262 patents
Page 2 of 14
Utility
System and method for monitoring parameters of a semiconductor factory automation system
31 Jan 23
A system for monitoring one or more conditions of an automation system of a semiconductor factory includes one or more instrumented substrates, one or more sealable containers and one or more system servers.
Mor Azarya, Michael D. Brain, Ami Appelbaum, Shai Mark, Arie Hoffman
Filed: 19 Feb 16
Utility
Loosely-coupled inspection and metrology system for high-volume production process monitoring
24 Jan 23
A metrology system is disclosed.
Song Wu, Yin Xu, Andrei V. Shchegrov, Lie-Quan Lee, Pablo Rovira, Jonathan Madsen
Filed: 27 Feb 19
Utility
Measuring thin films on grating and bandgap on grating
17 Jan 23
Methods and systems disclosed herein can measure thin film stacks, such as film on grating and bandgap on grating in semiconductors.
Houssam Chouaib, Zhengquan Tan
Filed: 15 Apr 20
Utility
Selective monitoring of multiple silicon compounds
17 Jan 23
Methods and apparatuses for selective monitoring of multiple silicon compounds in etchant solutions are provided.
Eugene Shalyt, Guang Liang
Filed: 27 Sep 19
Utility
Dynamic amelioration of misregistration measurement
10 Jan 23
A dynamic misregistration measurement amelioration method including taking at least one misregistration measurement at multiple sites on a first semiconductor device wafer, which is selected from a batch of semiconductor device wafers intended to be identical, analyzing each of the misregistration measurements, using data from the analysis of each of the misregistration measurements to determine ameliorated misregistration measurement parameters at each one of the multiple sites, thereafter ameliorating misregistration metrology tool setup for ameliorated misregistration measurement at the each one of the multiple sites, thereby generating an ameliorated misregistration metrology tool setup and thereafter measuring misregistration at multiple sites on a second semiconductor device wafer, which is selected from the batch of semiconductor device wafers intended to be identical, using the ameliorated misregistration metrology tool setup.
Roie Volkovich, Anna Golotsvan, Eyal Abend
Filed: 19 May 19
Utility
Unsupervised defect segmentation
10 Jan 23
An inspection system may receive inspection datasets from a defect inspection system associated with inspection of one or more samples, where an inspection dataset of the plurality of inspection datasets associated with a defect includes values of two or more signal attributes and values of one or more context attributes.
Erfan Soltanmohammadi, Ashwin Ramakrishnan, Mohit Jani
Filed: 8 Jan 19
Utility
Semiconductor wafer dicing process
3 Jan 23
A semiconductor wafer dicing process is disclosed for dicing a wafer into individual dies.
Matthew Michael Day, Samira Binte Kazemi
Filed: 10 Nov 20
Utility
3D microscope including insertable components to provide multiple imaging and measurement capabilities
27 Dec 22
A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities.
James Jianguo Xu, Ken Kinsun Lee, Rusmin Kudinar, Ronny Soetarman, Hung Phi Nguyen, Zhen Hou
Filed: 2 Dec 20
Utility
Reduction or elimination of pattern placement error in metrology measurements
27 Dec 22
Metrology methods and targets are provided for reducing or eliminating a difference between a device pattern position and a target pattern position while maintaining target printability, process compatibility and optical contrast—in both imaging and scatterometry metrology.
Yoel Feler, Vladimir Levinski, Roel Gronheid, Sharon Aharon, Evgeni Gurevich, Anna Golotsvan, Mark Ghinovker
Filed: 28 Jan 21
Utility
Automated accuracy-oriented model optimization system for critical dimension metrology
27 Dec 22
Techniques and systems for critical dimension metrology are disclosed.
Yuerui Chen, Xin Li
Filed: 30 Jan 18
Utility
Apparatus and method for cleaning wafer handling equipment
13 Dec 22
A cleaning assembly for cleaning one or more wafer edge handling contact surfaces of wafer handling equipment includes a substrate and a cleaning ring.
William VanHoomissen, Val Estrin, Eric Jong
Filed: 13 Jul 17
Utility
Transmission small-angle X-ray scattering metrology system
6 Dec 22
Methods and systems for characterizing dimensions and material properties of semiconductor devices by transmission small angle x-ray scatterometry (TSAXS) systems having relatively small tool footprint are described herein.
Andrei V. Shchegrov, Antonio Arion Gellineau, Sergey Zalubovsky
Filed: 25 Aug 20
Utility
Methods and systems for real time measurement control
6 Dec 22
Methods and systems for improving a measurement recipe describing a sequence of measurements employed to characterize semiconductor structures are described herein.
Antonio Arion Gellineau
Filed: 16 Feb 19
Utility
Method and apparatus for controlling stress variation in a material layer formed via pulsed DC physical vapor deposition
6 Dec 22
A method and apparatus are for controlling stress variation in a material layer formed via pulsed DC physical vapour deposition.
Anthony Wilby, Steve Burgess, Ian Moncrieff, Clive Widdicks, Scott Haymore, Rhonda Hyndman
Filed: 20 Feb 18
Utility
Nuisance mining for novel defect discovery
29 Nov 22
A method of defect discovery can include providing a nuisance bin in a nuisance filter, partitioning the defect population into a defect population partition, segmenting the defect population partition into a defect population segment, selecting from the defect population segment a selected set of defects, computing one or more statistics of the signal attributes of the defects in the defect population segment, replicating the selected set of defects to yield generated defects, shifting the generated defects outside of the defect population segment, creating a training set, and training a binary classifier.
Martin Plihal
Filed: 15 Feb 19
Utility
Method of plasma etching
1 Nov 22
A structure comprising a semiconductor substrate and a layer of PZT (lead zirconate titanate) is etched by performing a first plasma etch step with a first etch process gas mixture.
Huma Ashraf, Kevin Riddell, Codrin Prahoveanu
Filed: 23 Nov 20
Utility
Auto-correlation of wafer characterization data and generation of composite wafer metrics during semiconductor device fabrication
27 Sep 22
A system includes a controller with processors configured to execute an auto-correlation module embodied in one or more sets of program instructions stored in memory.
Shivam Agarwal, Hariharasudhan Koteeswaran, Priyank Jain, Suvi Murugan, Yuan Zhong
Filed: 23 Jan 19
Utility
Determining critical parameters using a high-dimensional variable selection model
27 Sep 22
A high-dimensional variable selection unit determines a list of critical parameters from sensor data and parametric tool measurements from a semiconductor manufacturing tool, such as a semiconductor inspection tool or other types of semiconductor manufacturing tools.
Wei Chang, Joseph Gutierrez, Krishna Rao
Filed: 23 Jun 19
Utility
Multi-spot analysis system with multiple optical probes
13 Sep 22
A system for analyzing a sample includes an illumination source with a plurality of transmitting optical fibers optically coupled to the illumination source and a detector with a plurality of receiving optical fibers optically coupled to the detector.
Prasanna Dighe, Dieter Mueller, Dong Chen, Dengpeng Chen, Steve Zamek, Daniel Kavaldjiev, Alexander Buettner
Filed: 26 Jun 18
Utility
Vacuum hold-down apparatus for flattening bowed semiconductor wafers
30 Aug 22
A vacuum hold-down apparatus retains a wafer in a desired position and orientation.
Ariel Hildesheim, Ofer Angel
Filed: 25 Mar 19