7578 patents
Page 60 of 379
Utility
Semiconductor Device Patterning Methods
11 May 23
Methods of patterning semiconductor devices comprising selective deposition methods are described.
Yong Wang, Doreen Wei Ying Yong, Bhaskar Jyoti Bhuyan, John Sudijono
Filed: 12 Jan 23
Utility
Methods and Apparatus for Correcting Lithography Systems
11 May 23
Aspects of the present disclosure relate to methods and apparatus for correcting lithography systems.
Qin ZHONG, Hwan Joo JEONG
Filed: 20 Apr 20
Utility
ienc80f tzupif6ti7qe0szf24mn6ggo0wzevprb
11 May 23
Exemplary diagnostic wafers for a semiconductor processing chamber may include a wafer body defining a plurality of recesses.
Kostiantyn Achkasov, Peter Reimer, Shawn Thanhson Le, Sohrab Zokaei
Filed: 9 Nov 21
Utility
u8f1jssr04nejs895crctkb7d31yku77qdvnaa5968w6n5pk7s
11 May 23
Methods and apparatus for generating a magnetic field external to a physical vapor deposition (PVD) chamber to improve etch or deposition uniformity on a substrate disposed inside of the PVD chamber are provided herein.
Anthony Chih-Tung CHAN, Adolph Miller ALLEN, Mehul CHAUHAN
Filed: 14 Jul 22
Utility
md84s738wnfrs4j0jvxgvvs257o4 2eu4eqpk0e3oh16gb4izqn39tu
11 May 23
Methods for DRAM device with a buried word line are described.
Yixiong Yang, Jacqueline S. Wrench, Yong Yang, Srinivas Gandikota, Annamalai Lakshmanan, Joung Joo Lee, Feihu Wang, Seshadri Ganguli
Filed: 3 Jan 23
Utility
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11 May 23
An article has a body having a protective coating.
David Fenwick, Chengtsin Lee, Jennifer Y. Sun, Yikai Chen
Filed: 5 Jan 23
Utility
s31qlbj2t9ig6bckpu27hgczgixtw6qlrivvc0g6 na82b
11 May 23
Described are apparatus and methods for processing a semiconductor wafer so that the wafer remains in place during processing.
Joseph Yudovsky, Kaushal Gangakhedkar
Filed: 11 Jan 23
Utility
21mzrw5yuksog75lb79vtmmf6fhi2c0rtfjb56v07ivkxtyhnaaqsqd
11 May 23
Methods and apparatus for plasma processing substrate are provided herein.
Yue GUO, Kartik RAMASWAMY, Yang YANG
Filed: 8 Nov 21
Utility
7wvxypjs5kyp5388j9c1n7u6yluawjg0ezj01f5hhol40spq9khmgo3vkhz
11 May 23
A semiconductor manufacturing process for forming a three-dimensional (3D) memory structure and a semiconductor device having a 3D memory structure is described.
Chang Seok Kang, Gill Yong Lee, Fred Fishburn, Tomohiko Kitajima, Sung-Kwan Kang, Sony Varghese
Filed: 4 Sep 22
Utility
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11 May 23
In an additional embodiment, a semiconductor processing tool is provided.
Mehran Moalem
Filed: 27 Sep 22
Utility
0jz306sf55xngbxserajk6xalseiic67tde4cbvlm4qv04kfyybt4ptxq
11 May 23
Pedestal heater radiators, pedestal assemblies including the pedestal heater radiators and methods of decreasing deposition non-uniformity are described.
Muhannad Mustafa, Mario D. Silvetti, Mandyam Sriram, Sanjeev Baluja
Filed: 9 Nov 21
Utility
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11 May 23
In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield.
Shantanu Rajiv Gadgil, Sumit Subhash Patankar, Nathan Arron Davis, Allen L. D`Ambra
Filed: 29 Dec 22
Utility
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11 May 23
Exemplary methods of semiconductor processing may include flowing a silicon-containing precursor into a processing region of a semiconductor processing chamber.
Rui Cheng, Diwakar Kedlaya, Karthik Janakiraman, Gautam K. Hemani, Krishna Nittala, Alicia J. Lustgraaf, Zubin Huang, Brett Spaulding, Shashank Sharma, Kelvin Chan
Filed: 5 Jan 23
Utility
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11 May 23
A substrate pedestal includes a thermally conductive substrate support including a mesh, a thermally conductive shaft including a plurality of conductive rods therein, each conductive rod having a first end and a second end, and a sensor.
Viren KALSEKAR, Vinay K. PRABHAKAR, Venkata Sharat Chandra PARIMI
Filed: 2 Jan 23
Utility
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11 May 23
Methods and systems for cleaning process sequence management are provided.
Chongyang C. Wang
Filed: 9 Nov 21
Utility
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9 May 23
A method of fabricating a polishing pad using an additive manufacturing system includes depositing a first set successive layers by droplet ejection to form a.
Daniel Redfield, Jason Garcheung Fung, Mayu Felicia Yamamura
Filed: 29 Dec 20
Utility
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9 May 23
Processing methods for forming iridium-containing films at low temperatures are described.
Feng Q. Liu, Hua Chung, Schubert Chu, Mei Chang, Jeffrey W. Anthis, David Thompson
Filed: 12 Sep 18
Utility
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9 May 23
Exemplary semiconductor processing chambers may include a substrate support including a top surface.
Nitin Pathak, Tuan A. Nguyen, Amit Bansal, Badri N. Ramamurthi, Thomas Rubio, Juan Carlos Rocha-Alvarez
Filed: 26 Mar 21
Utility
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9 May 23
Disclosed herein is a computer-implemented method for generating calibration data usable for analysis of a sample.
Yariv Simovitch
Filed: 11 Aug 20
Utility
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9 May 23
Extreme ultraviolet (EUV) mask blanks, methods for their manufacture and production systems therefor are disclosed.
Shuwei Liu, Vibhu Jindal
Filed: 13 Apr 21