544 patents
Page 16 of 28
Utility
Integrated Circuit (Ic) Package with Embedded Heat Spreader In a Redistribution Layer (RDL)
17 Jun 21
An integrated circuit (IC) package with an embedded heat spreader in a redistribution layer (RDL) is provided.
Kevin J. Anderson, Andrew Arthur Ketterson, Tarak A. Railkar, Deep C. Dumka
Filed: 12 Dec 19
Utility
Interdigital Transducer Arrangements for Surface Acoustic Wave Devices
17 Jun 21
Acoustic wave devices and interdigital transducer (IDT) arrangements for surface acoustic wave (SAW) devices are disclosed.
Manjunath Swamy
Filed: 2 Mar 21
Utility
Doherty Power Amplifier System
17 Jun 21
A Doherty amplifier system is disclosed with a carrier amplifier configured to amplify a first portion of a radio frequency (RF) signal.
Nadim Khlat
Filed: 11 Dec 19
Utility
Multi-mode Power Management Integrated Circuit In a Small Formfactor Wireless Apparatus
17 Jun 21
A multi-mode power management integrated circuit (PMIC) is provided.
Nadim Khlat
Filed: 9 Dec 20
Utility
Bipolar Transistor
10 Jun 21
Disclosed is a transistor having a base, a substrate, and a collector between the substrate and the base.
Peter J. Zampardi, Timothy S. Henderson, Leonard Hayden, Adrian Hutchinson
Filed: 9 Dec 19
Utility
RF Devices with Enhanced Performance and Methods of Forming the Same
3 Jun 21
The present disclosure relates to a radio frequency (RF) device and a process for making the same.
Julio C. Costa, Mickael Renault
Filed: 2 Dec 20
Utility
Biosensor Cartridge with Sample Acquisition
13 May 21
A sampler for acquiring and transporting sample material may include a sampler body defining a sampling volume configured to hold the sample material.
Thayne L. Edwards, Florian Bell
Filed: 2 Aug 17
Utility
Baw Biosensor Including Heater and Temperature Sensor and Methods for Using the Same
13 May 21
A device including at least one sensing bulk acoustic wave (BAW) resonator including a sensing surface; a fluid channel, wherein the sensing surface of the at least one sensing BAW resonator is disposed adjacent to or within the fluid channel; at least one resistive heater; and at least one temperature detector, wherein the at least one temperature detector is configured to monitor the temperature adjacent to the at least one BAW resonator and affect a current to be passed through the at least one resistive heater.
Florian Bell, Rick Morton, William Crawford Randle, Cody William Rombach, Donna Kay Barton
Filed: 26 Jul 17
Utility
Contact Pads for Electronic Substrates and Related Methods
13 May 21
Electronic substrates, contact pads for electronic substrates, and related methods are disclosed.
John August Orlowski, Thomas Scott Morris, David Jandzinski
Filed: 25 Jan 21
Utility
RF Devices with Nanotube Particles for Enhanced Performance and Methods of Forming the Same
6 May 21
The present disclosure relates to a radio frequency device that includes a mold device die and a multilayer redistribution structure underneath the mold device die.
Julio C. Costa, Todd Gillenwater
Filed: 9 Apr 20
Utility
Average Power Tracking Power Amplifier Apparatus
29 Apr 21
An average power tracking (APT) power amplifier apparatus is provided.
Nadim Khlat, Marcus Granger-Jones
Filed: 26 Oct 20
Utility
Radio Frequency Filtering Circuitry
29 Apr 21
Radio frequency (RF) filtering circuitry includes an input node, an output node, a shunt node, a first bulk acoustic wave (BAW) resonator, a second BAW resonator, a first inductor, and a second inductor.
Peter V. Wright
Filed: 23 Oct 20
Utility
Radio Frequency Filtering Circuitry on Integrated Passive Die
29 Apr 21
An integrated passive die includes a substrate, an input node, an output node, and RF filtering circuitry.
Peter V. Wright
Filed: 23 Oct 20
Utility
Semiconductor Chip Suitable for 2.5D and 3D Packaging Integration and Methods of Forming the Same
1 Apr 21
The present disclosure relates to a fabrication process of a semiconductor chip, which starts with providing a precursor wafer mounted on a carrier.
Deep C. Dumka
Filed: 3 Dec 19
Utility
Semiconductor Chip Suitable for 2.5D and 3D Packaging Integration and Methods of Forming the Same
1 Apr 21
The present disclosure relates to a semiconductor chip that includes a substrate, a metal layer, and a number of component portions.
Deep C. Dumka
Filed: 3 Dec 19
Utility
Guided Acoustic Wave Device
1 Apr 21
A guided acoustic wave device includes a substrate, a lithium tantalate layer on the substrate, and a transducer on the lithium tantalate film.
Shogo Inoue, Marc Solal
Filed: 15 Dec 20
Utility
Piezoelectric Bulk Layers with Tilted C-axis Orientation and Methods for Making the Same
18 Mar 21
A structure includes a substrate including a wafer or a portion thereof; and a piezoelectric bulk material layer comprising a first portion deposited onto the substrate and a second portion deposited onto the first portion, the second portion comprising an outer surface having a surface roughness (Ra) of 4.5 nm or less.
Derya Deniz, Matthew Wasilik, Robert Kraft, John Belsick
Filed: 13 Sep 19
Utility
Guided Saw Device
11 Mar 21
A guided surface acoustic wave (SAW) device includes a substrate, a piezoelectric layer on the substrate, and a transducer on the piezoelectric layer.
Shogo Inoue, Marc Solal
Filed: 19 Nov 20
Utility
Programmable Slave Circuit on a Communication Bus
4 Mar 21
A programmable slave circuit on a communication bus is provided.
Christopher Truong Ngo, Nadim Khlat, Alexander Wayne Hietala
Filed: 1 Sep 20
Utility
Reduced Flyback Esd Surge Protection
25 Feb 21
Reduced flyback electrostatic discharge (ESD) surge protection is disclosed.
Stephen James Franck
Filed: 22 Aug 19