1170 patents
Page 32 of 59
Utility
Envelope tracking integrated circuit and related apparatus
8 Jun 21
An envelope tracking (ET) integrated circuit (IC) (ETIC) is provided.
Nadim Khlat
Filed: 23 Oct 19
Utility
RF Devices with Enhanced Performance and Methods of Forming the Same
3 Jun 21
The present disclosure relates to a radio frequency (RF) device and a process for making the same.
Julio C. Costa, Mickael Renault
Filed: 2 Dec 20
Utility
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1 Jun 21
A passive wireless switch circuit and related apparatus are provided.
Nadim Khlat
Filed: 26 Sep 19
Utility
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1 Jun 21
A process for molding a back side wafer singulation guide is disclosed.
Neftali Salazar, Rommel Quintero, Thomas Scott Morris
Filed: 24 Jun 19
Utility
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1 Jun 21
RF circuitry, which includes a first acoustic RF resonator (ARFR) and a first compensating ARFR, is disclosed.
Nadim Khlat, Jean-Frederic Chiron, Marcus Granger-Jones, Andrew F. Folkmann, Robert Aigner
Filed: 22 Feb 19
Utility
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1 Jun 21
An adaptive frequency equalizer for wide modulation bandwidth envelope tracking (ET) is provided.
Nadim Khlat
Filed: 28 Jan 20
Utility
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25 May 21
A multi-bandwidth envelope tracking (ET) integrated circuit (IC) (ETIC) and related apparatus are provided.
Nadim Khlat
Filed: 2 Oct 19
Utility
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25 May 21
A multimode envelope tracking (ET) circuit and related apparatus is provided.
Nadim Khlat, Michael R. Kay
Filed: 25 Feb 19
Utility
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25 May 21
Compensation of on-die inductive parasitics in ladder filters through negative mutual inductance between ground inductors is disclosed herein.
Yazid Yusuf, Mudar Al-Joumayly, Gernot Fattinger
Filed: 6 May 19
Utility
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25 May 21
A multi-radio access technology (RAT) circuit is provided.
George Maxim, Dirk Robert Walter Leipold, Alexander Wayne Hietala, Baker Scott
Filed: 31 Aug 18
Utility
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18 May 21
A cartridge for collecting sample material may include a cartridge body, a filter, a fluid reservoir, and a fluid drive port.
James Russell Webster
Filed: 28 Sep 18
Utility
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18 May 21
The present disclosure relates to a microelectronics package with vertically stacked flip-chip dies, and a process for making the same.
Julio C. Costa, Robert Aigner, Gernot Fattinger, Dirk Robert Walter Leipold, George Maxim, Baker Scott, Merrill Albert Hatcher, Jr., Jon Chadwick
Filed: 31 Jul 19
Utility
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13 May 21
A sampler for acquiring and transporting sample material may include a sampler body defining a sampling volume configured to hold the sample material.
Thayne L. Edwards, Florian Bell
Filed: 2 Aug 17
Utility
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13 May 21
A device including at least one sensing bulk acoustic wave (BAW) resonator including a sensing surface; a fluid channel, wherein the sensing surface of the at least one sensing BAW resonator is disposed adjacent to or within the fluid channel; at least one resistive heater; and at least one temperature detector, wherein the at least one temperature detector is configured to monitor the temperature adjacent to the at least one BAW resonator and affect a current to be passed through the at least one resistive heater.
Florian Bell, Rick Morton, William Crawford Randle, Cody William Rombach, Donna Kay Barton
Filed: 26 Jul 17
Utility
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13 May 21
Electronic substrates, contact pads for electronic substrates, and related methods are disclosed.
John August Orlowski, Thomas Scott Morris, David Jandzinski
Filed: 25 Jan 21
Utility
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11 May 21
A multi-layer antenna assembly and related antenna array are provided.
Dirk Robert Walter Leipold, George Maxim, Nadim Khlat, Baker Scott
Filed: 28 Nov 18
Utility
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11 May 21
Spatial power-combining devices and, more particularly, spatial power-combining devices with improved isolation are disclosed.
Soack Dae Yoon, Ankush Mohan, Dan Denninghoff
Filed: 25 Feb 19
Utility
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11 May 21
A filter circuit includes a first input node and a second input node for receiving an input signal, and a first output node and a second output node for providing an output signal.
Nadim Khlat, Robert Aigner
Filed: 7 Sep 17
Utility
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11 May 21
The present disclosure relates to a bulk complementary-metal-oxide-semiconductor (CMOS) device including a device substrate, a thinned device die with a device region over the device substrate, a first mold compound, and a second mold compound.
Julio C. Costa, Michael Carroll, Dirk Robert Walter Leipold, George Maxim, Baker Scott
Filed: 28 Mar 19
Utility
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6 May 21
The present disclosure relates to a radio frequency device that includes a mold device die and a multilayer redistribution structure underneath the mold device die.
Julio C. Costa, Todd Gillenwater
Filed: 9 Apr 20