10908 patents
Page 12 of 546
Utility
Cross-function virtualization of a telecom core network
28 Nov 23
In the present disclosure, functions associated with the central office of an evolved packet core network are co-located onto a computer platform or sub-components through virtualized function instances.
Ashok Sunder Rajan, Richard A. Uhlig, Rajendra S. Yavatkar, Tsung-Yuan C. Tai, Christian Maciocco, Jeffrey R. Jackson, Daniel J. Dahle
Filed: 14 Feb 22
Utility
Robust surface registration based on parameterized perspective of image templates
28 Nov 23
Techniques related to performing image registration are discussed.
Itay Kaufman, Or Weiser
Filed: 25 Mar 20
Utility
Methods and apparatus to manage display luminance
28 Nov 23
Methods, apparatus, systems and articles of manufacture are disclosed to manage display luminance, for the purpose of power efficiency, halo reduction, and flicker prevention.
Roland Wooster, Perazhi Sameer Kalathil
Filed: 23 Dec 21
Utility
Integrated circuits with line breaks and line bridges within a single interconnect level
28 Nov 23
Integrated circuit (IC) interconnect lines having line breaks and line bridges within one interconnect level that are based on a single lithographic mask pattern.
Kevin Lin, Christopher J. Jezewski
Filed: 19 Nov 21
Utility
Embedded substrate heat sink for bottom side cooling
28 Nov 23
Embodiments include semiconductor packages.
Aastha Uppal, Divya Mani, Je-Young Chang
Filed: 11 Oct 19
Utility
Thermal management in integrated circuit packages
28 Nov 23
Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.
Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan
Filed: 6 Aug 19
Utility
Integrated circuits and methods for forming integrated circuits
28 Nov 23
An example relates to an integrated circuit including a semiconductor substrate, and a wiring layer stack located on the semiconductor substrate.
Carl Naylor, Ashish Agrawal, Urusa Alaan, Christopher Jezewski, Mauro Kobrinsky, Kevin Lin, Abhishek Anil Sharma
Filed: 25 May 21
Utility
Magnetic structures in integrated circuit package supports
28 Nov 23
Disclosed herein are magnetic structures in integrated circuit (IC) package supports, as well as related methods and devices.
Ying Wang, Yikang Deng, Junnan Zhao, Andrew James Brown, Cheng Xu, Kaladhar Radhakrishnan
Filed: 25 Mar 20
Utility
Semiconductor device having metal interconnects with different thicknesses
28 Nov 23
An apparatus includes a first metal layer, a second metal layer and a dielectric material.
Kinyip Phoa, Jui-Yen Lin, Nidhi Nidhi, Chia-Hong Jan
Filed: 1 Feb 22
Utility
Device, system and method for providing inductor structures
28 Nov 23
Techniques and mechanisms for providing an inductor with an integrated circuit (IC) die.
Wilfred Gomes, Mark Bohr, Doug Ingerly, Rajesh Kumar, Harish Krishnamurthy, Nachiket Venkappayya Desai
Filed: 9 Jun 22
Utility
Semiconductor package including a modular side radiating waveguide launcher
28 Nov 23
Integration of a side-radiating waveguide launcher system into a semiconductor package beneficially permits the coupling of a waveguide directly to the semiconductor package.
Georgios Dogiamis, Sasha Oster, Johanna Swan, Shawna Liff, Adel Elsherbini, Telesphor Kamgaing, Aleksandar Aleksov
Filed: 23 Sep 16
Utility
Heated pins to couple with solder elements
28 Nov 23
Embodiments herein relate to systems, apparatuses, or processes for coupling or decoupling two substrates by heating pins on one of the substrates and either inserting or withdrawing the heated pins from solder elements on a BGA.
Feroz Mohammad, Srinivasa R. Aravamudhan
Filed: 28 May 19
Utility
Electronic device package
28 Nov 23
Electronic device package technology is disclosed.
Zhicheng Ding, Bin Liu, Yong She, Hyoung Il Kim
Filed: 31 Dec 16
Utility
Dual-sided co-packaged optics for high bandwidth networking applications
28 Nov 23
Embodiments disclosed herein include electronic packages for optical to electrical switching.
Suresh V. Pothukuchi, Andrew Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao, Harinadh Potluri, David M. Bond, Sushrutha Reddy Gujjula, Donald Tiendung Tran, David Hui, Vladimir Tamarkin
Filed: 30 Nov 21
Utility
Gate-all-around integrated circuit structures having depopulated channel structures using bottom-up oxidation approach
28 Nov 23
Gate-all-around integrated circuit structures having depopulated channel structures, and methods of fabricating gate-all-around integrated circuit structures having depopulated channel structures using a bottom-up oxidation approach, are described.
Willy Rachmady, Gilbert Dewey, Jack T. Kavalieros, Aaron Lilak, Patrick Morrow, Anh Phan, Cheng-Ying Huang, Ehren Mannebach
Filed: 4 Jan 19
Utility
Beam failure recovery for uplink
28 Nov 23
Various embodiments herein provide techniques for beam failure recovery in uplink.
Alexei Davydov, Aida Vera Lopez
Filed: 2 Oct 20
Utility
Apparatus, system and method of transmitting a PPDU over a 320 megahertz channel bandwidth
28 Nov 23
For example, an apparatus may include a segment parser to parse scrambled data bits of a PPDU into a first plurality of data bits and a second plurality of data bits, the PPDU to be transmitted in an OFDM transmission over an aggregated bandwidth comprising a first channel in a first frequency band and a second channel in a second frequency band; a first baseband processing block to encode and modulate the first plurality of data bits according to a first OFDM MCS for transmission over the first channel in the first frequency band; and a second baseband block to encode and modulate the second plurality of data bits according to a second OFDM MCS for transmission over the second channel in the second frequency band.
Alexander W. Min, Thomas J. Kenney, Laurent Cariou, Shahrnaz Azizi, Xiaogang Chen, Robert J. Stacey, Qinghua Li
Filed: 24 Oct 22
Utility
Provisioning of multicast and broadcast services with different quality of service levels
28 Nov 23
Disclosed embodiments are related to configuring and/or provisioning user equipment (UE) for Multicast-Broadcast Service (MBS).
Ching-Yu Liao
Filed: 18 Nov 20
Utility
Out-of-band management of FPGA bitstreams
28 Nov 23
Mechanisms for out-of-band (OOB) management of Field Programmable Gate Array (FPGA) bitstreams and associated methods, apparatus, systems and firmware.
Murugasamy K. Nachimuthu, Mohan J. Kumar
Filed: 23 Mar 22
Utility
Modular I/O configurations for edge computing using disaggregated chiplets
28 Nov 23
Various approaches for deployment and use of configurable edge computing platforms are described.
Francesc Guim Bernat, Kshitij Arun Doshi, Ned M. Smith, Timothy Verrall, Uzair Qureshi
Filed: 5 May 22