7578 patents
Page 3 of 379
Utility
Electrostatic Chuck Cover Piece to Enable Processing of Dielectric Substrates
11 Jan 24
Apparatus for processing a semiconductor substrate are described herein.
Andrew CEBALLOS, Suraj YADAV, Kazuya DAITO
Filed: 7 Jul 23
Utility
Methods, Systems, and Apparatus for Interlocking a Device
11 Jan 24
In embodiments, systems and apparatus comprise a bracket having a through hole configured to receive a first connector connected to a panel spaced from the bracket, the bracket movable between first and second positions; a switch mountable on the panel, the switch having first and second switch positions; and at least one compression spring extending from the bracket to bias the bracket into the first position spaced away from the switch.
Vijay SINGH, Kumaresan NAGARAJAN, Adarsh BALAREDDY
Filed: 11 Jul 22
Utility
Ultraviolet and Ozone Clean System
11 Jan 24
A cleaning apparatus for cleaning a substrate includes a lamp for emitting ultraviolet radiation in an irradiation region; a housing that houses the lamp; a water deflector spaced below the housing, the water deflector having a water inlet for receiving a supply of ozonated water and a water outlet for discharging ozonated water irradiated by the lamp into a substrate processing region beneath the water deflector, and defining a water flow path between the water inlet and the water outlet, the water flow path extending in the irradiation region; an upper reflector extending along and above the lamp; and a lower reflector extending along and below the water deflector, wherein the upper reflector and the lower reflector at least partially define the irradiation region and reflect ultraviolet radiation toward the water flow path, and wherein the lower reflector shields the substrate from ultraviolet radiation emitted by the lamp.
Banqiu WU, Khalid MAKHAMREH, Hiroki OGAWA, Eliyahu Shlomo DAGAN
Filed: 20 Sep 23
Utility
Flat Susceptor with Grid Pattern and Venting Grooves on Surface Thereof
11 Jan 24
A susceptor for use in a processing chamber for supporting a wafer includes a susceptor substrate having a susceptor ledge on an outer circumferential edge of a front side of the susceptor substrate, wherein a pocket within the susceptor ledge is configured to hold a wafer to be processed in a processing chamber, and a coating layer deposited on the susceptor substrate, wherein a surface of the susceptor ledge is textured with a plurality of venting groove lines, a surface of the pocket is textured with a first pattern, and a surface of a back side of the susceptor substrate opposite the front side is textured with a second pattern.
Zhepeng CONG, Balakrishnam R. JAMPANA, Masato ISHII, Shawn Joseph BONHAM, James M. AMOS, Kirk Allen FISHER, Philip Michael AMOS, Cathryne A. RYAN, Aimee S. ERHARDT, Xinning LUAN, Hui CHEN
Filed: 8 Jul 22
Utility
Contact Formation Process for Cmos Devices
11 Jan 24
A method of forming an electrical contact in a semiconductor structure includes performing a patterning process to form a mask on a semiconductor structure, the semiconductor structure comprising a first semiconductor region, a second semiconductor region, a dielectric layer having a first opening over the first semiconductor region and a second opening over the second semiconductor region, wherein the mask covers an exposed surface of the second semiconductor region within the second opening, performing an amorphization ion implant process to amorphize an exposed surface of the first semiconductor region within the first opening, performing a removal process to remove the mask, performing a selective epitaxial deposition process, to epitaxially form a contact layer on the exposed surface of the second semiconductor region, and performing a recrystallization anneal process to recrystallize the amorphized surface of the first semiconductor region.
Nicolas Louis BREIL, Lisa MCGILL, Amritha RAMMOHAN, Shashank SHARMA
Filed: 5 Jun 23
Utility
Technique for Training Neural Network for Use In In-situ Monitoring During Polishing and Polishing System
11 Jan 24
A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements.
Kun Xu, Kiran Lall Shrestha, Doyle E. Bennett, David Maxwell Gage, Benjamin Cherian, Jun Qian, Harry Q. Lee
Filed: 21 Sep 23
Utility
Prevention of Contamination of Substrates During Gas Purging
11 Jan 24
Disclosed are implementations for efficient purging of substrate carriers (and content held therein) and preventing external contaminants from entering a gas purge apparatus by coupling the gas purge apparatus to a substrate carrier, performing a first gas purging session of an environment of the substrate carrier, receiving a first signal of a first signal type, responsive to receiving the first signal, keeping the gas purge apparatus coupled to the substrate carrier, performing a second gas purging session of the environment of the substrate carrier, receiving a second signal of a second signal type, and, responsive to receiving the second signal, decoupling the purge apparatus from the substrate carrier.
Douglas Brian Baumgarten, Russell Kaplan, Amitabh Puri, Paul B. Reuter
Filed: 25 Sep 23
Utility
Nitrogen Plasma Treatment for Bottom-up Growth
11 Jan 24
A method of forming a semiconductor device structure includes forming a nucleation layer within at least one feature.
Tsung-Han YANG, Zhimin QI, Yongqian GAO, Rongjun WANG, Yi XU, Yu LEI, Xingyao GAO, Chih-Hsun HSU, Xi CEN, Wei LEI, Shiyu YUE, Aixi ZHANG, Kai WU, Xianmin TANG
Filed: 21 Jun 23
Utility
Methods and Systems for Producing Lithium Intercalated Anodes
11 Jan 24
Embodiments of the present disclosure generally relate to battery technology, and more specifically, methods and systems for preparing lithium anodes.
PrasannaKalleshwara Buddappa RAMACHANDRAPPA, Sambhu Nath KUNDU, Visweswaren SIVARAMAKRISHNAN, Subramanya P. HERLE
Filed: 19 May 23
Utility
Algorithm for Accurately Converting a Wide Range of Photo Signals into an Electrical Current
11 Jan 24
Embodiments disclosed herein include a method of calibrating a tool for converting photonic signals to electrical signals.
Mikhail Taraboukhine, Oleg Serebryanov, Alexander Goldin, Vilen Nestorov
Filed: 11 Jul 22
Utility
Selective Laser Patterning on Piezoelectric Thin Films for Piezoelectric Device Fabrication
11 Jan 24
Examples disclosed herein relate to piezoelectric devices and methods of patterning piezoelectric layers for piezoelectric device fabrication.
Vijay Bhan SHARMA, Nilesh PATIL, Bharatwaj RAMAKRISHNAN, Suresh Chand SETH, Abhijeet Laxman SANGLE
Filed: 5 Jul 23
Utility
Temperature-based in-situ edge assymetry correction during CMP
9 Jan 24
A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier laterally movable by an actuator across the polishing pad to hold a substrate against a polishing surface of the polishing pad during a polishing process, a thermal control system including a plurality of independently controllable heaters and coolers to independently control temperatures of a plurality of zones on the polishing pad, and a controller configured to cause the thermal control system to generate a first zone having a first temperature and a second zone having a different second temperature on the polishing pad.
Haosheng Wu, Shou-Sung Chang, Jianshe Tang, Chih Chung Chou, Hui Chen, Hari Soundararajan, Benjamin Cherian
Filed: 15 Apr 20
Utility
Profile control with multiple instances of contol algorithm during polishing
9 Jan 24
During polishing of a stack of adjacent layers, a plurality of instances of a profile control algorithm are executed on a controller with different instances having different values for a control parameter.
Kun Xu, Harry Q. Lee, Benjamin Cherian, David Maxwell Gage
Filed: 7 Jun 21
Utility
Substrate support cover for high-temperature corrosive environment
9 Jan 24
Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber.
Shuran Sheng, Lin Zhang, Jiyong Huang, Joseph C. Werner, Stanley Wu, Mahesh Adinath Kanawade, Yikai Chen, Yixing Lin, Ying Ma
Filed: 2 Mar 20
Utility
Homoleptic lanthanide deposition precursors
9 Jan 24
Described are lanthanide-containing metal coordination complexes which may be used as precursors in thin film depositions, e.g., atomic layer deposition processes.
Thomas Knisley, Mark Saly
Filed: 9 Sep 22
Utility
Multi-piece slit valve gate
9 Jan 24
Disclosed is a slit valve gate.
Shawn Thanhson Le, Peter Reimer, Ofer Amir, Hannie Thi Vo
Filed: 28 Jul 22
Utility
Fabrication of diffractive optic element having a variable refractive index profile by inkjet printing deposition
9 Jan 24
Embodiments of the present disclosure generally relate to optical devices.
Kang Luo, Xiaopei Deng, Daihua Zhang, Ludovic Godet
Filed: 23 Sep 21
Utility
Imprint compositions with passivated nanoparticles and materials and processes for making the same
9 Jan 24
Embodiments of the present disclosure generally relate to imprint compositions and materials and related processes useful for nanoimprint lithography (NIL).
Amita Joshi, Andrew Ceballos, Kenichi Ohno, Rami Hourani, Ludovic Godet
Filed: 16 Nov 21
Utility
Optical emission spectroscopy control of gas flow in processing chambers
9 Jan 24
A system may be configured to monitor an amount of a gas species in a processing chamber using Optical Emission Spectrometry.
Philip DiGiacomo, Sunil Kumar Garg, Paul G. Kiely, Keith A. Miller, Rajat Agrawal
Filed: 11 Mar 21
Utility
Use of adaptive replacement maps in digital lithography for local cell replacement
9 Jan 24
Embodiments described herein relate to a system, software, and a method of using the system to edit a design to be printed by a lithography system.
Aravind Inumpudi, Thomas L. Laidig
Filed: 1 Dec 21