262 patents
Page 5 of 14
Utility
Model-based metrology using images
14 Dec 21
Methods and systems for combining information present in measured images of semiconductor wafers with additional measurements of particular structures within the measured images are presented herein.
Stilian Ivanov Pandev
Filed: 27 Jun 19
Utility
Target selection improvements for better design alignment
7 Dec 21
Techniques and systems to achieve more accurate design alignment to an image by improved pixel-to-design alignment (PDA) target selection are disclosed.
Santosh Kumar, Pavan Kumar Perali
Filed: 30 Aug 18
Utility
Plasma generating arrangement
30 Nov 21
A plasma generating arrangement includes a plurality of plasma sources, each plasma source including a respective antenna coil assembly electrically coupled to a common electrical terminal via a respective transmission line.
Paul Bennett
Filed: 25 Feb 19
Utility
Spectral filter for high-power fiber illumination sources
30 Nov 21
A spectral filter includes a curved filtering element including a concave surface forming a portion of a sphere.
Andrew V. Hill, Ohad Bachar, Avi Abramov, Amnon Manassen
Filed: 1 Aug 17
Utility
Lithographic apparatus and method of controlling a lithographic apparatus
23 Nov 21
A Lithographic apparatus and method of controlling a lithographic process.
Stefan Buhl, Philip Groeger, Wansoo Kim
Filed: 28 Dec 18
Utility
Passivation of nonlinear optical crystals
23 Nov 21
The passivation of a nonlinear optical crystal for use in an inspection tool includes growing a nonlinear optical crystal in the presence of at least one of fluorine, a fluoride ion and a fluoride-containing compound, mechanically preparing the nonlinear optical crystal, performing an annealing process on the nonlinear optical crystal and exposing the nonlinear optical crystal to a hydrogen-containing or deuterium-containing passivating gas.
Yung-Ho Alex Chuang, Vladimir Dribinski
Filed: 8 Apr 14
Utility
Training a machine learning model with synthetic images
9 Nov 21
Methods and systems for training a machine learning model using synthetic defect images are provided.
Ian Riley, Li He, Sankar Venkataraman, Michael Kowalski, Arjun Hegde
Filed: 19 Mar 19
Utility
Process-induced displacement characterization during semiconductor production
2 Nov 21
A controller is configured to perform at least a first characterization process prior to at least one discrete backside film deposition process on a semiconductor wafer; perform at least an additional characterization process following the at least one discrete backside film deposition process; determine at least one of a film force or one or more in-plane displacements for at least one discrete backside film deposited on the semiconductor wafer via the at least one discrete backside film deposition process based on the at least the first characterization process and the at least the additional characterization process; and provide at least one of the film force or the one or more in-plane displacements to at least one process tool via at least one of a feed forward loop or a feedback loop to improve performance of one or more fabrication processes.
Pradeep Vukkadala, Mark D. Smith, Ady Levy, Prasanna Dighe, Dieter Mueller
Filed: 26 Jun 18
Utility
Measurement methodology of advanced nanostructures
26 Oct 21
A parameterized geometric model of a structure can be determined based on spectra from a wafer metrology tool.
Manh Nguyen, Phillip Atkins, Alexander Kuznetsov, Liequan Lee, Natalia Malkova, Paul Aoyagi, Mikhail Sushchik, Dawei Hu, Houssam Chouaib
Filed: 28 Mar 18
Utility
High-brightness illumination source for optical metrology
26 Oct 21
An illumination source may include two or more input light sources, a collector, and any combination of a beam uniformizer, a speckle reducer, or any number of output fibers to provide a selected illumination etendue.
Amnon Manassen, Andrew V. Hill, Ohad Bachar, Avi Abramov
Filed: 4 Jun 19
Utility
Overlay measurement using multiple wavelengths
26 Oct 21
A method of determining overlay (“OVL”) in a pattern in a semiconductor wafer manufacturing process comprises capturing images from a cell in a metrology target formed in at least two different layers in the wafer with parts of the target offset in opposing directions with respect to corresponding parts in a different layer.
Yuval Lamhot, Eran Amit, Einat Peled, Noga Sella, Wei-Te Cheng, Ido Adam
Filed: 3 Sep 18
Utility
System and method for switching between an EUV pellicle and an optical pellicle
26 Oct 21
A system for switching between an optical pellicle and an EUV pellicle includes one or more inspection tools configured to perform one or more inspection processes on a mask.
Mohammad Mehdi Daneshpanah, Daniel Andrew Smith
Filed: 24 Apr 18
Utility
Cross layer common-unique analysis for nuisance filtering
19 Oct 21
Common events between layers on a semiconductor wafer are filtered.
Bjorn Brauer
Filed: 20 Nov 18
Utility
System and method for difference filter and aperture selection using shallow deep learning
19 Oct 21
A system for defect review and classification is disclosed.
Santosh Bhattacharyya, Jacob George, Saravanan Paramasivam, Martin Plihal
Filed: 15 Feb 19
Utility
Instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
19 Oct 21
An apparatus includes a substrate, a nested enclosure assembly including an outer enclosure and an inner enclosure, wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses at least the electronic assembly.
Mei Sun, Vaibhaw Vishal
Filed: 27 Sep 16
Utility
Process monitoring of deep structures with X-ray scatterometry
12 Oct 21
Methods and systems for estimating values of process parameters, structural parameters, or both, based on x-ray scatterometry measurements of high aspect ratio semiconductor structures are presented herein.
Antonio Arion Gellineau, Thaddeus Gerard Dziura
Filed: 5 Jun 20
Utility
Metrology targets and methods with oblique periodic structures
5 Oct 21
Metrology targets, design methods and measurement methods thereof are provided with periodic structure(s) which are oblique with respect to orthogonal production axes X and Y of the lithography tool—enabling more accurate overlay measurements of devices having diagonal (oblique, tilted) elements such as DRAM devices.
Yoel Feler, Mark Ghinovker, Alexander Svizher, Vladimir Levinski, Inna Tarshish-Shapir
Filed: 29 Nov 18
Utility
Differential imaging for single-path optical wafer inspection
5 Oct 21
Methods and systems for enhanced defect detection based on images collected by at least two imaging detectors at different times are described.
Anatoly Shchemelinin, Ilya Bezel, Eugene Shifrin
Filed: 21 Dec 18
Utility
System, method and non-transitory computer readable medium for tuning sensitivities of, and determining a process window for, a modulated wafer
5 Oct 21
A system, method, and non-transitory computer readable medium are provided for tuning sensitivities of, and determining a process window for, a modulated wafer.
David Craig Oram, Abhinav Mathur, Kenong Wu, Eugene Shifrin
Filed: 29 Apr 20
Utility
Apparatus and methods for measuring phase and amplitude of light through a layer
28 Sep 21
In one embodiment, disclosed are apparatus, methods, and targets for determining a phase shift of a photomask having a phase-shift target.
Abdurrahman Sezginer, Kuljit Virk, Eric Vella
Filed: 29 Jan 18