849 patents
Page 10 of 43
Utility
Semiconductor device
24 May 22
A semiconductor device has a split-gate type MONOS structure using a FinFET, and it includes a source and a drain each formed of an n-type impurity diffusion layer, a first channel forming layer which is formed under a control gate and is formed of a semiconductor layer doped with a p-type impurity, and a second channel forming layer which is formed under a memory gate and is formed of a semiconductor layer doped with an n-type impurity.
Digh Hisamoto, Yoshiyuki Kawashima, Takashi Hashimoto
Filed: 29 Oct 20
Utility
Electronic device and power receiving control method thereof
17 May 22
To make an excessive power receiving request by a sink when a USB Type-C legacy cable is used.
Takayuki Suzuki
Filed: 7 Oct 20
Utility
Semiconductor device including a package substrate and a semiconductor chip
17 May 22
A semiconductor device includes a package substrate, a semiconductor chip and a solder bump.
Hideaki Tsuchiya, Akira Matsumoto
Filed: 15 Jul 20
Utility
Semiconductor device and method of manufacturing the same
17 May 22
A semiconductor device includes a semiconductor substrate, an insulating film, a ferroelectric film, a first seed layer and a control gate electrode.
Tadashi Yamaguchi
Filed: 13 Nov 20
Utility
Semiconductor device and semiconductor system equipped with the same
10 May 22
A semiconductor device includes a master circuit which outputs a first write request signal for requesting to write data, a bus which receives the data and the first write request signal, a bus control unit which is arranged on the bus, generates an error detection code for the data and generates a second write request signal which includes second address information corresponding to first address information included in the first write request signal and memory controllers which each write the data into a storage area of an address designated by the first write request signal and writes the error detection code into a storage area of an address designated by the second write request signal in the storage areas of memories.
Kimihiko Nakazawa, Takahiro Irita
Filed: 14 Jan 21
Utility
Semiconductor device and method of manufacturing semiconductor device
10 May 22
A method of manufacturing a semiconductor device of one embodiment includes the steps of: forming a drift region in a first surface of a semiconductor substrate; forming a body region having a first portion disposed in the first surface, and a second portion disposed in the first surface so as to surround the first portion and the drift region; forming a hard mask, having an opening over the drift region, in the first surface; forming a reverse conductivity region in the first surface by ion implantation using the hard mask; forming a trench in the first surface by anisotropic etching using the hard mask; and embedding an isolation film in the trench.
Hiroaki Sekikawa, Takahiro Mori, Yuji Ishii
Filed: 4 Apr 19
Utility
Semiconductor device
3 May 22
A semiconductor device includes a substrate, an optical element, and a semiconductor element.
Seigo Namioka, Yasutaka Nakashiba
Filed: 6 Mar 20
Utility
Semiconductor device
19 Apr 22
A semiconductor device includes a first insulating layer, an optical modulator, and a multilayer wiring layer.
Teruhiro Kuwajima, Yasutaka Nakashiba
Filed: 25 Mar 20
Utility
Semiconductor device
19 Apr 22
A semiconductor device includes a bridge circuit comprising first to fourth elements, a first diagnostic circuit that detects a potential difference between two intermediate nodes of the bridge circuit and a control circuit that detects a failure of the first or second element based on an output of the first diagnostic circuit, wherein the first and second elements are first and second power transistors connected in series.
Akio Kamimoto
Filed: 27 Aug 20
Utility
Support apparatus and design support method
5 Apr 22
A storage device stores a source code and a model created by referencing a source code.
Tetsuji Tsuda, Saika Arai
Filed: 13 Nov 20
Utility
Semiconductor device including a bus arbiter
5 Apr 22
A semiconductor device includes a first master and a second master configured to issue requests for accessing to a memory, a first request issuing controller coupled to the first master, and configured to hold the request issued from the first master, a second request issuing controller coupled to the second master, and configured to hold the request issued from the second master, a bus arbiter coupled to the first request issuing controller and the second request issuing controller, a memory controller coupled to the bus arbiter, and including a buffer configured to store the requests issued from the first master and the second master, and a central bus controller configured to grant access rights to the first request issuing controller and the second request issuing controller based on space information of the buffer.
Sho Yamanaka, Toshiyuki Hiraki, Yoshihiko Hotta, Takahiro Irita
Filed: 9 Oct 20
Utility
Semiconductor device
5 Apr 22
Reduction in power consumption of a semiconductor device is achieved.
Kazuya Uejima, Kazuhiro Koudate
Filed: 22 Dec 20
Utility
Semiconductor device and method of manufacturing the same
5 Apr 22
In a deep trench DTC reaching a predetermined depth from a first main surface of a semiconductor substrate SUB, a plurality of columnar conductors CCB including plugs PUG and field plates FP are formed.
Senichirou Nagase, Tsuyoshi Kachi, Yoshinori Hoshino
Filed: 23 Mar 20
Utility
Semiconductor system and semiconductor device
29 Mar 22
A semiconductor system capable of reducing processing time in connection processing to a USB port is provided.
Dan Aoki
Filed: 28 Apr 20
Utility
Failure analysis apparatus, computer readable recording medium and failure analysis method
29 Mar 22
A failure analysis apparatus is an apparatus for analyzing a failure of a semiconductor device including a memory circuit and includes a storage device and a processor.
Toru Ogushi
Filed: 13 Nov 20
Utility
Semiconductor device and method of manufacturing the same
29 Mar 22
A method of manufacturing a semiconductor device includes: providing a substrate, forming a first opening, forming a first insulating layer, forming a second opening, embedding a conductive layer, forming a protective layer, and performing CMP.
Shigeo Tokumitsu, Yoshiki Maruyama, Satoshi Iida
Filed: 12 May 20
Utility
Semiconductor device including ferroelectric film and method of manufacturing the same
29 Mar 22
A first amorphous film including hafnium, oxygen and a first element is formed, and a plurality of grains including a second element which differs from any of hafnium, oxygen and the first element is formed on the first amorphous film.
Tadashi Yamaguchi
Filed: 25 Jun 20
Utility
Data transfer system and transfer method
29 Mar 22
To securely realize updating of a key shared between an apparatus on a transmission side and an apparatus on a reception side.
Tadaaki Tanimoto, Daisuke Moriyama
Filed: 10 Apr 19
Utility
Semiconductor device
29 Mar 22
A semiconductor device includes a power MOS chip having a source electrode on a surface and a control chip mounted on a portion of the power MOS chip, wherein, viewing from a first outer edge of the power MOS chip extending in a first direction to the control chip, a first column bonding pad and a second column bonding pad are formed in a region of the source electrode where the control chip is not mounted, and wherein a distance between a second outer edge of the power MOS chip extending in a second direction and the first column bonding pad is longer than a distance between the second outer edge and the second column bonding pad.
Tomoaki Ota, Makoto Tanaka
Filed: 28 Oct 20
Utility
Semiconductor device and method of manufacturing the same
22 Mar 22
A semiconductor device including a multilayer wiring layer comprising a first wiring, a first insulating film formed on the multilayer wiring layer and having a first opening exposing a portion of the first wiring, a second insulating film formed on the first insulating film and having a second opening continuing with the first opening, and an inductor formed of the first wiring, and a second wiring electrically connected with the first wiring through a via formed in the first opening.
Kazuhiko Iwakiri, Akira Matsumoto
Filed: 1 Jun 20