39 patents
Utility
Methods of Separating Good Probe Structures from Defective Probe Structures In an Electrochemical Fabrication System
18 Jan 24
Electronic test probes formed in a batch have a plurality of multi-material layers wherein at least one of the materials is a sacrificial material and at least one other material is a structural material.
Duy P. Le, Rulon J. Larsen, Jeffrey A. Thompson, Uri Frodis, Dale S. McPherson, Kleun Kim, Mahmood Samiee, Nina C. Levy, Dennis R. Smalley
Filed: 14 Apr 23
Utility
Buckling Beam Probe Arrays and Methods for Making Such Arrays Including Forming Probes with Lateral Positions Matching Guide Plate Hole Positions
18 Jan 24
Forming buckling beam probe arrays having MEMS probes engaged with guide plates during formation or after formation of the probes while the probes are held in the array configuration in which they were formed is disclosed.
MIchael S. Lockard, Stefano Felici, Uri Frodis, Dennis R. Smalley
Filed: 18 Sep 23
Utility
Probes with multiple springs, methods for making, and methods for using
9 Jan 24
Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays.
Ming Ting Wu, Garret R. Smalley, Dennis R. Smalley
Filed: 31 Dec 20
Utility
Method of In Situ Modulation of Structural Material Properties And/or Template Shape
21 Dec 23
Probe structures, probe arrays, have varying intrinsic material properties along their lengths.
Onnik Yaglioglu
Filed: 18 Aug 23
Utility
Vertical probe arrays and improved methods for making using temporary or permanent alignment structures for setting or maintaining probe-to-probe relationships
28 Nov 23
Probe arrays include spacers attached to the probes that were formed along with the probes.
Michael S. Lockard, Uri Frodis, Dennis R. Smalley
Filed: 13 May 21
Utility
Buckling beam probe arrays and methods for making such arrays including forming probes with lateral positions matching guide plate hole positions
21 Nov 23
Embodiments are directed to the formation of buckling beam probe arrays having MEMS probes that are engaged with guide plates during formation or after formation of the probes while the probes are held in the array configuration in which they were formed.
Michael S. Lockard, Stefano Felici, Uri Frodis, Dennis R. Smalley
Filed: 26 Apr 21
Utility
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
9 Nov 23
Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention configuration.
Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
Filed: 4 Apr 23
Utility
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
2 Nov 23
Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention configuration.
Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
Filed: 4 Apr 23
Utility
Compliant pin probes with multiple spring segments and compression spring deflection stabilization structures, methods for making, and methods for using
31 Oct 23
Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays.
Ming Ting Wu
Filed: 31 Dec 20
Utility
Pin-Type Probes for Contacting Electronic Circuits and Methods for Making Such Probes
12 Oct 23
Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components.
Arun S. Veeramani, Ming Ting Wu, Uri Frodis, Heath A. Jensen
Filed: 12 Apr 23
Utility
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
5 Oct 23
A method of forming a probe, comprises providing a first and a second probe modules, having respective compliant element functionally joining respective probes arm that directly or indirectly holds a first and a second tips and forming the probe by laterally and longitudinally aligning the first and second probe modules with their respective tips pointing away from each other.
Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
Filed: 4 Apr 23
Utility
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
5 Oct 23
Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and a dual array plate mounting and retention configuration.
Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
Filed: 4 Apr 23
Utility
Method of in situ modulation of structural material properties and/or template shape
3 Oct 23
Probe structures, probe arrays, have varying intrinsic material properties along their lengths.
Onnik Yaglioglu
Filed: 1 Sep 21
Utility
Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
26 Sep 23
Embodiments are directed to probes formed from multiple layers with at least a portion of the layers including portions that include elastic compliant regions of the probes wherein such elastic portions of different layers are formed of different materials and wherein a plane of preferred elastic deformation of the probes is parallel to a plane containing (1) a normal to the planes of the layers and (2) a longitudinal axes of the probes or a local longitudinal axes of the probes.
Ming Ting Wu
Filed: 22 Apr 22
Utility
Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
19 Sep 23
Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased).
Arun S. Veeramani
Filed: 31 Dec 20
Utility
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
3 Aug 23
Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and a dual array plate mounting and retention configuration.
Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
Filed: 4 Apr 23
Utility
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
3 Aug 23
Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention configuration.
Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
Filed: 4 Apr 23
Utility
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
3 Aug 23
Probe for making contact between two electronic circuit elements comprises a feature selected from the group consisting of: (A) at least one first tip and second tip arm supporting a shunting element that makes an electrical connection to at least one standoff while shunting current flow away from a spring element of the probe that joins a respective standoff and supports the respective tip arm, and (B) both of the first tip arm and the second tip arm support a respective shunting element that makes an electrical connection to the at least one respective standoff while shunting current flow away from a respective spring element that joins the respective standoff and supports the respective tip arm.
Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
Filed: 4 Apr 23
Utility
Pin-Type Probes for Contacting Electronic Circuits and Methods for Making Such Probes
29 Jun 23
Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components.
Richard T. Chen, Ezekiel J. J. Kruglick, Vacit Arat, Daniel I. Feinberg
Filed: 16 Dec 20
Utility
Methods of Forming Parts Using Laser Machining
29 Jun 23
Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting.
Arun S. Veeramani, Heath A. Jensen, Uri Frodis, Christopher G. Wiita, Michael S. Lockard, Irina Boguslavsky, Pavel Lembrikov, Dennis R. Smalley, Richard T. Chen
Filed: 18 Apr 22