1170 patents
Page 27 of 59
Utility
Bulk acoustic wave (BAW) resonator
19 Oct 21
An acoustic resonator includes a first piezoelectric layer, a second piezoelectric layer, a coupler layer, a first electrode, and a second electrode.
Jyothi Swaroop Sadhu, Gernot Fattinger, Robert Aigner, Michael Schaefer
Filed: 1 Mar 19
Utility
Doherty amplifier
19 Oct 21
A Doherty amplifier is disclosed with a main amplifier having a main input in communication with a radio frequency (RF) signal input and a main output in communication with a RF signal output.
Baker Scott, George Maxim, Dirk Robert Walter Leipold
Filed: 28 Jun 19
Utility
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19 Oct 21
The present disclosure relates to a bulk complementary-metal-oxide-semiconductor (CMOS) device including a device substrate, a thinned device die with a device region over the device substrate, a first mold compound, and a second mold compound.
Julio C. Costa, Michael Carroll, Dirk Robert Walter Leipold, George Maxim, Baker Scott
Filed: 28 Mar 19
Utility
3dp7h4qoql2n1zvgm4s5xtxa9ub48zo6yr2vovxm 5h0
19 Oct 21
Integration of self-biased magnetic circulators with microwave devices is disclosed herein.
Yongjie Cui, Xing Gu, Andrew Arthur Ketterson, Cathy Lee, Xing Chen
Filed: 3 Jun 19
Utility
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12 Oct 21
The present disclosure relates to a semiconductor chip that includes a substrate, a metal layer, and a number of component portions.
Deep C. Dumka
Filed: 3 Dec 19
Utility
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12 Oct 21
The present disclosure relates to a tunable Bulk Acoustic Wave (BAW) resonator with a top electrode, a bottom electrode, a piezoelectric layer sandwiched between the top electrode and the bottom electrode, and a reflection region underneath the bottom electrode.
Robert Aigner
Filed: 15 May 20
Utility
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12 Oct 21
Acoustic resonators, such as bulk acoustic wave (BAW) resonators, are disclosed that include phase shift structures.
Yazid Yusuf, Mudar AlJoumayly, Gernot Fattinger, Alfred Gimenez
Filed: 30 Jan 20
Utility
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12 Oct 21
A multi-radio access technology (RAT) envelope tracking (ET) amplifier apparatus is provided.
Nadim Khlat
Filed: 20 Nov 19
Utility
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12 Oct 21
Acoustic resonators, such as bulk acoustic wave (BAW) resonators, are disclosed that include mode suppression structures.
Yazid Yusuf, Mudar AlJoumayly, Alfred Gimenez
Filed: 13 Jan 20
Utility
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12 Oct 21
Acoustic resonators, such as bulk acoustic wave (BAW) resonators and, in particular, acoustic resonators including stacked crystal filters (SCFs) are disclosed.
Yazid Yusuf
Filed: 2 Mar 20
Utility
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5 Oct 21
A three-dimensional (3-D) inductor is incorporated in a substrate.
Dirk Robert Walter Leipold, George Maxim, Baker Scott, Toshiaki Moriuchi
Filed: 7 Dec 17
Utility
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5 Oct 21
The present disclosure relates to a shielded integrated module, which includes a module substrate with a number of perimeter bond pads, at least one electronic component attached to the module substrate and encapsulated by a mold compound, a number of perimeter vertical shield contacts, and a shielding structure.
Mohsen Haji-Rahim, Howard Joseph Holyoak
Filed: 19 Aug 19
Utility
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5 Oct 21
Unwanted or parasitic capacitances may occur in MEMS switches.
Cornelius Petrus Elisabeth Schepens, Roberto Gaddi
Filed: 23 Apr 20
Utility
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5 Oct 21
An envelope tracking (ET) apparatus is provided.
Nadim Khlat
Filed: 23 Oct 19
Utility
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30 Sep 21
Doherty radio frequency (RF) amplifier circuitry includes an input node, an output node, a main amplifier path, and a peaking amplifier path.
Baker Scott, George Maxim, Dirk Robert Walter Leipold
Filed: 12 Apr 21
Utility
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30 Sep 21
A device having device function circuitry configured to receive a device signal and output a modified device signal is disclosed.
Baker Scott, George Maxim, Chong Woo
Filed: 30 Mar 20
Utility
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28 Sep 21
Adaptive multi-standard signal classification and synchronization is disclosed.
Andrew Fort
Filed: 1 Jul 19
Utility
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28 Sep 21
Embodiments provide a solidly-mounted bulk acoustic wave (BAW) resonator and method of making same.
Alireza Tajic
Filed: 25 May 18
Utility
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23 Sep 21
The present disclosure relates to a thermally enhanced package, which includes a carrier, a thinned die over the carrier, a mold compound, and a heat extractor.
Julio C. Costa, George Maxim
Filed: 26 May 21
Utility
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23 Sep 21
Spatial power-combining devices with reduced dimensions are disclosed.
Soack Dae Yoon, Dana Jay Sturzebecher, Patrick Courtney
Filed: 17 Mar 20