544 patents
Page 23 of 28
Utility
Multimode Envelope Tracking Circuit and Related Apparatus
29 Apr 20
A multimode envelope tracking (ET) circuit and related apparatus is provided.
Nadim Khlat, Michael R. Kay
Filed: 24 Feb 19
Utility
Acoustic Filter Apparatus Having Configurable Parallel Resonance Frequencies
29 Apr 20
An acoustic filter apparatus is provided.
Nadim Khlat
Filed: 29 Apr 19
Utility
e8awoperix0bldfsf7 rofz0naufqd31nhd6o
22 Apr 20
A multi-voltage generation circuit and related envelope tracking (ET) amplifier apparatus is provided.
Nadim Khlat
Filed: 6 Feb 19
Utility
64pqznl x2ozeg13gi279qz3eiu
22 Apr 20
A multi-amplifier envelope tracking (ET) circuit and related apparatus are provided.
Nadim Khlat
Filed: 30 Jan 19
Utility
5l1t8h3fobgesup5szs nxs6x6
22 Apr 20
A multi-amplifier envelope tracking (ET) circuit and related apparatus are provided.
Nadim Khlat
Filed: 30 Jan 19
Utility
2ios72jlf2fxxvivsjjfxdc4hwhjtpg8gefopd1099z2gqjdor4i
22 Apr 20
A distributed envelope tracking (ET) amplifier circuit and related apparatus are provided.
Nadim Khlat
Filed: 4 Feb 19
Utility
ak1f73qw5h39kttm2 q2g8shicw2ptzkof5s
22 Apr 20
A voltage generation circuit and related envelope tracking (ET) amplifier apparatus is provided.
Nadim Khlat, Michael R. Kay, Philippe Gorisse
Filed: 18 Feb 19
Utility
rzzx6vfxkt4if20dk14fthe825vsqiwdmqvz0bxsswnw9s1cu16mvc10qz5
22 Apr 20
Nadim Khlat
Filed: 4 Feb 19
Utility
mhrypyviqb5nugr7jx8 1v42fgodet
22 Apr 20
Disclosed is a device that includes a crystalline substrate and a patterned aluminum-based material layer disposed onto the crystalline substrate.
Casey Kirkpatrick, Andrew P. Ritenour
Filed: 19 Dec 19
Utility
z5qp4leeg1legxuproexkyt99ua6yni7zp7canuz5keen395pkhqks
22 Apr 20
Switch circuitry is disclosed having a series stack of transistors coupled between first and second port terminals.
Charles Forrest Campbell
Filed: 6 Dec 18
Utility
irac1undqrhbvg8ezgmxstdfa038ay3w30f0yqvqv6ra0 5f
22 Apr 20
An envelope tracking (ET) amplifier apparatus is provided.
Nadim Khlat
Filed: 11 Feb 19
Utility
4rmf6obznsh qx2vvfg7a3yyepd2je9ph336eydrnv1ea1ua0xp2
15 Apr 20
The present disclosure relates to a wafer-level fan-out package that includes a first thinned die, a second die, a multilayer redistribution structure underneath the first thinned die and the second die, a first mold compound over the second die, a second mold compound over the multilayer redistribution structure, and around the first thinned die and the second die, and a third mold compound.
Jonathan Hale Hammond, Julio C. Costa, Jon Chadwick
Filed: 26 Jun 19
Utility
ehau3c8tvutygf30k8di0nle9mb2gzau
15 Apr 20
The present disclosure relates to a packaging process to enhance performance of a wafer-level package.
Jonathan Hale Hammond, Julio C. Costa
Filed: 26 Jun 19
Utility
3nozvorgoguxz4 jzlwo
8 Apr 20
A process for molding a back side wafer singulation guide is disclosed.
Neftali Salazar, Rommel Quintero, Thomas Scott Morris
Filed: 23 Jun 19
Utility
7eipxmopuxthceno59euzhbz32z0610v9t aza7tndagcay5w0lpvgyffv
8 Apr 20
An edge enabled void antenna (EEVA) apparatus is provided.
Jan-Willem Zweers
Filed: 13 Jan 19
Utility
b0rzm9x262lwb78e2a0li 6hr4h
1 Apr 20
The present disclosure relates to a wafer-level package that includes a first thinned die having a first device layer, a multilayer redistribution structure, a first mold compound, and a second mold compound.
Julio C. Costa, Jon Chadwick, David Jandzinski, Merrill Albert Hatcher, JR., Jonathan Hale Hammond
Filed: 3 Dec 19
Utility
nxp3k3g014cio1p0tooly 0ljr3hhhxusv
1 Apr 20
An envelope tracking (ET) amplifier circuit is provided.
Nadim Khlat, James M. Retz
Filed: 13 Jan 19
Utility
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1 Apr 20
An acoustic resonator includes a piezoelectric layer on a substrate and an interdigital electrode structure on the piezoelectric layer.
Shogo Inoue, Hao Dong
Filed: 30 Apr 19
Utility
5feyp689utw4sdadjp4okf4j6nyiujafynnwepss08bbtt98pwckj57z0
25 Mar 20
An acoustic resonator structure is provided.
Nadim Khlat
Filed: 17 Mar 19
Utility
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25 Mar 20
An acoustic resonator structure is provided.
Nadim Khlat
Filed: 19 Mar 19