32417 patents
Page 13 of 1621
Utility
Display Device
11 Jan 24
A display device includes: at least two mount members fixable to a wall in a row; and at least two display panels coupleable to the at least two mount members, respectively, and slidable along the at least two mount members.
Taehun KIM, Suan CHOI, Soonseok SEO, Wookjin LEE, Huulam Vuong NGUYEN
Filed: 20 Sep 23
Utility
Wearable Device and Method for Identifying User's State
11 Jan 24
A wearable device includes a communication circuit, at least one sensor, and a processor, wherein the processor is configured to identify a distance between the wearable device and an external electronic device through the communication circuit, during identifying that a user wearing the wearable device is sleeping, compare data obtained through the at least one sensor to first reference data to identify a first state of the user while the user is sleeping based at least in part on identifying that the distance that is less than a reference distance, and compare the data to second reference data to identify a second state of the user while the user is awake, which is distinct to the first reference data based at least in part on identifying that the distance that is greater than or equal to the reference distance.
Hyeonseong KIM, Chanung PARK, Jeongmin PARK
Filed: 29 Jun 23
Utility
Integrated Circuit Device and Method of Manufacturing the Same
11 Jan 24
An integrated circuit device may include a plurality of lower electrodes above a substrate, a supporter between the plurality of lower electrodes, an upper electrode on the plurality of lower electrodes, and a capacitor dielectric film between the upper electrode and the plurality of lower electrodes.
Kyooho JUNG, Jongyeong MIN, Jiye BAEK, Yeseul LEE, Jinwook LEE, Wonsik CHOI
Filed: 12 Jun 23
Utility
Electronic Device Supporting Multi-edid Read Operation and Operating Method
11 Jan 24
An operating method for an electronic device that communicates with a source device through a high definition multimedia interface (HDMI), includes determining whether the source device supports a multi-extended display identification data (EDID) read operation through a display data channel (DDC) and sequentially transmitting an EDID set stored in a non-volatile memory to the source device using an EDID group corresponding to a size of a cache memory, as a transmission unit, based on a size of the EDID set and the size of the cache memory, when it is determined that the multi-EDID read operation is supported.
TECK SHENG NG, SEONGIN KANG, BONGCHAN CHO, HYEONGSU CHOI
Filed: 27 Dec 22
Utility
Semiconductor Memory Device
11 Jan 24
A semiconductor memory device is provided.
JEON IL LEE, SERYEUN YANG, HYERAN LEE
Filed: 7 Apr 23
Utility
Semiconductor Package
11 Jan 24
A semiconductor package includes a flexible base film, a semiconductor chip on a first surface of the base film, and a heat radiating member on a second surface of the base film.
YECHUNG CHUNG, WOONBAE KIM
Filed: 28 Feb 23
Utility
Operating Method of Communication Device and Signal Processor Included In the Communication Device
11 Jan 24
An operating method of a communication device includes storing a first part of a synchronization signal received from a cell as a first signal sample in first and second consecutive synchronization signal periods, determining a synchronization signal-reference signal received power (SS-RSRP) estimation candidate within the first and second consecutive synchronization signal periods based on the first signal sample, and performing an SS-RSRP estimation operation on the SS-RSRP estimation candidate.
Hae Chul LEE
Filed: 25 Sep 23
Utility
Semiconductor Package and Method of Fabricating the Same
11 Jan 24
A semiconductor package includes: a substrate; a first semiconductor chip disposed on the substrate, wherein the first semiconductor chip includes first and second surfaces, which are opposite to each other, and has first and second trenches formed on the first surface thereof, wherein the first and second trenches extend in first and second directions, respectively, wherein the first and second direction intersect each other; and a second semiconductor chip disposed on the first semiconductor chip and in a region between the first and second trenches.
Hyun Su KIM
Filed: 8 May 23
Utility
Integrated Circuit Device and Method of Manufacturing the Same
11 Jan 24
A method of manufacturing an integrated circuit device may include forming a plurality of lower electrodes above a substrate, forming a supporter configured to support the plurality of lower electrodes, forming a dielectric film on the plurality of lower electrodes and the supporter, and forming an upper electrode on the dielectric film.
Kyooho JUNG, Jongyeong MIN, Jiye BAEK, Yeseul LEE, Jinwook LEE, Changhwa JUNG
Filed: 12 Jun 23
Utility
Semiconductor Package
11 Jan 24
A semiconductor package includes a redistribution substrate having a first side and an opposite second side, a semiconductor chip on the first side of the redistribution substrate, a silicon capacitor on the second side of the redistribution substrate, a plurality of solder balls on the second side of the redistribution substrate and adjacent the silicon capacitor, and a metal pattern in the redistribution substrate and positioned between the silicon capacitor and the solder balls.
Jong Youn KIM, Eung Kyu KIM, Min Jun BAE, Hyeon Seok LEE, Seok Kyu CHOI
Filed: 4 May 23
Utility
Three-dimensional Ferroelectric Memory Device
11 Jan 24
A three-dimensional (3D) ferroelectric memory device may include a plurality of gate electrodes stacked on a substrate, a plurality of ferroelectric layers in contact with the plurality of gate electrodes, a plurality of intermediate electrodes in contact with the plurality of ferroelectric layers, a gate insulating layer in contact with the plurality of intermediate electrodes, and a channel layer in contact with the gate insulating layer.
Jinseong HEO, Taehwan MOON, Seunggeol NAM, Hyunjae LEE
Filed: 23 Jun 23
Utility
Semiconductor Package and Method for Fabricating the Same
11 Jan 24
A semiconductor package includes a redistribution substrate.
Young Kun JEE, Un-Byoung KANG, Jum Yong PARK, Jong-Hyeon CHANG
Filed: 3 Jul 23
Utility
Electronic Device and Method for Controlling the Same
11 Jan 24
An electronic device and method thereof.
Sanghyuk PARK, Kiyong LEE, Chaekyu LEE
Filed: 28 Apr 23
Utility
Method of Determining End Point Detection Time and Electronic Device for Performing the Method
11 Jan 24
A method of determining an End Point Detection (EPD) time and an electronic device for performing the method are provided.
Myeungyong CHOI, Sungjae PARK, Hyuk OH, Seungbeom RYU, Junkwon CHOI
Filed: 1 Aug 23
Utility
Cooking Device
11 Jan 24
A cooking device including a main body forming a cooking chamber and including a front plate having at least one first hole; a hood coupled to a lower portion of the main body; a fan and a door to open and close the cooking chamber, and including a rear panel having at least one second hole.
Geunyong PARK, Keunseuk OH, Youseop LEE, Sangjin JEONG, Pungyeun CHO
Filed: 26 Sep 23
Utility
Sensor Module and Substrate Processing Apparatus Using the Same
11 Jan 24
A sensor module includes a body including a first body part and a second body part detachably coupled to the first body part, a first sensor unit on a lower surface of the body, and configured to detect a contact area in which the lower surface of the body contacts a first external object and to output a first measurement value, a second sensor unit on a side surface of the body and configured to output a second measurement value by measuring a distance between the side surface of the body and a second external object, and a control circuit in the body part configured to control the first sensor unit and the second sensor unit and generate measurement data based on the first measurement value and the second measurement value.
Daejung Kim, Minyoung Kang, Sungsoo Kim, Sohee Kim, Yongsoo Yoo, Jihyeon Ha
Filed: 31 Jan 23
Utility
Integrated Circuit Device and Method of Manufacturing the Same
11 Jan 24
A method of manufacturing an integrated circuit device includes forming a plurality of lower electrodes above a substrate, forming a dielectric film on the plurality of lower electrodes, forming a doped upper interface film on the dielectric film, and forming an upper electrode on the doped upper interface film, wherein the doped upper interface film includes a dopant, and the dopant includes one selected from tin (Sn), molybdenum (Mo), niobium (Nb), tantalum (Ta), and aluminum (Al).
Kyooho JUNG, Wonsik CHOI
Filed: 7 Jul 23
Utility
Semiconductor Package Including Interposors and Electronic System
11 Jan 24
An electronic system includes a first interposer including first signal paths, a second interposer spaced apart from the first interposer and including second signal paths, a first semiconductor chip structure on the first and second interposers and including a first circuit region and a second circuit region, and a second semiconductor chip structure on the first and second interposers and spaced apart from the first semiconductor chip structure.
Kiwon Baek
Filed: 5 Jul 23
Utility
Semiconductor Device and Data Storage System Including the Same
11 Jan 24
A semiconductor device includes a pattern structure; a stack structure including gate layers stacked in a first region on the pattern structure and extending into a second region; a memory vertical structure penetrating the stack structure in the first region; gate contact plugs electrically connected to the gate layers in the second region; and a first peripheral contact plug spaced apart from the gate layers, the gate layers including a first gate layer, the gate contact plugs including a first gate contact plug electrically connected to the first gate layer, side surfaces of the first gate contact plug and the first peripheral contact plug having different numbers of upper bending portions, and the number of upper bending portions of the side surface of the first gate contact plug being greater than the number of upper bending portions of the side surface of the first peripheral contact plug.
Seungyoon Kim, Jeongyong Sung, Sanghun Chun, Jihwan Kim, Sunghee Chung, Jeehoon Han
Filed: 21 Sep 23
Utility
Nonvolatile Memory Device, System Including the Same and Method of Fabricating the Same
11 Jan 24
A nonvolatile memory device including a substrate extending in a first direction, a ground selection line extending in the first direction on the substrate, a plurality of word lines stacked sequentially on the ground selection line and extending in the first direction, a landing pad spaced apart from the ground selection line and the plurality of word lines in the first direction, a rear contact plug connected to a lower face of the landing pad and extending in a second direction intersecting the first direction, a front contact plug connected to an upper face of the landing pad opposite the lower face and extending in the second direction, an input/output pad electrically connected to the rear contact plug, and an upper bonding pad electrically connected to the front contact plug and connected to at least a part of a plurality of circuit elements of the nonvolatile memory device.
Jae Ho Ahn, Ji Won Kim, Sung-Min Hwang, Joon-Sung Lim, Suk Kang Sung
Filed: 7 Jul 23