7578 patents
Page 59 of 379
Utility
Deep Auto-encoder for Equipment Health Monitoring and Fault Detection In Semiconductor and Display Process Equipment Tools
18 May 23
Implementations described herein generally relate to a method for detecting anomalies in time-series traces received from sensors of manufacturing tools.
Heng HAO, Sreekar BHAVIRIPUDI, Shreekant GAYAKA
Filed: 6 Jan 23
Utility
Magnetic Housing Systems
18 May 23
Embodiments described herein relate to magnetic and electromagnetic systems and a method for controlling the density profile of plasma generated in a process volume of a PECVD chamber to affect deposition profile of a film.
Srinivas GANDIKOTA, Tza-Jing GUNG, Samuel E. GOTTHEIM, Timothy Joseph FRANKLIN, Pramit MANNA, Eswaranand VENKATASUBRAMANIAN, Edward HAYWOOD, Stephen C. GARNER, Adam FISCHBACH
Filed: 17 Jan 23
Utility
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18 May 23
Apparatus for processing a substrate are described herein.
Songjae LEE, Avinash SHERVEGAR, Srinivasa RANGAPPA, Sundarapandiyan SHANMUGAM, Ernesto J. ULLOA, Vinodh RAMACHANDRAN, Abraham PALATY, Jaidev RAJARAM
Filed: 18 Nov 21
Utility
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18 May 23
A direct current (DC) power is supplied to heating elements embedded in zones of a substrate support assembly (SSA) of a processing chamber.
Paul Zachary Wirth, Kiyki-Shiy Shang, Mikhail Taraboukhine
Filed: 5 Jan 23
Design
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16 May 23
Joseph Perry
Filed: 24 Jan 22
Utility
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16 May 23
Embodiments of the present invention provide a polishing ring assembly suitable for polishing an electrostatic chuck and method of using the same.
William Ming-ye Lu, Wendell Glenn Boyd, Jr., Stacy Meyer
Filed: 2 Dec 21
Utility
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16 May 23
A method of cleaning a conditioner head includes bringing two clamps of a cleaning tool inward toward a disk-shaped pad conditioner head to press a sponge against an outer surface of the disk-shaped pad conditioner head, and creating relative motion between the cleaning tool and the pad conditioner head to wipe the sponge against the pad conditioner head.
Shantanu Rajiv Gadgil, Sumit Subhash Patankar, Nathan Arron Davis, Michael J. Coughlin, Allen L. D'Ambra
Filed: 24 Jun 22
Utility
wxryive5fmlnjqlod70aauzjy6c00t7tyrxt1gfpxkmx0y99i53p7
16 May 23
Implementations of the present disclosure generally relate to the fabrication of integrated circuits.
Xinyu Bao, Chun Yan, Hua Chung, Schubert S. Chu
Filed: 4 Feb 19
Utility
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16 May 23
Embodiments generally relate to methods for depositing silicon-phosphorous materials, and more specifically, relate to using silicon-phosphorous compounds in vapor deposition processes (e.g., epitaxy, CVD, or ALD) to deposit silicon-phosphorous materials.
Errol Antonio C Sanchez, Mark J. Saly, Schubert Chu, Abhishek Dube, Srividya Natarajan
Filed: 2 Aug 19
Utility
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16 May 23
Methods and apparatuses for minimizing line edge/width roughness in lines formed by photolithography are provided.
Huixiong Dai, Mangesh Bangar, Christopher S. Ngai, Srinivas D. Nemani, Ellie Y. Yieh, Steven Hiloong Welch
Filed: 11 Oct 19
Utility
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16 May 23
A method of generating training spectra for training of a neural network includes measuring a first plurality of training spectra from one or more sample substrates, measuring a characterizing value for each training spectra of the plurality of training spectra to generate a plurality of characterizing values with each training spectrum having an associated characterizing value, measuring a plurality of dummy spectra during processing of one or more dummy substrates, and generating a second plurality of training spectra by combining the first plurality of training spectra and the plurality of dummy spectra, there being a greater number of spectra in the second plurality of training spectra than in the first plurality of training spectra.
Benjamin Cherian, Nicholas Wiswell, Jun Qian, Thomas H. Osterheld
Filed: 21 Jun 19
Utility
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16 May 23
A method for process control of a semiconductor structure fabricated by a series of fabrication steps, the method comprising obtaining an image of the semiconductor structure indicative of at least two individual fabrication steps; wherein the image is generated by scanning the semiconductor structure with a charged particle beam and collecting signals emanating from the semiconductor structure; and processing, by a hardware processor, the image to determining a parameter of the semiconductor structure, wherein processing includes measuring step/s from among the fabrication steps as an individual feature.
Roman Kris, Roi Meir, Sahar Levin, Ishai Schwarzband, Grigory Klebanov, Shimon Levi, Efrat Noifeld, Hiroshi Miroku, Taku Yoshizawa, Kasturi Saha, Sharon Duvdevani-Bar, Vadim Vereschagin
Filed: 31 Oct 19
Utility
0mlyuujo4ib5kfwkwi27yi9i5dyuc5p9ifqawwqhc2pj3s3k90f8sx4
16 May 23
An ion source capable of extracting a ribbon ion beam with improved vertical angular uniformity is disclosed.
Alexandre Likhanskii, Jay T. Scheuer, Sudhakar Mahalingam, Nevin Clay
Filed: 26 Oct 21
Utility
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16 May 23
Methods and apparatus for processing a substrate are provided herein.
Kartik Ramaswamy, Yang Yang, Kenneth Collins, Steven Lane, Gonzalo Monroy, Yue Guo
Filed: 2 Jun 21
Utility
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16 May 23
An insulating system to reduce or eliminate the possibility of arcing while the pressure within a chamber is being varied is disclosed.
Jonathan D. Fischer, Steven M. Anella, Manohara Kumar
Filed: 27 Jan 21
Utility
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16 May 23
A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member.
Stephen Donald Prouty, Andreas Schmid, Jonathan Simmons, Sumanth Banda
Filed: 15 Feb 22
Utility
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16 May 23
A superconducting nanowire single photon detector (SNSPD) device includes a substrate having a top surface, an optical waveguide on the top surface of the substrate to receive light propagating substantially parallel to the top surface of the substrate, a seed layer of metal nitride on the optical waveguide, and a superconductive wire on the seed layer.
Zihao Yang, Mingwei Zhu, Nag B. Patibandla, Nir Yahav, Robert Jan Visser, Adi de la Zerda
Filed: 29 Jan 21
Utility
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11 May 23
Embodiments disclosed herein include methods of processing substrates in a tool.
Wolfgang Aderhold, Boris Axelrod, Maxim Shaposhnikov, Dayal Ramachandran, Bindusagar Marath Sankarathodi
Filed: 11 Nov 21
Utility
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11 May 23
Method of forming low-k films with reduced dielectric constant, reduced CHx content, and increased hardness are described.
Bo Xie, Ruitong Xiong, Sure K. Ngo, Kang Sub Yim, Yijun Liu, Li-Qun Xia
Filed: 21 Dec 21
Utility
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11 May 23
The present disclosure relates to methods and apparatus for forming a thin-form-factor semiconductor device package.
Steven VERHAVERBEKE, Han-Wen CHEN
Filed: 26 Oct 22