3198 patents
Utility
Ion implantation to modify glass locally for optical devices
16 Jan 24
Embodiments described herein provide for optical devices with methods of forming optical device substrates having at least one area of increased refractive index or scratch resistance.
Nai-Wen Pi, Jinxin Fu, Kang Luo, Ludovic Godet
Filed: 22 Mar 22
Utility
MEMS resonator sensor substrate for plasma, temperature, stress, or deposition sensing
16 Jan 24
Embodiments disclosed herein include diagnostic substrates and methods of using the diagnostic substrates to extract plasma parameters.
Chuang-Chia Lin, David Peterson, Philip Allan Kraus, Amir Bayati
Filed: 2 Jul 21
Utility
ma645fg85un1lvyy4b3ujobrh3gw1br7gxmeeosmv4nuxn4
16 Jan 24
Methods and systems for RF pulse monitoring and RF pulsing parameter optimization at a manufacturing system are provided.
Dermot Cantwell, Quentin Ernie Walker, Serghei Malkov, Jatinder Kumar
Filed: 23 Jan 23
Utility
1wkcha9wxcak0gdrrr33heora7u75d5qyo5973a2ij62
16 Jan 24
Methods and systems for cleaning process sequence management are provided.
Chongyang C. Wang
Filed: 9 Nov 21
Utility
jsy0c eph6guyxakv4b8s
16 Jan 24
An apparatus may include a clamp to clamp a substrate wherein the clamp is arranged opposing a back side of the substrate; and an illumination system, disposed to direct radiation to the substrate, when the substrate is disposed on the clamp, wherein the radiation comprises a radiation energy equal to or above a threshold energy to generate mobile charge in the substrate, where the illumination system is disposed to direct radiation to a front side of the substrate, opposite the back side of the substrate.
Qin Chen, Julian G. Blake, Michael W. Osborne, Steven M. Anella, Jonathan D. Fischer
Filed: 21 May 20
Utility
miytq0muunxj70s5ejr7q489b7k4e22q7o6nj
16 Jan 24
A processing system comprises a chamber body, a substrate support and a lid assembly.
Fei Wu, Abdul Aziz Khaja, Sungwon Ha, Vinay K. Prabhakar, Ganesh Balasubramanian
Filed: 23 Apr 20
Utility
uz5ydqzbe2svyawl 97z
16 Jan 24
A method may include providing a substrate, where the substrate includes a first main surface and a second main surface, opposite the first main surface.
Scott Falk, Jun-Feng Lu, Qintao Zhang
Filed: 9 Nov 21
Utility
0tzelkbihkzt5m476tn66q4 ppt63
16 Jan 24
A method of depositing a metal material on an isolated seed layer uses a barrier layer as a conductive path for plating.
Marvin Louis Bernt
Filed: 23 Sep 21
Utility
bs9e2kavs8cu30v6tbwu70dp36sgu nhnlcr30
16 Jan 24
Lithium-containing anodes, high performance electrochemical devices, such as secondary batteries, including the aforementioned lithium-containing electrodes, and methods for fabricating the same are provided.
Dmitri A. Brevnov
Filed: 18 Jun 19
Utility
v2nsra1q1h10xid5vmk86
9 Jan 24
During polishing of a stack of adjacent layers, a plurality of instances of a profile control algorithm are executed on a controller with different instances having different values for a control parameter.
Kun Xu, Harry Q. Lee, Benjamin Cherian, David Maxwell Gage
Filed: 7 Jun 21
Utility
1c9jd1pqogpic5armyqwy7afqry1fobp2kw99zjxpemq a7ft6af7vmj677l
9 Jan 24
A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier laterally movable by an actuator across the polishing pad to hold a substrate against a polishing surface of the polishing pad during a polishing process, a thermal control system including a plurality of independently controllable heaters and coolers to independently control temperatures of a plurality of zones on the polishing pad, and a controller configured to cause the thermal control system to generate a first zone having a first temperature and a second zone having a different second temperature on the polishing pad.
Haosheng Wu, Shou-Sung Chang, Jianshe Tang, Chih Chung Chou, Hui Chen, Hari Soundararajan, Benjamin Cherian
Filed: 15 Apr 20
Utility
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9 Jan 24
Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber.
Shuran Sheng, Lin Zhang, Jiyong Huang, Joseph C. Werner, Stanley Wu, Mahesh Adinath Kanawade, Yikai Chen, Yixing Lin, Ying Ma
Filed: 2 Mar 20
Utility
86lhs8n4itzjy qulptk9u9zhnptmq5466hqclx6eyves5pxvo0
9 Jan 24
Described are lanthanide-containing metal coordination complexes which may be used as precursors in thin film depositions, e.g., atomic layer deposition processes.
Thomas Knisley, Mark Saly
Filed: 9 Sep 22
Utility
v34690cmjna8nfvjhbj0vv8e3kclrv4e61rz0eirnxidnov 39fa
9 Jan 24
Disclosed is a slit valve gate.
Shawn Thanhson Le, Peter Reimer, Ofer Amir, Hannie Thi Vo
Filed: 28 Jul 22
Utility
6ke75cy10hbadhcsdesw7kg74et2qz74od0c2ihh9ku8oxeb5a8pjuh58h
9 Jan 24
Embodiments of the present disclosure generally relate to optical devices.
Kang Luo, Xiaopei Deng, Daihua Zhang, Ludovic Godet
Filed: 23 Sep 21
Utility
5tslzjsqjnw4jikgoub1zv9iue16gv2csp5l0bqig8x5wgv2c
9 Jan 24
Embodiments of the present disclosure generally relate to imprint compositions and materials and related processes useful for nanoimprint lithography (NIL).
Amita Joshi, Andrew Ceballos, Kenichi Ohno, Rami Hourani, Ludovic Godet
Filed: 16 Nov 21
Utility
8ny56isbuuo099k6z8jlj3snavutgmavlfnsf75d
9 Jan 24
A system may be configured to monitor an amount of a gas species in a processing chamber using Optical Emission Spectrometry.
Philip DiGiacomo, Sunil Kumar Garg, Paul G. Kiely, Keith A. Miller, Rajat Agrawal
Filed: 11 Mar 21
Utility
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9 Jan 24
Embodiments described herein relate to a system, software, and a method of using the system to edit a design to be printed by a lithography system.
Aravind Inumpudi, Thomas L. Laidig
Filed: 1 Dec 21
Utility
i0hxcg8beyspjqn2qi8atqu36eebau7
9 Jan 24
System and methods of improving dynamic pressure response during recipe step transitions.
Tina Dhekial-Phukan, Michael Nichols
Filed: 6 Sep 19
Utility
bvhtye3op9ifbney837zfagfwzplz8j2zmv7o78wub
9 Jan 24
Exemplary substrate support assemblies may include a chuck body defining a substrate support surface.
Saketh Pemmasani, Akshay Dhanakshirur, Mayur Govind Kulkarni, Madhu Santosh Kumar Mutyala, Hang Yu, Deenesh Padhi
Filed: 9 Jul 21