21 patents
Utility
Probes with multiple springs, methods for making, and methods for using
9 Jan 24
Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays.
Ming Ting Wu, Garret R. Smalley, Dennis R. Smalley
Filed: 31 Dec 20
Utility
Vertical probe arrays and improved methods for making using temporary or permanent alignment structures for setting or maintaining probe-to-probe relationships
28 Nov 23
Probe arrays include spacers attached to the probes that were formed along with the probes.
Michael S. Lockard, Uri Frodis, Dennis R. Smalley
Filed: 13 May 21
Utility
Buckling beam probe arrays and methods for making such arrays including forming probes with lateral positions matching guide plate hole positions
21 Nov 23
Embodiments are directed to the formation of buckling beam probe arrays having MEMS probes that are engaged with guide plates during formation or after formation of the probes while the probes are held in the array configuration in which they were formed.
Michael S. Lockard, Stefano Felici, Uri Frodis, Dennis R. Smalley
Filed: 26 Apr 21
Utility
Compliant pin probes with multiple spring segments and compression spring deflection stabilization structures, methods for making, and methods for using
31 Oct 23
Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays.
Ming Ting Wu
Filed: 31 Dec 20
Utility
Method of in situ modulation of structural material properties and/or template shape
3 Oct 23
Probe structures, probe arrays, have varying intrinsic material properties along their lengths.
Onnik Yaglioglu
Filed: 1 Sep 21
Utility
Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
26 Sep 23
Embodiments are directed to probes formed from multiple layers with at least a portion of the layers including portions that include elastic compliant regions of the probes wherein such elastic portions of different layers are formed of different materials and wherein a plane of preferred elastic deformation of the probes is parallel to a plane containing (1) a normal to the planes of the layers and (2) a longitudinal axes of the probes or a local longitudinal axes of the probes.
Ming Ting Wu
Filed: 22 Apr 22
Utility
Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
19 Sep 23
Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased).
Arun S. Veeramani
Filed: 31 Dec 20
Utility
Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
27 Sep 22
Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers.
Richard T. Chen, Will J. Tan
Filed: 11 Feb 21
Utility
Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
1 Mar 22
Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g., probe structures for making contact between two electronic components for example in semiconductor wafer, chip, and electronic component test applications).
Garret R. Smalley
Filed: 26 Sep 19
Utility
Neutral radical etching of dielectric sacrificial material from reentrant multi-layer metal structures
28 Dec 21
Embodiments are directed to forming reentrant multi-layer micro-scale or millimeter scale three dimensional structures, parts, components, or devices where each layer is formed from a plurality of deposited materials and more specifically where each layer is formed from at least one metal structural material and at least one organic sacrificial material (e.g. polymer) that are co-planarized and a portion of the sacrificial material located on a plurality of layers is removed after formation of the plurality of layers via one or more plasma etching operations or one or more neutral radical etching operations.
Rulon J. Larsen, III, Adam L. Cohen
Filed: 10 Apr 19
Utility
Miniature RF and microwave components and methods for fabricating such components
12 Oct 21
RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components.
Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Morton Grosser
Filed: 11 Dec 19
Utility
Fuel injector systems, fuel injectors, fuel injector nozzles, and methods for making fuel injector nozzles
30 Mar 21
Embodiments are directed to fuel injectors for internal combustion engines (e.g. engines with reciprocating pistons and with compression-ignition or spark-ignition, Wankel engines, turbines, jets, rockets, and the like) and more particularly to improved nozzle configurations for use as part of such fuel injectors.
Gregory P. Schmitz, Ming Ting Wu, Uri Frodis, Eli Baldwin, Gabriel Jacobsohn
Filed: 26 Aug 19
Utility
Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
23 Mar 21
Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers.
Richard T. Chen, Will J. Tan
Filed: 3 Apr 20
Utility
Miniature shredding tools for use in medical applications, methods for making, and procedures for using
9 Mar 21
The present disclosure relates generally to the field of tissue removal and more particularly to methods and devices for use in medical applications involving selective tissue removal.
Michael S. Lockard, Uri Frodis, Adam L. Cohen, Richard T. Chen, Gregory P. Schmitz, Eric C. Miller, Ming Ting Wu, Arun S. Veeramani, Juan Diego Perea
Filed: 28 Sep 17
Utility
Pin-type probes for contacting electronic circuits and methods for making such probes
28 Dec 20
Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components.
Richard T. Chen, Ezekiel J. J. Kruglick, Vacit Arat, Daniel I. Feinberg
Filed: 25 Oct 18
Utility
Tissue scaffolding devices, methods of using, and methods of making
19 Oct 20
Embodiments of the present invention are directed to microscale and millimeter scale tissue scaffolding structures that may be static or expandable and which may be formed of biocompatible metals or other materials that may be coated to become biocompatible.
Richard T. Chen, Eric C. Miller
Filed: 10 Jul 17
Utility
Counterfeiting deterrent and security devices, systems, and methods
12 Oct 20
A counterfeiting deterrent device according to one implementation of the disclosure includes a plurality of layers formed by an additive process.
Gregory P. Schmitz, Michael S. Lockard, Ming-Ting Wu, Eric C. Miller, Adam L. Cohen
Filed: 6 Nov 18
Utility
Cantilever microprobes for contacting electronic components
28 Sep 20
Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like.
Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
Filed: 1 Apr 19
Utility
Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
8 Jun 20
Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates.
Adam L. Cohen, Michael S. Lockard, Kieun Kim, Qui T. Le, Gang Zhang, Uri Frodis, Dale S. McPherson, Dennis R. Smalley
Filed: 29 Aug 18
Utility
Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
25 May 20
Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers.
Richard T. Chen, Will J. Tan
Filed: 1 Apr 19