porous partition wall disposed inside the outer peripheral wall, the a porous partition wall defining a plurality of cells, each of the cells extending from one end face to other end face to form a flow path, wherein a surface of the porous partition wall in the cells comprise a collecting layer having an average pore diameter lower than that of the porous partition wall; and wherein magnetic particles having a Curie point of 700° C. or higher are provided either or both between the surfaces of the porous partition wall and the collecting layer, and on the collecting layer.
Takafumi KIMATA, Yukio MIYAIRI, Masaaki MASUDA, Kazuya HOSODA
Filed: 30 Aug 21
Utility
Bonded Substrate
16 Dec 21
Electrical insulating properties between adjacent copper plates are improved while a defect of a bonded substrate which is caused by concentration of stress to end portions of the copper plates is prevented.
Takashi EBIGASE, Izumi MASUDA
Filed: 30 Aug 21
Utility
Wear-resistant Member
16 Dec 21
A wear-resistant member that is slidingly contacted with a hard member, wherein the wear-resistant member is formed of an alloy in which hard particles having an average particle size of 10 to 150 μm are bonded by a bonding portion.
Yuichi TAJIMA, Yoshimasa KONDO
Filed: 26 Aug 21