55 patents
Page 2 of 3
Utility
Sintering materials and attachment methods using same
19 Jul 22
Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die.
Shamik Ghoshal, V. Sathish Kumar, Pavan Vishwanath, Ranjit S. Pandher, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Bawa Singh, Ravindra Mohan Bhatkal
Filed: 12 Jun 15
Utility
Composite and multilayered silver films for joining electrical and mechanical components
19 Jul 22
A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles.
Oscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
Filed: 13 Jul 20
Utility
Compositions and methods for the electrodeposition of nanotwinned copper
12 Jul 22
A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl.
Kyle M. Whitten, Stephan I. Braye, Jianwen Han, Pingping Ye, Thomas B. Richardson, Elie H. Najjar
Filed: 28 Aug 20
Utility
System for thermal development of flexographic printing plates
10 May 22
The present disclosure is directed to a thermal developing assembly that is configured to reduce (or eliminate) the reactivity of contaminants and/or unreacted photosensitive material associated with forming a relief image on a photosensitive printing element during thermal development.
Gary T. Markhart, Ryan W. Vest
Filed: 27 Jul 20
Utility
Soldering material based on Sn Ag and Cu
29 Mar 22
The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper).
Hans-Jurgen Albrecht, Gunnar Petzold, Klaus Wilke, Klaus Heinrich Georg Bartl, Hector Andrew Hamilton Steen, Klaus Muller, Werner Kruppa, Mathias Nowottnick, Klaus Wittke
Filed: 2 Aug 19
Utility
Method for die and clip attachment
29 Mar 22
A method of die and clip attachment includes providing a clip, a die and a substrate, laminating a sinterable silver film on the clip and the die, depositing a tack agent on the substrate, placing the die on the substrate, placing the clip on the die and the substrate to create a substrate, die and clip package, and sintering the substrate, die and clip package.
Oscar Khaselev, Eef Boschman
Filed: 16 Dec 15
Utility
Silver/tin electroplating bath and method of using the same
22 Mar 22
An electroplating bath for depositing a silver/tin alloy on a substrate.
Fengting Xu, Jean W. Chevalier, Ernest Long, Richard A. Bellemare, Michael M. Ryl
Filed: 5 Jun 20
Utility
Cobalt chemistry for smooth topology
25 Jan 22
An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate.
Shaopeng Sun, Kyle Whitten, Stephan Braye, Elie Najjar
Filed: 13 Dec 19
Utility
Dielectric ink composition
7 Dec 21
The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed.
Narahari Pujari, Jayaprakash Sundaramurthy, Siuli Sarkar, Ravindra M. Bhatkal
Filed: 14 May 18
Utility
Chromium-free plating-on-plastic etch
16 Nov 21
The present invention relates to a chrome free etch for plating on plastic processes, wherein plastic surfaces are contacted in a first etching step with an etching solution at least comprising Mn(IV)-ions and, in a second etching step, with a solution at least comprising Mn(III)- and Mn(VII)-ions prior to the metal plating step.
Frank Noffke, Christoph Werner, Andreas Königshofen
Filed: 22 Nov 17
Utility
Leveler compositions for use in copper deposition in manufacture of microelectronics
9 Nov 21
Vincent Paneccasio, Kyle Whitten, Thomas B. Richardson, Ivan Li
Filed: 4 Nov 19
Utility
Sintering paste
2 Nov 21
A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent.
Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
Filed: 1 Mar 19
Utility
Stretchable interconnects for flexible electronic surfaces
5 Oct 21
A conductive paste and method of manufacturing thereof.
Narahari Pujari, Bawa Singh, Ravi Bhatkal, Siuli Sarkar, Anubhav Rustogi
Filed: 29 May 20
Utility
Cost-effective lead-free solder alloy for electronic applications
21 Sep 21
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony.
Md Hasnine, Lik Wai Kho
Filed: 28 Jun 18
Utility
Copper deposition in wafer level packaging of integrated circuits
21 Sep 21
An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor, and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin).
Thomas Richardson, Kyle Whitten, Vincent Paneccasio, Jr., John Commander, Richard Hurtubise
Filed: 20 Sep 17
Utility
Lead-free and antimony-free tin solder reliable at high temperatures
17 Aug 21
A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.
Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh
Filed: 28 Apr 15
Utility
Cobalt filling of interconnects
15 Jun 21
Compositions and methods of using such compositions for electroplating cobalt onto semiconductor base structures comprising submicron-sized electrical interconnect features are provided herein.
John Commander, Kyle Whitten, Vincent Paneccasio, Jr., Shaopeng Sun, Eric Yakobson, Jianwen Han, Elie Najjar
Filed: 5 Jul 17
Utility
Selective plating of three dimensional surfaces to produce decorative and functional effects
25 May 21
A method of creating a selectively plated three-dimensional thermoplastic part.
Paul Andrew Bray, Martin Vaughan Herbert, Keith Paul Parsons, Peter Alan Warwick
Filed: 27 Nov 18
Utility
Low pressure sintering powder
4 May 21
Shamik Ghoshal, Nirmalya Kumar Chaki, Poulami Sengupta Roy, Siuli Sarkar, Anubhav Rustogi
Filed: 10 Apr 15
Utility
Cobalt filling of interconnects in microelectronics
4 May 21
Processes and compositions for electroplating a cobalt deposit onto a semiconductor base structure comprising submicron-sized electrical interconnect features.
John Commander, Vincent Paneccasio, Jr., Eric Rouya, Kyle Whitten, Shaopeng Sun, Jianwen Han
Filed: 30 Jun 16