55 patents
Utility
Compositions and methods for the electrodeposition of nanotwinned copper
16 Jan 24
A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl.
Kyle M. Whitten, Stephan I. Braye, Jianwen Han, Pingping Ye, Thomas B. Richardson, Elie H. Najjar
Filed: 7 Jun 22
Utility
Method and wet chemical compositions for diffusion barrier formation
19 Dec 23
A method of forming a diffusion barrier layer on a dielectric or semiconductor substrate by a wet process.
Richard W. Hurtubise, Eric Yakobson, Shaopeng Sun, Taylor L. Wilkins, Elie H. Najjar, Wenbo Shao
Filed: 7 Feb 22
Utility
Solder material and method for die attachment
12 Dec 23
A solder material comprising a solder alloy and a thermal conductivity modifying component.
Angelo Gulino, Bogdan Bankiewicz, Oscar Khaselev, Anna Lifton, Michael T. Marczi, Girard Sidone, Paul Salerno, Paul J. Koep
Filed: 11 May 18
Utility
Stretchable interconnects for flexible electronic surfaces
28 Nov 23
A conductive paste and method of manufacturing thereof.
Narahari Pujari, Bawa Singh, Ravi Bhatkal, Siuli Sarkar, Anubhav Rustogi
Filed: 22 Jul 21
Utility
Cobalt chemistry for smooth topology
7 Nov 23
An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate.
Shaopeng Sun, Kyle Whitten, Stephan Braye, Elie Najjar
Filed: 11 Nov 21
Utility
Single step electrolytic method of filling through holes in printed circuit boards and other substrates
5 Sep 23
A method of copper electroplating in the manufacture of printed circuit boards.
Donald Desalvo, Ron Blake, Carmichael Gugliotti, William J. Decesare, Richard Bellemare
Filed: 5 Nov 19
Utility
High reliability lead-free solder alloy for electronic applications in extreme environments
22 Aug 23
A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony.
Md Hasnine, Lik Wai Kho
Filed: 28 Jun 18
Utility
Cost-effective lead-free solder alloy for electronic applications
15 Aug 23
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony.
Md Hasnine, Lik Wai Kho
Filed: 31 Aug 21
Utility
Copper deposition in wafer level packaging of integrated circuits
11 Jul 23
An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor; and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin).
Thomas Richardson, Kyle Whitten, Vincent Paneccasio, Jr., John Commander, Richard Hurtubise
Filed: 12 Aug 21
Utility
Methods for attachment and devices produced using the methods
11 Jul 23
Methods for attachment and devices produced using such methods are disclosed.
Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
Filed: 20 Jan 21
Utility
Encoding signals on flexographic printing plates to enable tracking and management
4 Jul 23
The present disclosure relates generally to signal encoding for flexographic printing plates.
Jay Kelly Sperry, Ryan W. Vest
Filed: 30 Jul 21
Utility
Silver/tin electroplating bath and method of using the same
9 May 23
An electroplating bath for depositing a silver/tin alloy on a substrate.
Fengting Xu, Jean W. Chevalier, Ernest Long, Richard A. Bellemare, Michael M. Ryl
Filed: 2 Feb 22
Utility
Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures
11 Apr 23
This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS).
Nirmalya Kumar Chaki, Chetan Pravinchandra Shah, Barun Das, Supriya Devarajan, Siuli Sarkar, Rahul Raut, Bawa Singh, Anubhav Rustogi, Anna Jane Harris, Keith Paul Parsons, Jeffrey William Braham
Filed: 22 May 18
Utility
Method and system for thermal processing of flexo printing elements
11 Apr 23
The present disclosure is directed to a system and method configured for curing non-reactive photopolymer collected by an absorbent blotting material during thermal processing of flexographic printing elements.
Ryan W. Vest, Gary T. Markhart
Filed: 31 Aug 21
Utility
Low-silver alternative to standard SAC alloys for high reliability applications
14 Feb 23
A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, and antimony.
Md Hasnine, Lik Wai Kho
Filed: 28 Jun 18
Utility
Multicorrosion protection system for decorative parts with chrome finish
31 Jan 23
The invention relates to a corrosion protection layer system for metal surfaces, said layer system comprising as the two top most layers: a) a discontinuous nickel-phosphorus layer and b) a chromium layer plated from a trivalent chromium electrolyte solution, as well as to a method of producing such a layer system.
Andreas Konigshofen, Ronny Kiefer
Filed: 6 Nov 20
Utility
Method of making a film negative
6 Sep 22
A method of preparing a film negative including the steps of dispersing a UV ink in a desired pattern on a UV printing substrate; and curing the UV ink with a source of actinic radiation to crosslink and cure the UV ink and create the UV printed polymer layer in the desired pattern.
John Maneira
Filed: 4 May 21
Utility
Cobalt filling of interconnects in microelectronics
6 Sep 22
Processes and compositions for electroplating a cobalt deposit onto a semiconductor base structure comprising sub-micron-sized electrical interconnect features.
John Commander, Vincent Paneccasio, Jr., Eric Rouya, Kyle Whitten, Shaopeng Sun, Jianwen Han
Filed: 1 Apr 21
Utility
Advanced solder alloys for electronic interconnects
9 Aug 22
Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces.
Morgana de Avila Ribas, Pritha Choudhury, Siuli Sarkar, Ranjit Pandher, Nicholas G Herrick, Amit Patel, Ravindra M Bhatkal, Bawa Singh
Filed: 25 Jan 19
Utility
Cobalt filling of interconnects
2 Aug 22
Compositions and methods of using such compositions for electroplating cobalt onto semiconductor base structures comprising submicron-sized electrical interconnect features are provided herein.
John Commander, Kyle Whitten, Vincent Paneccasio, Jr., Shaopeng Sun, Eric Yakobson, Jianwen Han, Elie Najjar
Filed: 5 Apr 21