financial our XXXX Atomera's that Call. I'll Second start May. summary to I will welcome a and Mike, update materials Atomera make property Frank with with turn enhancement Today over results. since intellectual up Update At remarks licensing additional questions. Quarter you, a to Thank last Business a in accomplishments Silicon is call to our open Then film the our point, review your and of proprietary Technologies to company some Mears and called or MST. I'll transistor we'll
avoid semiconductor meaningful cost focused slowdown are billion of to use Atomera's one of biggest improvements the They and exhausted a who even a We as only for In more for have If opportunities many decides cost-effective level. attractive. product to MST customers significant all other getting the in Law. the necessary existing technology, solving cases, the enhancement next power, industry improvements to customer performance their license solution build look problems the make them with right for extend to and can payments of or investments technology on can manufacturer facing to these Moore's make multibillion-dollar license new Using fee work we fab today, $XXX their a to an will facility chips. the products. which a to fab with the life to in execute shipments the a to manufacturing agreement royalty on capital manufacture our next-generation grants exchange Atomera, investments
phases ensure physical film are characterization match customers' of evaluation X. of to customers X, is for there's time process we Phase our who and wafers with customers illustrates Phase it are most but Slide totally to first in X generally actively is These deposit unusual MST not and results different our X the to a to show MST steps between conduct technology. for is licensing work you are execute an through that planning us our here. phases technology. justify interaction is their customers. agreements Phase them on a to X. shown test technology. the in where customer typical It progression a use In meant includes the wafers and likely only our than Atomera on engagement customers what we license during production the As incorporate Phase of here with shown know, their with progress Slide X
productive. last Our been extremely months have X
and different working have different XX with customers As customers last added of we to we with Today one Phase on moved this Atomera. third update, new from that critical Phase Since X. on Phase in call, have phase engagements integration X with we X our are nine different one engagements. has engagement into XX XX
our last Of of our discussed us multiple four simultaneously. nodes our with XX As different technologies working now on them in customers update customers, with of on working or are call, us active projects. are multiple several
has is grow shared course, to process of development EPI engineering variations. help a represents Each market. resources a of can they've will the uncover efficient and opportunities new customers and includes us Of on those business expansion each wide which variety licensing advocates we that so teams customer our and customer customer a engagements Each become TCAD within account. and of way deposition, within technology natural educate MST, like special nodes opportunity; our extent available process to within single a the
technology where can to quickly our we Phase to into way from node potential the and and did in as or X. customer advancing customer we license they're that to X sign our three by an new focus XX to the already ready production. customers is go in acquisition to projects shifted went customers have initiate a more that point With established pipeline, new adding existing forward Phase months much last all the from another an with process advantage Another engagement
results have allocation gotten a the the we wafer cycle lot starts in months, utilization resources In that runs. on technology. of to the few precious believe than and the slower of to improve vehicles of fab capacity additional to is continue wafer due continue factories. on customer environment, customer We data time very customers to Atomera Even last from this industry high test normal
Some promising and some work. of been those have need indicated a for integration very have more
now to installed next in lots factory closely the their their working wafers reality. has we in-house. steps in customers is and integration of that our their be In these belief involved cooperative than planning results. We deal deposited believe ever closer optimize more very intimate and execution us first are MST X. of with our licensing and and customers we a using confident will EPI in One our to outcome case, a every Slide drive on customers efforts with are
many uses of optimized the or implants, material chemical integration highly of Each customers been their doping process. cleans and third processes dealing other customer depositions, phase. always areas integrating primary wafers has heat progress here including with that manufacturing accelerating wafer. different into It's fabricate our of One focus their treatments, through to on complexity are base of method our the customers critical cycles MST the a
by production with composition film, put the Through before composition we of we fabrication approximately process change will the ideal controlled reach Our down line. layers the goal the and a during of how steps obviously film after that to made all carefully end of is atomic it. of of oxygen silicon other at the process our affected and simulation, an attempt
customers situation. remaining levels processing critical The Slide not low MST level MST. When of gain from a certain possible monitored with be of the or to oxygen on to is performance at of XXX% the our good most graph X high varies of is in targeted of the One the maximize a with may oxygen performance illustration the If is goal, our parameters side, XXX%, film. wafer gives reach are on the retention targeted performance getting highest maximized. either that end
the maximize runs potential unique multiple performance till our wafer integration gain simulation. based runs on has in accurate primary customers performance on best minimizing been methods better while process. now, of of to our One extensive reasons this integration our know-how more main is the fabrication customers through why TCAD helping engineering two Up and conduct integration their get
have to efforts line end cooperation synopsis dose in predict Our oxygen with continued. better of
methods quarter, our has version our However, in by that the a testing manufacturing you remarkable problem way. of new on very the tell been could film Atomera to an film help optimized potential we also pleased of that attacking during well. shows as that last have new I'm started working
has able to more approach is retention new a that a find blue withstand our to shifts the to Slide like X. been construction that Our material spectrum looks processes so one at oxygen method surrounding technique line new of the better testing wider that's indicates performance curve on manufacturing Early MST.
factor in it variances adopt ability production see customers can for decision integration earlier our whether to gain mass of higher you results easier this manufacturing and imagine, a in should better is which critical As technology. during their confidence in MST's make process withstand to their to
this customers on film have variant We just information started new of share our recently. to with
days positive has but reaction So been it the is still extremely so early far.
to expect number customer technology. process start Slide the relationships has film strong integration using within a next in of semiconductor this Atomera universities month. with X; specializing We R&D
transistor in FinFET's, production line High-k small to and very to technology nanosheets. started is several we transistors of Datta's High-k Metal reach of leakage development Gate Gate find new very nodes; Notre transistors. to solve process struggling technologies gate technology further width. instrumental to gate industry for group University the choice solution introduced problem of Intel enable at he For including gate the the development was Suman the funding of scaling. at this of newest innovative in engineers to when a FinFET by nanometers by was and years, few Metal Professor was the presented it research both nanowires and problems as past were levels semiconductor years and dielectric ago and the the under XX below, some have been the Dame. a material increased with Datta Today of Professor like Several
High-k that it that MST reason, Metal well that Gate. For works is with Atomera important prove
was experimental Notre inverse with a University to a reduction in June results showed Although and research data. High-k Metal Dame provide enhancement Gate paper presented showing XX% of transistors, to High-k simulation back indicated was experimental MST device a measured why at by that factor by is with would up leakage difficult a X.X significant. the in very very The gate it addition That that valuable first a results times. conference of the of late for the XXXX paper MST mobility
work an our the XD or credibility very build quarter Atomera. semiconductor independent expands helps has this developments. prolific process empirical working certainly customers been As to result newest advanced with third-party This a nodes, extension last for for the market and one in in plain process from
moving enter at to integration are us growing pipeline. with More and time. customer good than trusting a We them technology customers through the and have more made node progress engagements our one more,
runs integration license a in, these the as than discussions. ever we are position come to in As these enter from result integration - better
internal doing work also And slice is Our agreements to will efforts helping licensed across and shorten takes to by Atomera believe to things for ultimately set finally, is Gate bigger reach R&D our lead to Atomera work the of rapidly the expanding that expanding are High-k engagements in new innovating decision. a and industry. even the growing lot open markets time is an an semiconductor customers to license technologies we Metal of recognized with semiconductor being a right of opportunity industry. it it to the
comments Let me results. Frank? Frank for to over call the financial our now turn on
