626 patents
Page 15 of 32
Utility
Single-wire bus (SuBUS) slave circuit and related apparatus
31 Aug 21
A single-wire bus (SuBUS) slave circuit is provided.
Christopher Truong Ngo, Alexander Wayne Hietala, Puneet Paresh Nipunage
Filed: 7 Jan 20
Utility
Envelope tracking circuit and related power amplifier apparatus
31 Aug 21
An envelope tracking (ET) circuit and related power amplifier apparatus is provided.
Nadim Khlat
Filed: 17 Jan 19
Utility
Doherty power amplifier system
31 Aug 21
A Doherty amplifier system is disclosed.
Nadim Khlat
Filed: 19 Jul 19
Utility
Multi-amplifier envelope tracking circuit and related apparatus
31 Aug 21
A multi-amplifier envelope tracking (ET) circuit and related apparatus are provided.
Nadim Khlat
Filed: 31 Jan 19
Utility
Multi-level voltage circuit and related apparatus
31 Aug 21
A multi-level voltage circuit and related apparatus are provided.
Nadim Khlat
Filed: 20 Jun 19
Utility
Sensor with droplet retaining structure
24 Aug 21
This disclosure describes methods and devices that assist in forming biosensors.
James Russell Webster
Filed: 31 Aug 18
Utility
Substrates with integrated three dimensional inductors with via columns
17 Aug 21
This disclosure relates generally to substrates having three dimensional (3D) inductors and methods of manufacturing the same.
Dirk Robert Walter Leipold, George Maxim, John August Orlowski, Baker Scott
Filed: 20 Aug 19
Utility
Slanted apodization for acoustic wave devices
17 Aug 21
A device includes a die and an interdigital transducer on the die.
Shogo Inoue, Marc Solal
Filed: 9 Oct 17
Utility
Coupled resonator filter with embedded border ring
17 Aug 21
A coupled resonator filter includes a first resonator, a second resonator, one or more intervening layers, a first border ring, and a second border ring.
Susanne Kreuzer
Filed: 27 Feb 19
Utility
Envelope tracking amplifier apparatus
10 Aug 21
An envelope tracking (ET) amplifier apparatus is provided.
Nadim Khlat
Filed: 17 Jul 19
Utility
Multi-amplifier envelope tracking circuit and related apparatus
10 Aug 21
A multi-amplifier envelope tracking (ET) circuit and related apparatus are provided.
Nadim Khlat
Filed: 31 Jan 19
Utility
Bulk acoustic wave resonators with shaped border rings
10 Aug 21
Bulk acoustic wave (BAW) resonators, and particularly shaped border (BO) rings for BAW resonators are disclosed.
Mohammad J. Modarres-Zadeh, Alireza Tajic, Paul Stokes
Filed: 30 Jul 19
Utility
PWM DC-DC converter with linear voltage regulator for DC assist
10 Aug 21
A DC power supply, which includes a DC-DC converter and a linear voltage regulator, is disclosed.
Manbir Singh Nag, Michael R. Kay
Filed: 5 Sep 18
Utility
RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
3 Aug 21
The present disclosure relates to a radio frequency (RF) device including a device substrate, a thinned device die with a device region over the device substrate, a first mold compound, and a second mold compound.
Julio C. Costa, Michael Carroll
Filed: 22 Apr 19
Utility
Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
3 Aug 21
The present disclosure relates to a thermally enhanced package, which includes a carrier, a thinned die over the carrier, a mold compound, and a heat extractor.
Julio C. Costa, George Maxim
Filed: 29 Nov 18
Utility
Gallium-nitride-based module with enhanced electrical performance and process for making the same
3 Aug 21
The present disclosure relates to a Gallium-Nitride (GaN) based module, which includes a module substrate, a thinned switch die residing over the module substrate, a first mold compound, and a second mold compound.
Julio C. Costa, Michael Carroll
Filed: 3 Apr 19
Utility
Envelope tracking integrated circuit and related apparatus
3 Aug 21
An envelope tracking (ET) integrated circuit (IC) (ETIC) is provided.
Nadim Khlat
Filed: 17 Jul 19
Utility
Envelope tracking power amplifier apparatus
3 Aug 21
An envelope tracking (ET) power amplifier apparatus is provided.
Nadim Khlat
Filed: 1 Oct 19
Utility
Wafer-level fan-out package with enhanced performance
20 Jul 21
The present disclosure relates to a wafer-level fan-out package that includes a first thinned die, a second die, a multilayer redistribution structure underneath the first thinned die and the second die, a first mold compound over the second die, a second mold compound over the multilayer redistribution structure, and around the first thinned die and the second die, and a third mold compound.
Jonathan Hale Hammond, Julio C. Costa, Jon Chadwick
Filed: 27 Jun 19
Utility
Multi-radio access technology antenna assembly and related front-end package
20 Jul 21
A multi-radio access technology (RAT) antenna assembly and related front-end package is provided.
Dirk Robert Walter Leipold, George Maxim, Baker Scott
Filed: 30 Nov 18