10908 patents
Page 3 of 546
Utility
Controlling coarse pixel size from a stencil buffer
9 Jan 24
Systems, apparatuses and methods may provide for technology that determines a stencil value and uses the stencil value to control, via a stencil buffer, a coarse pixel size of a graphics pipeline.
Karthik Vaidyanathan, Prasoonkumar Surti, Hugues Labbe, Atsuo Kuwahara, Sameer Kp, Jonathan Kennedy, Murali Ramadoss, Michael Apodaca, Abhishek Venkatesh
Filed: 7 Feb 22
Utility
Automatic point cloud validation for immersive media
9 Jan 24
Techniques related to validating an image based 3D model of a scene are discussed.
Xiaofeng Tong, Wenlong Li
Filed: 14 May 19
Utility
Adaptive deformable kernel prediction network for image de-noising
9 Jan 24
Embodiments are generally directed to an adaptive deformable kernel prediction network for image de-noising.
Anbang Yao, Ming Lu, Yikai Wang, Xiaoming Chen, Junjie Huang, Tao Lv, Yuanke Luo, Yi Yang, Feng Chen, Zhiming Wang, Zhiqiao Zheng, Shandong Wang
Filed: 5 Nov 20
Utility
Deep learning inference efficiency technology with early exit and speculative execution
9 Jan 24
Systems, apparatuses and methods may provide for technology that processes an inference workload in a first subset of layers of a neural network that prevents or inhibits data dependent branch operations, conducts an exit determination as to whether an output of the first subset of layers satisfies one or more exit criteria, and selectively bypasses processing of the output in a second subset of layers of the neural network based on the exit determination.
Haim Barad, Barak Hurwitz, Uzi Sarel, Eran Geva, Eli Kfir, Moshe Island
Filed: 9 Jan 23
Utility
Thermal interface structures for integrated circuit packages
9 Jan 24
A thermal interface structure may be formed comprising a thermally conductive substrate having a first surface and an opposing second surface, a first liquid metal layer on the first surface of the thermally conductive substrate, and a second liquid metal layer on the second surface of the thermally conductive substrate.
Kyle J. Arrington, Aaron McCann, Kelly Lofgreen, Elah Bozorg-Grayeli, Aravindha Antoniswamy, Joseph B. Petrini
Filed: 4 Nov 19
Utility
Scalable high speed high bandwidth IO signaling package architecture and method of making
9 Jan 24
Embodiments disclosed herein include electronic packages.
Sanka Ganesan, Robert L. Sankman, Arghya Sain, Sri Chaitra Jyotsna Chavali, Lijiang Wang, Cemil Geyik
Filed: 24 Jul 19
Utility
Self-aligned gate endcap (SAGE) architectures without fin end gap
9 Jan 24
Self-aligned gate endcap (SAGE) architectures without fin end gaps, and methods of fabricating self-aligned gate endcap (SAGE) architectures without fin end gaps, are described.
Szuya S. Liao, Scott B. Clendenning, Jessica Torres, Lukas Baumgartel, Kiran Chikkadi, Diane Lancaster, Matthew V. Metz, Florian Gstrein, Martin M. Mitan, Rami Hourani
Filed: 23 Sep 19
Utility
Stacked transistors with contact last
9 Jan 24
An apparatus is provided which comprises: a first transistor comprising a source region and a drain region with a channel region therebetween, a first dielectric layer over the first transistor, a second transistor comprising a source region and a drain region with a channel region therebetween, wherein the second transistor is over the first dielectric layer, a second dielectric layer over the second transistor, and a contact coupled to the source region or the drain region of the first transistor, wherein the contact comprises a metal having a straight sidewall that extends from through both the first and second dielectric layers.
Ravi Pillarisetty, Willy Rachmady, Gilbert Dewey, Rishabh Mehandru, Jack T. Kavalieros
Filed: 26 Dec 17
Utility
Non-planar integrated circuit structures having mitigated source or drain etch from replacement gate process
9 Jan 24
Non-planar integrated circuit structures having mitigated source or drain etch from replacement gate process are described.
Jun Sung Kang, Kai Loon Cheong, Erica J. Thompson, Biswajeet Guha, William Hsu, Dax M. Crum, Tahir Ghani, Bruce Beattie
Filed: 28 Sep 18
Utility
Metallization structures for stacked device connectivity and their methods of fabrication
9 Jan 24
A stacked device structure includes a first device structure including a first body that includes a semiconductor material, and a plurality of terminals coupled with the first body.
Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey, Jessica M. Torres, Kimin Jun, Tristan A. Tronic, Christopher J. Jezewski, Hui Jae Yoo, Robert S. Chau, Chi-Hwa Tsang
Filed: 13 Jul 22
Utility
Nanowire transistor structure and method of shaping
9 Jan 24
A nanowire device includes one or more nanowire having a first end portion, a second end portion, and a body portion between the first end portion and the second end portion.
Erica J. Thompson, Aditya Kasukurti, Jun Sung Kang, Kai Loon Cheong, Biswajeet Guha, William Hsu, Bruce Beattie
Filed: 20 Jun 18
Utility
Gate-all-around integrated circuit structures including varactors
9 Jan 24
Gate-all-around integrated circuit structures including varactors are described.
Ayan Kar, Saurabh Morarka, Carlos Nieva-Lozano, Kalyan Kolluru, Biswajeet Guha, Chung-Hsun Lin, Brian Greene, Tahir Ghani
Filed: 7 Jul 22
Utility
Structural battery with pressure housing for portable electronic devices
9 Jan 24
The present disclosure is directed to systems and methods for improving the rigidity or stiffness of an electronic device chassis or housing using a structural secondary battery.
Juha Paavola, Naoki Matsumura, Mikko Makinen
Filed: 9 Apr 20
Utility
Antenna modules and communication devices
9 Jan 24
Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications).
Sidharth Dalmia, Jonathan Jensen, Ozgur Inac, Trang Thai, William J. Lambert, Benjamin Jann
Filed: 9 May 22
Utility
Antenna isolation enhancement
9 Jan 24
Techniques are disclosed for providing isolation between a pair of partially overlapping antennas.
Simon Svendsen, Ole Jagielski, Farooq Shaikh, Daniel B. Schwartz, Poul Olesen
Filed: 17 Feb 23
Utility
Antenna package using ball attach array to connect antenna and base substrates
9 Jan 24
In accordance with disclosed embodiments, there is an antenna package using a ball attach array to connect an antenna and base substrates of the package.
Jimin Yao, Robert L. Sankman, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang
Filed: 25 Mar 22
Utility
Wireless power transmitting coil disposed at an input device
9 Jan 24
Techniques for wireless charging in a system, method, and apparatus are described herein.
Esa Saunamaki
Filed: 17 Jun 20
Utility
Systems and methods for calibrating digital phase-locked loops
9 Jan 24
A clock generator calibration system can include a phased-locked loop and a correction circuit.
Elan Banin, Yaniv Cohen, Ofir Degani, Igal Kushnir
Filed: 28 Dec 19
Utility
Function generation in named function networks
9 Jan 24
A named function network (NFN) system includes a routing node, a function generation node, and a server node.
Sunil Cheruvu, Ned M. Smith, Francesc Guim Bernat, Kshitij Arun Doshi, Eve M. Schooler, Dario Sabella
Filed: 22 Dec 20
Utility
Apparatus, system and method of communicating an EDMG PPDU
9 Jan 24
Some demonstrative embodiments include apparatuses, devices, systems and methods of communicating an Enhanced Directional Multi-Gigabit (DMG) (EDMG) Physical Layer Protocol Data Unit (PPDU).
Artyom Lomayev, Alexander Maltsev, Michael Genossar, Claudio Da Silva, Carlos Cordeiro
Filed: 16 Oct 22