18 patents
Utility
Methods of Separating Good Probe Structures from Defective Probe Structures In an Electrochemical Fabrication System
18 Jan 24
Electronic test probes formed in a batch have a plurality of multi-material layers wherein at least one of the materials is a sacrificial material and at least one other material is a structural material.
Duy P. Le, Rulon J. Larsen, Jeffrey A. Thompson, Uri Frodis, Dale S. McPherson, Kleun Kim, Mahmood Samiee, Nina C. Levy, Dennis R. Smalley
Filed: 14 Apr 23
Utility
Buckling Beam Probe Arrays and Methods for Making Such Arrays Including Forming Probes with Lateral Positions Matching Guide Plate Hole Positions
18 Jan 24
Forming buckling beam probe arrays having MEMS probes engaged with guide plates during formation or after formation of the probes while the probes are held in the array configuration in which they were formed is disclosed.
MIchael S. Lockard, Stefano Felici, Uri Frodis, Dennis R. Smalley
Filed: 18 Sep 23
Utility
Method of In Situ Modulation of Structural Material Properties And/or Template Shape
21 Dec 23
Probe structures, probe arrays, have varying intrinsic material properties along their lengths.
Onnik Yaglioglu
Filed: 18 Aug 23
Utility
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
9 Nov 23
Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention configuration.
Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
Filed: 4 Apr 23
Utility
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
2 Nov 23
Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention configuration.
Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
Filed: 4 Apr 23
Utility
Pin-Type Probes for Contacting Electronic Circuits and Methods for Making Such Probes
12 Oct 23
Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components.
Arun S. Veeramani, Ming Ting Wu, Uri Frodis, Heath A. Jensen
Filed: 12 Apr 23
Utility
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
5 Oct 23
A method of forming a probe, comprises providing a first and a second probe modules, having respective compliant element functionally joining respective probes arm that directly or indirectly holds a first and a second tips and forming the probe by laterally and longitudinally aligning the first and second probe modules with their respective tips pointing away from each other.
Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
Filed: 4 Apr 23
Utility
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
5 Oct 23
Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and a dual array plate mounting and retention configuration.
Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
Filed: 4 Apr 23
Utility
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
3 Aug 23
Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and a dual array plate mounting and retention configuration.
Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
Filed: 4 Apr 23
Utility
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
3 Aug 23
Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention configuration.
Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
Filed: 4 Apr 23
Utility
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
3 Aug 23
Probe for making contact between two electronic circuit elements comprises a feature selected from the group consisting of: (A) at least one first tip and second tip arm supporting a shunting element that makes an electrical connection to at least one standoff while shunting current flow away from a spring element of the probe that joins a respective standoff and supports the respective tip arm, and (B) both of the first tip arm and the second tip arm support a respective shunting element that makes an electrical connection to the at least one respective standoff while shunting current flow away from a respective spring element that joins the respective standoff and supports the respective tip arm.
Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
Filed: 4 Apr 23
Utility
Pin-Type Probes for Contacting Electronic Circuits and Methods for Making Such Probes
29 Jun 23
Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components.
Richard T. Chen, Ezekiel J. J. Kruglick, Vacit Arat, Daniel I. Feinberg
Filed: 16 Dec 20
Utility
Methods of Forming Parts Using Laser Machining
29 Jun 23
Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting.
Arun S. Veeramani, Heath A. Jensen, Uri Frodis, Christopher G. Wiita, Michael S. Lockard, Irina Boguslavsky, Pavel Lembrikov, Dennis R. Smalley, Richard T. Chen
Filed: 18 Apr 22
Utility
Micro Heat Transfer Arrays, Micro Cold Plates, and Thermal Management Systems for Semiconductor Devices, and Methods for Using and Making Such Arrays, Plates, and Systems
29 Jun 23
Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers.
Onnik Yaglioglu, Richard T. Chen, Will J. Tan, Jia Li, Uri Frodis, Nina C. Levy, Dennis R. Smalley
Filed: 18 Mar 22
Utility
Counterfeiting Deterrent and Security Devices, Systems, and Methods
10 Jun 21
A counterfeiting deterrent device according to one implementation of the disclosure includes a plurality of layers formed by an additive process.
Gregory P. Schmitz, Michael S. Lockard, Ming-Ting Wu, Eric C. Miller, Adam L. Cohen
Filed: 13 Oct 20
Utility
Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates
11 Nov 20
Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates.
Adam L. Cohen, Michael S. Lockard, Kieun Kim, Qui T. Le, Gang Zhang, Uri Frodis, Dale S. McPherson, Dennis R. Smalley
Filed: 27 Apr 20
Utility
Micro Heat Transfer Arrays, Micro Cold Plates, and Thermal Management Systems for Cooling Semiconductor Devices, and Methods for Using and Making Such Arrays, Plates, and Systems
21 Oct 20
Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers.
Richard T. Chen, Will J. Tan
Filed: 2 Apr 20
Utility
Miniature RF and Microwave Components and Methods for Fabricating Such Components
15 Jul 20
RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components.
Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Morton Grosser
Filed: 10 Dec 19
- Prev
- 1
- Next
Patents are sorted by USPTO publication date, most recent first