10908 patents
Page 14 of 546
Utility
Method and system of audio false keyphrase rejection using speaker recognition
21 Nov 23
Techniques related to a method and system of audio false keyphrase rejection using speaker recognition are described herein.
Jacek Ossowski, Tobias Bocklet, Kuba Lopatka
Filed: 13 Jul 22
Utility
Non-planar I/O and logic semiconductor devices having different workfunction on common substrate
21 Nov 23
Non-planar I/O and logic semiconductor devices having different workfunctions on common substrates and methods of fabricating non-planar I/O and logic semiconductor devices having different workfunctions on common substrates are described.
Roman W. Olac-Vaw, Walid M. Hafez, Chia-Hong Jan, Pei-Chi Liu
Filed: 13 Apr 22
Utility
Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices
21 Nov 23
An integrated circuit assembly may be formed having a substrate, a first integrated circuit device electrically attached to the substrate, a second integrated circuit device electrically attached to the first integrated circuit device, and a heat dissipation device comprising at least one first thermally conductive structure proximate at least one of the first integrated circuit device, the second integrated circuit device, and the substrate; and a second thermally conductive structure disposed over the first thermally conductive structure(s), the first integrated circuit device, and the second integrated circuit device, wherein the first thermally conductive structure(s) have a lower electrical conductivity than an electrical conductivity of the second thermally conductive structure.
Feras Eid, Adel Elsherbini, Johanna Swan
Filed: 20 Jul 18
Utility
Systems and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package
21 Nov 23
In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing a Pad on Solder Mask (PoSM) semiconductor substrate package.
Eng Huat Goh, Jiun Hann Sir, Min Suet Lim
Filed: 14 Feb 22
Utility
Variable pitch and stack height for high performance interconnects
21 Nov 23
An integrated circuit structure comprises a base and a plurality of metal levels over the base.
En-Shao Liu, Joodong Park, Chen-Guan Lee, Walid M. Hafez, Chia-Hong Jan, Jiansheng Xu
Filed: 28 Jun 19
Utility
Multi-chip package and method of providing die-to-die interconnects in same
21 Nov 23
A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die.
Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan, Sujit Sharan
Filed: 29 Sep 22
Utility
Package substrate with reduced interconnect stress
21 Nov 23
Techniques for mounting a semiconductor chip in a circuit board assembly includes using different buildup materials on opposite sides of a core to optimize stress in the first level interconnect structure (between the chip and core) and/or the second level interconnect structure (between the core and circuit board).
Lauren A. Link, Andrew J. Brown, Sheng C. Li, Sandeep B. Sane
Filed: 15 Aug 19
Utility
Hyperchip
21 Nov 23
Hyperchip structures and methods of fabricating hyperchips are described.
Mark T. Bohr, Wilfred Gomes, Rajesh Kumar, Pooya Tadayon, Doug Ingerly
Filed: 9 Apr 21
Utility
Heterogeneous nested interposer package for IC chips
21 Nov 23
Embodiments disclosed herein include electronic packages and methods of fabricating electronic packages.
Debendra Mallik, Ravindranath Mahajan, Robert Sankman, Shawna Liff, Srinivas Pietambaram, Bharat Penmecha
Filed: 27 Dec 22
Utility
Contact architecture for capacitance reduction and satisfactory contact resistance
21 Nov 23
Solid assemblies having a composite dielectric spacer and processes for fabricating the solid assemblies are provided.
Rishabh Mehandru, Pratik A. Patel, Ralph T. Troeger, Szuya S. Liao
Filed: 8 Feb 22
Utility
Wrap-around contact structures for semiconductor nanowires and nanoribbons
21 Nov 23
Wrap-around contact structures for semiconductor nanowires and nanoribbons, and methods of fabricating wrap-around contact structures for semiconductor nanowires and nanoribbons, are described.
Rishabh Mehandru, Tahir Ghani, Stephen Cea, Biswajeet Guha
Filed: 9 Nov 22
Utility
Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact
21 Nov 23
Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact are described.
Biswajeet Guha, William Hsu, Chung-Hsun Lin, Kinyip Phoa, Oleg Golonzka, Ayan Kar, Nicholas Thomson, Benjamin Orr, Nathan Jack, Kalyan Kolluru, Tahir Ghani
Filed: 18 Dec 19
Utility
Apparatus, system and method for generating an output oscillator signal, transceiver, mobile device and base station
21 Nov 23
An apparatus for generating an output oscillator signal is provided.
Ofir Degani, Gil Horovitz, Evgeny Shumaker, Sergey Bershansky, Aryeh Farber, Igor Gertman, Run Levinger
Filed: 24 Sep 20
Utility
Techniques for artificial intelligence capabilities at a network switch
21 Nov 23
Examples include techniques for artificial intelligence (AI) capabilities at a network switch.
Francesc Guim Bernat, Suraj Prabhakaran, Kshitij A. Doshi, Brinda Ganesh, Timothy Verrall
Filed: 28 Dec 18
Utility
Automated platform resource management in edge computing environments
21 Nov 23
Various approaches for implementing platform resource management are described.
Brian Andrew Keating, Marcin Spoczynski, Lokpraveen Mosur, Kshitij Arun Doshi, Francesc Guim Bernat
Filed: 20 Dec 19
Utility
Enhanced security for multi-link wireless operations
21 Nov 23
This disclosure describes systems, methods, and devices related to security for multi-link operations.
Po-Kai Huang, Cheng Chen, Ido Ouzieli, Avner Epstein, Danny Alexander, Ofer Schreiber, Arik Klein, Daniel Bravo, Laurent Cariou, Ofer Hareuveni, Ehud Reshef, Nir Balaban
Filed: 27 Aug 20
Utility
Asymmetric device attestation using physically unclonable functions
21 Nov 23
In one example, a system for asymmetric device attestation includes a physically unclonable function (PUF) configured to generate a response to a challenge.
Prashant Dewan, Baiju Patel
Filed: 12 May 22
Utility
Adaptively encoding video frames based on complexity
21 Nov 23
An example apparatus for encoding video frames includes a frame analyzer to execute a look ahead analysis on a received set of frames.
Ximin Zhang, Sang-Hee Lee, Keith Rowe
Filed: 15 Nov 19
Utility
Random access channel (RACH) optimization in 5G networks
21 Nov 23
Methods, systems, and storage media are described for configuring RACH parameters in a cell in order to achieve the optimal RACH performance.
Joey Chou, Yizhi Yao, Ansab Ali
Filed: 29 Sep 20
Utility
Group identification indication signaling
21 Nov 23
This disclosure describes methods, apparatuses, and wireless stations related to waking up low power radios.
Po-Kai Huang, Daniel Bravo, Noam Ginsburg, Robert Stacey
Filed: 5 Nov 21