11728 patents
Page 20 of 587
Utility
Techniques to Shape Network Traffic for Server-based Computational Storage
14 Dec 23
Examples include techniques to shape network traffic for server-based computational storage.
Michael MESNIER, Anil VASUDEVAN, Kelley MULLICK
Filed: 25 Aug 23
Utility
Methods and Apparatus to Slice Networks for Wireless Services
14 Dec 23
Systems, apparatus, articles of manufacture, and methods are disclosed to slice networks for wireless services.
Omid Semiari, Hosein Nikopour, Shilpa Talwar
Filed: 8 Jun 23
Utility
p98rbfdywdfr2851yuvfzbp0z9nmwj288me3sdapp1f6jc3zuhv70vtt
14 Dec 23
A system configured to track network slicing operations within a 5G communication network includes processing circuitry configured to determine a network slice instance (NSI) associated with a QoS flow of a UE.
Dario Sabella, Miltiadis Filippou
Filed: 24 May 23
Utility
xamwysxldlii46qesry87gwh7t1e4fskhicojzzm05bfls8
7 Dec 23
Techniques for preventing read disturb in NAND memory devices are described.
Arun Sitaram ATHREYA, Shankar NATARAJAN, Sriram NATARAJAN, Yihua ZHANG, Suresh NAGARAJAN
Filed: 18 Aug 23
Utility
gn58rkw38jenkjlt7cg7cxcw3xffy fk7u4l4yat98qbd0dxh151e
7 Dec 23
An apparatus, system, and method for improved replica bit line (RBL) operation are provided.
Naveen Kumar, Gururaj Shamanna, Jagadeesh Chandra Salaka, Purna Chandra Nayak
Filed: 7 Jun 22
Utility
gtilcujj60eiw4b6ng0yt0uzcqaejqu7i6iunnnf4icebogc5
7 Dec 23
In one embodiment, a substrate includes a glass core layer defining a plurality of holes between a first side of the glass core layer and a second side of the glass core layer opposite the first side and a conductive metal inside the holes of the glass core layer.
Srinivas V. Pietambaram, Kristof Darmawikarta, Tarek A. Ibrahim, Jeremy D. Ecton, Brandon Christian Marin, Gang Duan, Suddhasattwa Nad, Yi Yang, Benjamin T. Duong, Junxin Wang, Sameer R. Paital
Filed: 6 Jun 22
Utility
w6kfefre5824y1de6qd7ob32ralc2vguprnw8s0h1
7 Dec 23
Thermally conductive, electrically insulating materials and their manufacture on integrated circuit (IC) dies.
Jean-Pierre Njante, Telesphor Kamgaing
Filed: 2 Jun 22
Utility
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7 Dec 23
In one embodiment, a substrate includes a glass core layer defining a plurality of holes between a first side of the glass core layer and a second side of the glass core layer opposite the first side and a conductive metal inside the holes of the glass core layer.
Srinivas V. Pietambaram, Kristof Darmawikarta, Tarek A. Ibrahim, Jeremy D. Ecton, Brandon Christian Marin, Gang Duan, Suddhasattwa Nad, Yi Yang, Benjamin T. Duong, Junxin Wang, Sameer R. Paital
Filed: 6 Jun 22
Utility
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7 Dec 23
Systems, apparatus, articles of manufacture, and methods are disclosed for supports for internal hardware of electronic devices.
David Shia, Rick Canham, Eric W. Buddrius, Jeffory L. Smalley, John Beatty, Kenan Arik, Mohanraj Prabhugoud, Kirk Wheeler, Shelby Ferguson, Jorge Contreras Perez, Daniel Neumann, Ernesto Borboa Lizarraga
Filed: 16 Aug 23
Utility
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7 Dec 23
A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins.
Tin Poay Chuah, Jeff Ku, Min Suet Lim, Yew San Lim, Twan Sing Loo
Filed: 7 Jun 22
Utility
9csklokelu8ji5ksnk60jcfvmqqmi1o31xyojny64f5rbpsa1b2lqa74cu
7 Dec 23
Embodiments disclosed herein include package substrates.
Jooi Wah WONG, Eng Huat GOH, Telesphor KAMGAING, Chee Kheong YOON, Min Suet LIM, Kavitha NAGARAJAN, Chu Aun LIM
Filed: 6 Jun 22
Utility
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7 Dec 23
Adjacent interconnect features are in staggered, vertically spaced positions, which accordingly reduces their capacitive coupling within a level of interconnect metallization.
Miriam Reshotko, Elijah Karpov, Mark Anders, Gauri Auluck, Shakuntala Sundararajan, Michael Makowski, Caleb Barrett
Filed: 6 Jun 22
Utility
3vpcysx2iyz70pijg5iwjdw20033yu 7wzl8vwlx
7 Dec 23
Microelectronic assemblies, and related devices and methods, are disclosed herein.
Aleksandar Aleksov, Johanna M. Swan
Filed: 17 Aug 23
Utility
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7 Dec 23
A semiconductor structure includes an upper device stacked over a lower device.
Munzarin F. Qayyum, Nicole K. Thomas, Jami A. Wiedemer, Jack T. Kavalieros, Marko Radosavljevic, Willy Rachmady, Cheng-Ying Huang, Rohit Galatage, Nitesh Kumar, Kai Loon Cheong, Venkata Vasiraju
Filed: 3 Jun 22
Utility
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7 Dec 23
Embodiments disclosed herein include electronic packages.
Eng Huat GOH, Jiun Hann SIR, Chee Kheong YOON, Telesphor KAMGAING, Min Suet LIM, Kavitha NAGARAJAN, Chu Aun LIM
Filed: 6 Jun 22
Utility
k7mzpny55n5erfsn79w4yd803trpq5xs50ocklo
7 Dec 23
A semiconductor structure includes a second device stacked over a first device.
Nicole K. Thomas, Munzarin F. Qayyum, Marko Radosavljevic, Cheng-Ying Huang, Willy Rachmady, Rohit Galatage, Jami A. Wiedemer, David Bennett, Dincer Unluer, Venkata Aditya Addepalli
Filed: 3 Jun 22
Utility
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7 Dec 23
Embodiments disclosed herein include electronic packages.
Eng Huat GOH, Telesphor KAMGAING, Chee Kheong YOON, Jooi Wah WONG, Min Suet LIM, Kavitha NAGARAJAN, Chu Aun LIM
Filed: 6 Jun 22
Utility
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7 Dec 23
An integrated circuit structure includes a first device, and a second device laterally adjacent to the first device.
Willy Rachmady, Nitesh Kumar, Jami A. Wiedemer, Cheng-Ying Huang, Marko Radosavljevic, Mauro J. Kobrinsky, Patrick Morrow, Rohit Galatage, David N. Goldstein, Christopher J. Jezewski
Filed: 6 Jun 22
Utility
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7 Dec 23
Embodiments disclosed herein include an electronic package.
Eng Huat GOH, Telesphor KAMGAING, Jooi Wah WONG, Min Suet LIM, Chee Kheong YOON, Kavitha NAGARAJAN, Chu Aun LIM
Filed: 6 Jun 22
Utility
zlm2kukv78faxbjem5vyossqbner19lzqpqxux6d35ibzgzmzit2mtd0udd
7 Dec 23
An integrated circuit structure includes a vertical stack including a first device, and a second device above the first device.
Willy Rachmady, Nitesh Kumar, Jami A. Wiedemer, Cheng-Ying Huang, Marko Radosavljevic, Mauro J. Kobrinsky, Patrick Morrow, Rohit Galatage, David N. Goldstein, Christopher J. Jezewski
Filed: 6 Jun 22