20 patents
Utility
Apparatus and method for die stack flux removal
12 Sep 23
A system for removing flux from openings formed in a substrate that has openings (e.g., sized 20 microns or less) formed therein includes a spay nozzle device that has a spray nozzle arm that is formed at an angle of about 45 degrees or less for discharging fluid towards the openings in the substrate for flux removal.
John Taddei, Kenji Nulman, Jonathan Fijal, Phillip Tyler, Ian Rafter
Filed: 10 Dec 20
Utility
Enhanced cathodic ARC source for ARC plasma deposition
11 Oct 22
An improved cathodic arc source and method of DLC film deposition with a carbon containing directional-jet plasma flow produced inside of cylindrical graphite cavity with depth of the cavity approximately equal to the cathode diameter.
Boris L. Druz, Viktor Kanarov, Yuriy N. Yevtukhov, Sandeep Kohli, Xingjie Fang
Filed: 19 Aug 20
Utility
High pressure spray head
23 Aug 22
A device for spraying substrates comprises a longitudinal extending fluid dispensing head coupled to a supply of fluid and including a perpendicularly extending flange, a spacer having first and second ends, the first end of the spacer coupled to the extending flange of the dispensing head, a nozzle adapted to eject fluid coupled to the second end of the spacer, and a locking nut enclosing the spacer and securely the dispensing head, spacer and nozzle.
Steven Honigman, Kenji Nulman
Filed: 7 Jun 19
Utility
High-efficiency line-forming optical systems and methods using a serrated spatial filter
16 Aug 22
High-efficiency line-forming optical systems and methods that employ a serrated aperture are disclosed.
Serguei Anikitchev
Filed: 15 Jul 19
Utility
Melt detection systems and methods of using the same
16 Aug 22
High bandwidth time-and-space resolved phase transition microscopy systems configured to detect melt onset in a wafer being processed by laser annealing systems with ultra-short dwell times and spot size.
Matthew Earl Wallace Reed
Filed: 30 Jun 20
Utility
Semiconductor wafer processing chamber
24 May 22
A housing of a wafer processing system includes at least one chamber exhaust outlet and at least one chemical exhaust outlet.
William Gilbert Breingan, Chris Hofmeister, Lev Rapoport, John Taddei
Filed: 23 Apr 18
Utility
Wafer carrier having retention pockets with compound radii for chemical vapor deposition systems
15 Feb 22
A wafer carrier for use in a chemical vapor deposition (CVD) system includes a plurality of wafer retention pockets, each having a peripheral wall surface surrounding a floor surface and defining a periphery of that wafer retention pocket.
Sandeep Krishnan, Lukas Urban
Filed: 30 Nov 18
Utility
System and method for self-cleaning wet treatment process
25 Jan 22
An apparatus for supporting and maneuvering a wafer comprises a handle having a gas inlet adapted to couple to a gas supply, a supporting surface coupled to the handle section including a frame structure having edge segments connecting at vertices and spoke elements extending from a center of the frame structure to the vertices, a gas supply channel coupled to the gas inlet that extends from the handle and branches into channels that run through the spoke elements, and a plurality of nozzles positioned at the vertices on the supporting surface and coupled to the channels in the spoke elements.
Kenji Michael Nulman, Mark Yannuzzi, Phillip Tyler, Jonathan Fijal, William Gilbert Breingan, John Taddei, Nicholas Baverov, James Swallow, Christopher Orlando, Paul Vit, Christopher Hofmeister, Tremayne Diggs
Filed: 19 Jun 19
Utility
Apparatus and method for the minimization of undercut during a UBM etch process
20 Jul 21
A plurality of endpoints in a wet etching process of a substrate are determined.
John Taddei, David A. Goldberg, Elena Lawrence, Ian Cochran, Christopher Orlando, James Swallow, William Gilbert Breingan
Filed: 15 Nov 19
Utility
Apparatus and method for the minimization of undercut during a UBM etch process
11 May 21
A semiconductor etch process is provided in which an undercut is minimized during an etch process through tight control of etch profile, recognition of etch completion, and minimization of over etch time to increase productivity.
John Taddei, David A. Goldberg, Elena Lawrence, Ian Cochran, Christopher Orlando, James Swallow
Filed: 20 Jun 19
Utility
Laser annealing systems and methods with ultra-short dwell times
23 Nov 20
Laser annealing systems and methods with ultra-short dwell times are disclosed.
Andrew M. Hawryluk, Serguei Anikitchev
Filed: 20 Aug 18
Utility
Chuck systems and methods having enhanced electrical isolation for substrate-biased ALD
23 Nov 20
A chuck system for performing a substrate-biased atomic layer deposition process that forms an electrically conductive film on a substrate includes an electrically conductive substrate holder configured to support the substrate and an electrically conductive base that supports the substrate holder.
Michael J. Sershen, Adam Bertuch
Filed: 22 Jan 18
Utility
Rotating disk reactor with ferrofluid seal for chemical vapor deposition
20 Jul 20
A rotating disk reactor for chemical vapor deposition includes a vacuum chamber and a ferrofluid feedthrough comprising an upper and a lower ferrofluid seal that passes a motor shaft into the vacuum chamber.
Louise S. Barriss, Richard A. Comunale, Roger P. Fremgen, Alexander I. Gurary, Todd A. Luse, Robert White Milgate, John D. Pollock
Filed: 15 Dec 16
Utility
Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle
6 Jul 20
The wafer processing system includes a rotatable wafer support member for supporting a wafer and a plurality of collections trays disposed about a peripheral edge of the wafer support member.
William Gilbert Breingan, Chris Hofmeister, John Taddei
Filed: 24 Apr 17
Utility
Laser-assisted atomic layer deposition of 2D metal chalcogenide films
8 Jun 20
Methods of forming 2D metal chalcogenide films using laser-assisted atomic layer deposition are disclosed.
Ganesh Sundaram
Filed: 28 Mar 18
Utility
Laser-based systems and methods for melt-processing of metal layers in semiconductor manufacturing
25 May 20
Methods disclosed herein include scanning a focus spot formed by a laser beam over either a metal layer or IC structures that include a metal and a non-metal.
Serguei Anikitchev, Andrew M. Hawryluk
Filed: 16 Jul 18
Utility
Periphery purge shutter and flow control systems and methods
24 Feb 20
An arrangement of two shutters radially outward from an injector block and a susceptor onto which a wafer carrier is removably mounted are configured to provide a flowpath through a reactor chamber that does not exhibit a vortex, thereby reducing or eliminating buildup on the inside of the reactor chamber and facilitating large temperature gradient between the injector block and the wafer carrier.
Bojan Mitrovic, Eric Armour, Ian Kunsch
Filed: 1 Mar 17
Utility
Gas concentration sensors and systems
24 Feb 20
A chemical vapor deposition or atomic layer deposition system includes a gas concentration sensor for determining the quantity of precursor gases admitted thereto.
Chi-Jung Cheng, Leo Chin, Christopher J. Morath, Arindam Sinharoy, Raymond C. Logue
Filed: 9 Mar 17
Utility
Filter element for wafer processing assembly
23 Dec 19
Filter elements for gaseous fluid (e.g., air) filtration for wafer processing systems.
Maria Ferreira, Joseph Lamb, Ankit Modi, David Gant
Filed: 25 Sep 17
Utility
Self-centering wafer carrier system for chemical vapor deposition
7 Oct 19
A self-centering wafer carrier system for a chemical vapor deposition (CVD) reactor includes a wafer carrier comprising an edge.
Sandeep Krishnan, Alexander I. Gurary, Chenghung Paul Chang, Earl Marcelo
Filed: 9 Jun 16
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