10908 patents
Page 34 of 546
Utility
Inductors for package substrates
19 Sep 23
Embodiments herein describe techniques for a semiconductor device including a package substrate having a core layer.
Sri Chaitra Jyotsna Chavali, Tarek Ibrahim, Wei-Lun Jen
Filed: 3 Jul 19
Utility
Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same
19 Sep 23
An embedded multi-die interconnect bridge apparatus and method includes photolithographically formed interconnects coupled to laser-drilled interconnects.
Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama, Robert L. Sankman
Filed: 3 May 21
Utility
Semiconductor packages, and methods for forming semiconductor packages
19 Sep 23
A semiconductor package includes a first semiconductor die, a semiconductor device comprising a second semiconductor die, and one or more wire bond structures.
Bernd Waidhas, Georg Seidemann, Thomas Wagner, Andreas Wolter, Andreas Augustin, Sonja Koller, Thomas Ort, Reinhard Mahnkopf
Filed: 29 Sep 17
Utility
Metal space centered standard cell architecture to enable higher cell density
19 Sep 23
Embodiments disclosed herein include a semiconductor device.
Harshitha Vishwanath, Renukprasad Hiremath, Sukru Yemenicioglu, Ranjith Kumar, Ruth Amy Brain
Filed: 2 Dec 19
Utility
Gate-all-around integrated circuit structures having depopulated channel structures using multiple bottom-up oxidation approaches
19 Sep 23
Gate-all-around integrated circuit structures having depopulated channel structures, and methods of fabricating gate-all-around integrated circuit structures having depopulated channel structures using multiple bottom-up oxidation approaches, are described.
Ehren Mannebach, Anh Phan, Aaron Lilak, Willy Rachmady, Gilbert Dewey, Cheng-Ying Huang, Richard Schenker, Hui Jae Yoo, Patrick Morrow
Filed: 4 Jan 19
Utility
Indium-containing fin of a transistor device with an indium-rich core
19 Sep 23
An apparatus including a transistor device disposed on a surface of a circuit substrate, the device including a body including opposing sidewalls defining a width dimension and a channel material including indium, the channel material including a profile at a base thereof that promotes indium atom diffusivity changes in the channel material in a direction away from the sidewalls.
Chandra S. Mohapatra, Glenn A. Glass, Harold W. Kennel, Anand S. Murthy, Willy Rachmady, Gilbert Dewey, Sean T. Ma, Matthew V. Metz, Jack T. Kavalieros, Tahir Ghani
Filed: 1 Apr 16
Utility
Antiferroelectric gate dielectric transistors and their methods of fabrication
19 Sep 23
A transistor, including an antiferroelectric (AFE) gate dielectric layer is described.
Ravi Pillarisetty, Brian S. Doyle, Abhishek A. Sharma, Prashant Majhi, Willy Rachmady, Jack T. Kavalieros, Gilbert Dewey
Filed: 2 Sep 21
Utility
Thin film transistors having double gates
19 Sep 23
Thin film transistors having double gates are described.
Abhishek A. Sharma, Van H. Le, Jack T. Kavalieros, Tahir Ghani, Gilbert Dewey
Filed: 22 Mar 18
Utility
Multi-layer crystalline back gated thin film transistor
19 Sep 23
Described is an apparatus which comprises: a gate comprising a metal; a first layer adjacent to the gate, the first layer comprising a dielectric material; a second layer adjacent to the first layer, the second layer comprising a second material; a third layer adjacent to the second layer, the third layer comprising a third material including an amorphous metal oxide; a fourth layer adjacent to the third layer, the fourth layer comprising a fourth material, wherein the fourth and second materials are different than the third material; a source partially adjacent to the fourth layer; and a drain partially adjacent to the fourth layer.
Van H. Le, Abhishek A. Sharma, Gilbert Dewey, Kent Millard, Jack Kavalieros, Shriram Shivaraman, Tristan A. Tronic, Sanaz Gardner, Justin R. Weber, Tahir Ghani, Li Huey Tan, Kevin Lin
Filed: 13 Sep 21
Utility
Integrated circuit including a dielectric waveguide with a cavity therein surrounded by a conductive coating forming a wall for the cavity
19 Sep 23
Disclosed herein are various designs for dielectric waveguides, as well as methods of manufacturing such waveguides.
Georgios Dogiamis, Adel A. Elsherbini, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan
Filed: 16 Feb 22
Utility
Lensing systems for wireless communications
19 Sep 23
A communication device may include a millimeter wave (mm-wave) antenna array having antenna elements, a mm-wave element (e.g. lens), and one or more transceivers (e.g. first and second transceivers).
Ashoke Ravi, Ofir Degani, Ronen Kronfeld, Harry Skinner, Seong-Youp Suh, Tae-Young Yang
Filed: 9 Sep 21
Utility
Magnetoelectric majority gate device
19 Sep 23
A magneto-electric (ME) majority gate device includes a conducting device and a plurality of ME transistors coupled to the conducting device.
Nishtha Sharma Gaul, Andrew Marshall, Peter A. Dowben, Dmitri E. Nikonov
Filed: 29 May 22
Utility
Channel state information for multiple access points
19 Sep 23
Methods, apparatuses, and computer readable media for channel state information for multiple access points are disclosed.
Qinghua Li, Feng Jiang, Xiaogang Chen, Po-Kai Huang, Jonathan Segev, Dibakar Das
Filed: 4 Sep 20
Utility
Method and system for attaching optical fibers to warped photonic chips
19 Sep 23
The present disclosure relates to a method including arranging multiple optical fibers between a die and a lid, wherein the die is bent and comprises multiple grooves, each optical fiber in or close to a separate groove; bonding the lid to the die to hold the multiple optical fibers in place in the multiple grooves, wherein the bonding comprises applying a bonding force non-uniformly across the lid to conform the lid to the bent die.
Sufi Ahmed, Vineeth Abraham, Eric Moret, Paul Diglio
Filed: 23 Sep 21
Utility
Current control for a multicore processor
19 Sep 23
Apparatuses, methods and storage medium associated with current control for a multicore processor are disclosed herein.
Alexander Gendler, Efraim Rotem, Nir Rosenzweig, Krishnakanth V. Sistla, Ashish V. Choubal, Ankush Varma
Filed: 28 Dec 21
Utility
USB Type-C subsystem power management
19 Sep 23
Hardware-based wake detection and system-on-chip (SoC) firmware support for servicing fixed display port (DP) and High Definition Multimedia Interface (HDMI) port hot plug events which allow a Universal Serial Bus (USB) Type-C subsystem to go into a powered off state while the fixed display is not streaming.
Sindhu Amireddy, Brent Bero, Deepak Rangaraj, Patrick Maloney
Filed: 16 May 22
Utility
Methods and apparatus to add common sense reasoning to artificial intelligence in the context of human machine interfaces
19 Sep 23
Methods, apparatus, systems and articles of manufacture are disclosed to add common sense to a human machine interface.
Hassnaa Moustafa, Rita H. Wouhaybi, Nadine L. Dabby, Chaitanya Sreerama, Shekoufeh Qawami
Filed: 29 Sep 18
Utility
Instruction prefetch based on thread dispatch commands
19 Sep 23
A graphics processing device comprises a set of compute units to execute multiple threads of a workload, a cache coupled with the set of compute units, and a prefetcher to prefetch instructions associated with the workload.
James Valerio, Vasanth Ranganathan, Joydeep Ray, Pradeep Ramani
Filed: 25 Oct 21
Utility
Hybrid low power homogenous grapics processing units
19 Sep 23
In an example, an apparatus comprises a plurality of execution units comprising at least a first type of execution unit and a second type of execution unit and logic, at least partially including hardware logic, to analyze a workload and assign the workload to one of the first type of execution unit or the second type of execution unit.
Abhishek R Appu, Altug Koker, Balaji Vembu, Joydeep Ray, Kamal Sinha, Prasoonkumar Surti, Kiran C. Veernapu, Subramaniam Maiyuran, Sanjeev S. Jahagirdar, Eric J. Asperheim, Guei-Yuan Lueh, David Puffer, Wenyin Fu, Nikos Kaburlasos, Bhushan M. Borole, Josh B. Mastronarde, Linda L. Hurd, Travis T. Schluessler, Tomasz Janczak, Abhishek Venkatesh, Kai Xiao, Slawomir Grajewski
Filed: 5 Nov 21
Utility
Streaming fabric interface
19 Sep 23
An interface for coupling an agent to a fabric supports a load/store interconnect protocol and includes a header channel implemented on a first subset of a plurality of physical lanes, the first subset of lanes including first lanes to carry a header of a packet based on the interconnect protocol and second lanes to carry metadata for the header.
Swadesh Choudhary, Debendra Das Sharma, Lee Albion
Filed: 27 Jun 20