10908 patents
Page 72 of 546
Utility
Microelectronic package with substrate-integrated components
2 May 23
Embodiments may relate to a microelectronic package or a die thereof which includes a die, logic, or subsystem coupled with a face of the substrate.
Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan
Filed: 15 Mar 22
Utility
Blind spot detection
25 Apr 23
Herein is disclosed a detection device comprising one or more sensors, configured to receive sensor input from a vicinity of a first vehicle, and to generate sensor data representing the received sensor input; one or more processors, configured to detect a second vehicle from the received sensor data; determine from the sensor data a region of a first type relative to the second vehicle and a region of a second type relative to the second vehicle; and control the first vehicle to avoid or reduce travel in the one or more regions of the first type or to travel from a region of the first type to a region of the second type.
Daniel Pohl, Maik Sven Fox
Filed: 9 Aug 19
Utility
37cbxlmkm5ihwmbyc yj2in3bu3r
25 Apr 23
An apparatus comprises at least one sensor to collect localization information indicating a location of a first robotic agent of a plurality of robotic agents; and a processor comprising circuitry.
Dibyendu Ghosh, Ganeshram Nandakumar, Karthik Narayanan, Vinayak Honkote
Filed: 29 Jun 19
Utility
w99yxbzapz1t5bb0x8flceuy7j560bz
25 Apr 23
Described herein are hardware acceleration of random number generation for machine learning and deep learning applications.
Yiwen Guo, Anbang Yao, Dongqi Cai, Libin Wang, Lin Xu, Ping Hu, Shandong Wang, Wenhua Cheng
Filed: 7 Apr 17
Utility
5b208krn16fgimbnkp5vqgnat9v6qvdy zscsocpolv
25 Apr 23
Methods, apparatus, systems, and articles of manufacture are disclosed to identify code semantics.
Justin Gottschlich
Filed: 17 Dec 21
Utility
4a6aqewyky0 otskcq4jfwm8zc16x6
25 Apr 23
Methods and apparatuses relating to mitigations for speculative execution side channels are described.
Jason W. Brandt, Deepak K. Gupta, Rodrigo Branco, Joseph Nuzman, Robert S. Chappell, Sergiu D. Ghetie, Wojciech Powiertowski, Jared W. Stark, IV, Ariel Sabba, Scott J. Cape, Hisham Shafi, Lihu Rappoport, Yair Berger, Scott P. Bobholz, Gilad Holzstein, Sagar V. Dalvi, Yogesh Bijlani
Filed: 31 Oct 18
Utility
mdtde0is4n4c5gt1cm5mok1msmm2362uv89j241iy05n2s9is6t7z6yo5mz
25 Apr 23
Embodiments are directed to memory protection with hidden inline metadata.
David M. Durham, Ron Gabor
Filed: 28 Mar 22
Utility
y4r2l9jrvhjntp18istznp862lcifpsq2kcam3sjvaok6dtidavo5sauur
25 Apr 23
Described herein is an accelerator device including a host interface, a fabric interconnect coupled with the host interface, and one or more hardware tiles coupled with the fabric interconnect, the one or more hardware tiles including sparse matrix multiply acceleration hardware including a systolic array with feedback inputs.
Subramaniam Maiyuran, Jorge Parra, Supratim Pal, Ashutosh Garg, Shubra Marwaha, Chandra Gurram, Darin Starkey, Durgesh Borkar, Varghese George
Filed: 16 Nov 21
Utility
s21jxpms299j4f1ehst2yak4rxozr aiwvzklinj4f6db4agw31ttt
25 Apr 23
Techniques and mechanisms for servicing a search query using a spiking neural network.
Arnab Paul, Narayan Srinivasa
Filed: 15 Dec 17
Utility
c1xfnprci0sbpisuwsftu6rnw2whxqm7o1qivrhiho9 orgd4dladhs7fb
25 Apr 23
An embodiment of a semiconductor package apparatus may include technology to process one or more vectors with a sum of squares operation with a layer of a multi-layer neural network, and determine a fixed-point approximation for the sum of squares operation.
Gokce Keskin, Anil Thomas, Oguz Elibol
Filed: 22 Aug 18
Utility
9oybo5ru8i11l8gnfzq3km0l6 j5i4y25zs1rjktk45vdmwvp78m
25 Apr 23
An apparatus to facilitate processing of a sparse matrix for arbitrary graph data is disclosed.
Eriko Nurvitadhi, Amit Bleiweiss, Deborah Marr, Eugene Wang, Saritha Dwarakapuram, Sabareesh Ganapathy
Filed: 29 Dec 17
Utility
f4nhuep3kwg7s5op34w1zru2y
25 Apr 23
An embodiment of a graphics command coordinator apparatus may include a commonality identifier to identify a commonality between a first graphics command corresponding to a first frame and a second graphics command corresponding to a second frame, a commonality analyzer communicatively coupled to the commonality identifier to determine if the first graphics command and the second graphics command can be processed together based on the commonality identified by the commonality identifier, and a commonality indicator communicatively coupled to the commonality analyzer to provide an indication that the first graphics command and the second graphics command are to be processed together.
Abhishek Venkatesh, Karthik Vaidyanathan, Murali Ramadoss, Michael Apodaca, Prasoonkumar Surti
Filed: 27 Sep 21
Utility
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25 Apr 23
Embodiments are generally directed to methods and apparatuses for encoding based on importance values.
Yejun Guo
Filed: 16 Dec 20
Utility
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25 Apr 23
Methods and apparatus relating to an adaptive multibit bus for energy optimization are described.
Sanjeev S. Jahagirdar, Tapan A. Ganpule, Anupama A. Thaploo, Abhishek R. Appu, Joydeep Ray, Altug Koker
Filed: 23 Jul 21
Utility
ukerbtut5qy1ctalyzuysq7y7ytsa3 g7sgdn
25 Apr 23
Embodiments described herein provide an anisotropic conductive film (ACF) positioned on a semiconductor package and techniques of using the ACF to test semiconductor devices positioned in or on the semiconductor package.
Hyoung Il Kim
Filed: 29 Jan 19
Utility
lwe1bl046nayki4p54mup4f46cjslx9fvd
25 Apr 23
An inductor or transformer with the inductor can include one or more windings split into strands along a radial path of the winding and provide for a more uniform current distribution across a width of the winding.
Alfred Erik Raidl
Filed: 21 Jan 21
Utility
rulkrl4yfi8t53c6usz0tt4h6jo iywurw1uybvliqqc7vf4damr8a3
25 Apr 23
Micro light-emitting diode (LED) displays, and fabrication and assembly of micro LED displays, are described.
Khaled Ahmed, Anup Pancholi, Sansaptak Dasgupta, Chad Mair
Filed: 24 May 18
Utility
hka1tm7iur vus6mr1sodvdilsibdt1b0p0yqjmdyvpj91x1ssmi
25 Apr 23
A semiconductor package substrate includes an integral magnetic-helical inductor that is assembled during assembly of the semiconductor package substrate.
Shivasubramanian Balasubramanian, Dilan Seneviratne
Filed: 21 Jul 20
Utility
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25 Apr 23
Embodiments herein describe techniques for an integrated circuit that includes a substrate, a semiconductor device on the substrate, and a contact stack above the substrate and coupled to the semiconductor device.
Justin Weber, Harold Kennel, Abhishek Sharma, Christopher Jezewski, Matthew V. Metz, Tahir Ghani, Jack T. Kavalieros, Benjamin Chu-Kung, Van H. Le, Arnab Sen Gupta
Filed: 25 Sep 18
Utility
xc5gn6xnorxcxu0zkh9nq71f3s g2k64c4i
25 Apr 23
Describe is a resonator that uses ferroelectric (FE) materials in the gate of a transistor as a dielectric.
Tanay Gosavi, Chia-ching Lin, Raseong Kim, Ashish Verma Penumatcha, Uygar Avci, Ian Young
Filed: 2 Jan 19