2134 patents
Page 39 of 107
Utility
Drive circuit
19 Apr 22
A drive circuit having a set-side level shift circuit and a reset-side level shift circuit each configured to shift a level of a set or reset signal, and output the level-shifted set or reset signal from a set-side or reset-side output node, a mask-signal generating circuit configured to output a mask signal in response to a change in a voltage at the set-side or reset-side output node, and a control circuit configured to output a drive signal to a power device.
Masashi Akahane
Filed: 25 Feb 21
Utility
Semiconductor Device and Manufacturing Method Thereof
14 Apr 22
A manufacturing method of a semiconductor device includes sealing a metal plate on which a semiconductor chip and a control IC are mounted by injecting molding resin raw material into a cavity from an inlet, filling the cavity with the molding resin raw material, and discharging excessive molding resin raw material from an outlet.
Nobuhiro HIGASHI, Akira FURUTA
Filed: 30 Aug 21
Utility
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14 Apr 22
A semiconductor inspection device, including a stage having first and second surfaces opposite to each other, a first holding part for holding the semiconductor wafer apart from the first surface and protruding from the first surface of the stage, a plurality of air suction holes and air supply holes, through which a gas is suctioned from or supplied to a space between the semiconductor wafer and the stage, and an imaging unit configured to capture an image of a second main surface of the semiconductor wafer, after the gas is concurrently suctioned from, and supplied to, the space between the semiconductor wafer and the stage, to thereby correct a warpage of the semiconductor wafer.
Noriaki NOJI
Filed: 31 Aug 21
Utility
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14 Apr 22
A semiconductor module is provided, comprising a circuit board having a predetermined circuit pattern, a semiconductor chip placed on the circuit board, a wiring member configured to connect the semiconductor chip and the circuit pattern, and a sealing resin configured to seal the semiconductor chip and the wiring member, wherein the sealing resin has a first resin including an inorganic filler and an epoxy resin, which covers the semiconductor chip and a second resin having a smaller elastic modulus than the first resin, which is provided on a surface of the first resin, and wherein the second resin is separated from the semiconductor chip and the circuit board.
Tomohiro NISHIMURA
Filed: 24 Aug 21
Utility
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14 Apr 22
A switching control circuit configured to control a switching device.
Akira NAKAMORI
Filed: 22 Dec 21
Utility
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5 Apr 22
There is provision of a control device for outputting an operation amount of a controlled object so as to cause a process value of the controlled object to track a target value.
Yoshio Tange, Satoshi Kiryu
Filed: 28 Oct 19
Utility
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5 Apr 22
A method of manufacturing a semiconductor device prepares contact members, each of which has a cylindrical through-hole, and column-shaped connection terminals, each having a polygonal shape in a cross-sectional view along a length direction thereof, wherein a length of a diagonal of the polygonal shape is greater than an inner diameter of the through-holes.
Rikihiro Maruyama, Masaoki Miyakoshi
Filed: 26 May 20
Utility
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5 Apr 22
A silicon carbide semiconductor device includes, sequentially, a first semiconductor layer of a first conductivity type, a second semiconductor layer of the first conductivity type provided on the first semiconductor layer, a third semiconductor layer of the first conductivity type provided on the second semiconductor layer, and a fourth semiconductor layer of a second conductivity type provided on the third semiconductor layer.
Takeshi Tawara, Mina Ohse
Filed: 23 Oct 19
Utility
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5 Apr 22
A semiconductor device includes an active region configured by a first MOS structure region and a second MOS structure region, a gate ring region surrounding a periphery of the active region, a first ring region surrounding a periphery of the gate ring region, a second ring region surrounding a periphery of the first ring region, and a termination region surrounding a periphery of the second ring region.
Yasuyuki Hoshi
Filed: 30 Nov 20
Utility
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5 Apr 22
An uninterruptible power supply includes disconnectors that perform a disconnection operation to electrically disconnect a plurality of uninterruptible power supply modules individually.
Keita Koshii, Seiitsu Kin, Tomo Kurozaki
Filed: 24 Aug 20
Utility
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31 Mar 22
A semiconductor device includes a semiconductor unit, a printed circuit board and a case, including a bottom portion formed in a plate-like shape and a side wall portion surrounding an outer periphery of the bottom portion of the case.
Kenshi TERASHIMA
Filed: 27 Jul 21
Utility
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31 Mar 22
A control device for a mobile body is equipped with a charging and electrical power supplying unit including a first smoothing capacitor positioned on a connector side and a second smoothing capacitor positioned on a battery side, and a control unit configured to control the charging and electrical power supplying unit.
Mitsuteru YANO, Shinichi YOKOYAMA, Masahiko SATO, Tomoki NAKAHARA
Filed: 23 Sep 21
Utility
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31 Mar 22
A control device for a mobile body is equipped with a switching unit configured to switch a conductive path between a charging and electrical power supplying unit, a charging connector, and an electrical power supplying connector, a connection determination unit configured to determine whether or not an electrical load is connected to the electrical power supplying connector, a failure determination unit configured to execute a failure determination to determine a failure of the switching unit based on a conductive state when the conductive path is switched, and a control unit configured to limit execution of the failure determination by the failure determination unit, in the case it is determined by the connection determination unit that the electrical load is connected to the electrical power supplying connector.
Shinichi YOKOYAMA, Mitsuteru YANO, Masahiko SATO, Atsushi KANEKO
Filed: 23 Sep 21
Utility
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29 Mar 22
A semiconductor unit includes transistor chips; first main circuit terminals that are electrically connected to first main electrodes of the transistor chips; second main circuit terminals that are electrically connected to second main electrodes of the transistor chips; and a sealing body that has two sides and positioned on opposite sides from one another in one direction and that seals the transistor chip and the first and second main circuit terminals except for a portion of each of the first and second main circuit terminals.
Masashi Hoya
Filed: 4 Feb 20
Utility
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29 Mar 22
In an uninterruptible power supply, a signal generator generates a semiconductor switch drive signal for driving a semiconductor switch and continuously generates the semiconductor switch drive signal while AC power is being supplied via a bypass circuit.
Shota Oki, Takuya Kimizu
Filed: 24 Jun 20
Utility
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24 Mar 22
A semiconductor device is provided including: a semiconductor substrate having a first-conductivity-type drift region; a second-conductivity-type base region provided above the drift region inside the semiconductor substrate; an accumulation region provided between the drift region and the lower surface of the base region inside the semiconductor substrate, and having a lower second-conductivity-type carrier mobility than the drift region and the base region; a gate trench portion provided from an upper surface of the semiconductor substrate to an inside of the semiconductor substrate, where the gate trench portion is in contact with the base region; and a carrier passage region occupying at least a partial region between the accumulation region and the gate trench portion inside the semiconductor substrate, where the carrier passage region has a higher second-conductivity-type carrier mobility than the accumulation region.
Tatsuya NAITO
Filed: 6 Dec 21
Utility
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22 Mar 22
A semiconductor device that includes a SiC semiconductor substrate; a SiC epitaxial layer having an impurity concentration lower than that of the SiC semiconductor substrate; a first semiconductor layer including first semiconductor pillars and second semiconductor pillars; a second semiconductor layer; a device active region; a termination region; a channel stopper region having an impurity concentration higher than that of the SiC epitaxial layer; and a plurality of first chip end portions and a plurality of second chip end portions, and a surface of the first side surface is covered with an impurity region having an impurity concentration higher than those of the first semiconductor pillar and the SiC epitaxial layer and is connected to the channel stopper region.
Ryoji Kosugi, Kazuhiro Mochizuki, Kohei Adachi, Manabu Takei, Yoshiyuki Yonezawa
Filed: 15 Feb 19
Utility
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22 Mar 22
A semiconductor device includes an enhancement mode MOSFET and a junction FET.
Takeyoshi Nishimura
Filed: 31 Mar 21
Utility
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22 Mar 22
An uninterruptible power supply includes a first detector provided on an input side of a power converter, the first detector detecting a first detection value that is a value of a voltage or current, and a second detector provided on an AC power supply side relative to the first detector, the second detector detecting a second detection value that is a value of a voltage or current input to the uninterruptible power supply module.
Yasuhiro Tamai
Filed: 30 Dec 20
Utility
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22 Mar 22
A semiconductor device includes a power semiconductor chip, a threshold setting unit and a breaker circuit.
Shigemi Miyazawa
Filed: 30 Mar 20