10908 patents
Page 9 of 546
Utility
Dot product operations on sparse matrix elements
12 Dec 23
Embodiments described herein include software, firmware, and hardware logic that provides techniques to perform arithmetic on sparse data via a systolic processing unit.
Abhishek Appu, Subramaniam Maiyuran, Mike Macpherson, Fangwen Fu, Jiasheng Chen, Varghese George, Vasanth Ranganathan, Ashutosh Garg, Joydeep Ray
Filed: 15 Dec 20
Utility
Real-time multi-view detection of objects in multi-camera environments
12 Dec 23
A mechanism is described for facilitating real-time multi-view detection of objects in multi-camera environments, according to one embodiment.
Qiang Li, Xiaofeng Tong, Yikai Fang, Chen Ling, Wenlong Li
Filed: 26 Sep 18
Utility
Additive manufacturing for integrated circuit assembly connector support structures
12 Dec 23
Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies.
Adel Elsherbini, Feras Eid, Johanna Swan, Georgios Dogiamis
Filed: 23 Jun 20
Utility
Electronic systems with inverted circuit board with heat sink to chassis attachment
12 Dec 23
An apparatus is described.
Barrett M. Faneuf, Phil Geng, Kenan Arik, David Shia, Casey Winkel, Sandeep Ahuja, Eric D. McAfee, Jeffory L. Smalley, Minh T. D. Le, Ralph V. Miele, Marc Milobinski, Aaron P. Anderson, Brendan T. Pavelek, Fernando Gonzalez Lenero, Carlos Alvizo Flores
Filed: 5 Aug 20
Utility
IC assemblies including die perimeter frames suitable for containing thermal interface materials
12 Dec 23
An integrated circuit (IC) assembly comprising an IC die and a frame material that has been dispensed over the assembly substrate to be further adjacent to a perimeter edge of the IC die.
Kyle Arrington, Frederick Atadana, Taylor Gaines, Minseok Ha
Filed: 26 Dec 19
Utility
Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate
12 Dec 23
Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die.
Rahul Jain, Ji Yong Park, Kyu Oh Lee
Filed: 3 Sep 21
Utility
Transistor contact area enhancement
12 Dec 23
A semiconductor device includes a semiconductor body that includes a surface and a first region and a second region formed in the semiconductor body, where a channel region is located between the first region and the second region, and where the second region includes a sub-region that includes a blanket dopant; a first conductive contact on the surface of the semiconductor body above the first region; a semiconductor-on-insulator (SOI) at a bottom of the first region; and a pocket channel dopant (PCD) formed in the channel, where a first portion of the PCD is adjacent to a first portion of the SOI; and a second conductive contact on a bottom portion of the sub-region, where a first portion of the second conductive contact is adjacent to a second portion of the SOI, and a second portion of the second conductive contact is adjacent to a second portion of the PCD.
Rishabh Mehandru, Tahir Ghani, Stephen Cea
Filed: 31 Jan 22
Utility
Vertical architecture of thin film transistors
12 Dec 23
Embodiments herein describe techniques for a semiconductor device including a transistor.
Van H. Le, Seung Hoon Sung, Benjamin Chu-Kung, Miriam Reshotko, Matthew Metz, Yih Wang, Gilbert Dewey, Jack Kavalieros, Tahir Ghani, Nazila Haratipour, Abhishek Sharma, Shriram Shivaraman
Filed: 22 Jun 18
Utility
Transistor structures with a metal oxide contact buffer and a method of fabricating the transistor structures
12 Dec 23
Transistor structures may include a metal oxide contact buffer between a portion of a channel material and source or drain contact metallization.
Gilbert Dewey, Abhishek Sharma, Van Le, Jack Kavalieros, Shriram Shivaraman, Seung Hoon Sung, Tahir Ghani, Arnab Sen Gupta, Nazila Haratipour, Justin Weber
Filed: 1 Nov 21
Utility
Bluetooth receiver, electronic device and method for a Bluetooth receiver
12 Dec 23
A Bluetooth receiver is provided.
Avishay Friedman, Yarden Regev, Jinyong Lee, Assaf Gurevitz
Filed: 22 Nov 21
Utility
Packet processing with reduced latency
12 Dec 23
Generally, this disclosure provides devices, methods, and computer readable media for packet processing with reduced latency.
Eliezer Tamir, Jesse C. Brandeburg, Anil Vasudevan
Filed: 19 Oct 21
Utility
Technologies for managing a flexible host interface of a network interface controller
12 Dec 23
Technologies for processing network packets by a host interface of a network interface controller (NIC) of a compute device.
Thomas E. Willis, Brad Burres, Amit Kumar
Filed: 10 Jun 21
Utility
Method and system of multiple channel video coding with cross-channel referencing
12 Dec 23
Techniques related to video coding include multiple channel video coding with cross-channel referencing.
Jason Tanner, Vasily Aristarkhov
Filed: 25 Sep 19
Utility
Techniques of user equipment receiver power switching
12 Dec 23
Methods and devices including a processing circuit for a User Equipment, UE, wherein the UE includes a radio frequency, RF, receiver, wherein the processing circuit is configured to set a power switching pattern of the RF receiver for UE power saving in Discontinuous Reception, DRX, Radio Resource Control, RRC, IDLE mode based on a paging occasion, PO, and a signal block associated with the PO.
Zhibin Yu, Bertram Gunzelmann, Rui Huang
Filed: 7 Jan 19
Utility
Flexible retention ring for thermal interface material
12 Dec 23
An embodiment of an electronic apparatus may include an electronic device package having a first surface, a heat conductive structure having a second surface, a reservoir structure positioned between the first surface of the electronic device package and the second surface of the heat conductive structure, and a thermal interface material disposed within the reservoir structure between the first surface of the electronic device package and the second surface of the heat conductive structure to place the first surface in thermal communication with the second surface.
Raymon S. Anglin Williams
Filed: 6 Mar 20
Utility
Elastic cloud video editing and multimedia search
5 Dec 23
Technologies for cloud-based media search and editing include a video editor configured to build a media query and associate the media query with a dynamic content slot of a media program.
Charles Baron, Sherry Chang, Robert L. Vaughn, Kevin Jacobs, Jeffrey Caroli
Filed: 1 Jul 21
Utility
Continuous gate and fin spacer for advanced integrated circuit structure fabrication
5 Dec 23
Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures.
Heidi M. Meyer, Ahmet Tura, Byron Ho, Subhash Joshi, Michael L. Hattendorf, Christopher P. Auth
Filed: 18 Aug 22
Utility
Substrate with gradiated dielectric for reducing impedance mismatch
5 Dec 23
An electronic circuit including a substrate having a first dielectric characteristic.
Jackson Chung Peng Kong, Bok Eng Cheah, Ping Ping Ooi, Kooi Chi Ooi
Filed: 11 Oct 21
Utility
Heatsink cutout and insulating through silicon vias to cut thermal cross-talk
5 Dec 23
Embodiments disclosed herein include electronic packages.
Zhimin Wan, Chia-Pin Chiu, Chandra Mohan Jha
Filed: 6 Feb 20
Utility
Substrate with variable height conductive and dielectric elements
5 Dec 23
Apparatuses, systems and methods associated with package substrate design with variable height conductive elements within a single layer are disclosed herein.
Aleksandar Aleksov, Kristof Darmawikarta, Haobo Chen, Changhua Liu, Sri Ranga Sai Boyapati, Bai Nie
Filed: 29 Dec 17