ATOM - Earnings call transcript Q2 2024

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Mike Bishop

Hello, everyone, and welcome to Atomera's Second Quarter Fiscal Year 2024 Update Call. I would like to remind everyone that this call and webinar are being recorded, and a replay will be available on Atomera's IR website for 1 year. I'm Mike Bishop with the company's Investor Relations. [Operator Instructions] We will open with prepared remarks from Scott Bibaud, Atomera's President and CEO; and Frank Laurencio, Atomera's CFO. Then we will open the call to questions.

page by our may and remarks of Investor joining presentation a Presentations are our accompany website. to on Relations you telephone, follow you slide section If our on the Events

uncertainties. will filings the obligation laws, we events, session, report otherwise call, uncertainties update call, February will Securities elsewhere or regards note during Factors circumstances. filed most reflect disclaims securities whether are our revisions statements non-GAAP Risk these with to is press on inherent today's in subject are G. I our that forward-looking that forward-looking or in annual remarks and statements. we which like remind measures to to contained make to Regulation non-GAAP measures the to financial Except defined or Reconciliations any and with Before to everyone required the Exchange of as company's with in be on These specifically expectations Commission, begin, during as detailed federal during release, prepared XX, These XXXX. by on herein financial and comparable forward-loo-looking included Atomera such risks section in XX-K and by of GAAP please those changes in to Also, posted are today's conditions the discussing the statements, we would website. SEC Form the make directly risks Q&A SEC this measures

the to Scott. Scott call Go our over President I CEO, Now Bibaud. like to and ahead, turn would

Scott Bibaud

funding been with company. development team of give Today, little recruiting customer a I'm our the to The to outside a Update welcome activity, strong time picture of Act our at new going format submission. Atomera's Atomera XXXX and extensive Call. Good comprehensive usual busy last of on Chips have to few months very Quarter go first a members product results, afternoon, Second

be further where could might take I'd that into a making segments development the there To activity Nothing end, truth. sense a technology, innovative the we and/or customer price, stock license primary and a be significant our investors agreements. from feeling market of progress customers to look each stalled. our are current deeper little the towards Given like JDAs that among somehow are

First, for very power to technology. smart on for with products next-generation solid in Chip revenue royalty MST and progress result making is Power production Atomera a work continues Atomera. their on which closely will compelling release, STMicroelectronics

the as performance excellent is During this we've and with of optimizing in-person this manufacturing The I a developmental you meetings fast teams to tight of mutual process. production quarter, our past developing working device but basis as proprietary had tell information, a remains team goal and meeting of ST's high-volume our highest a We're This weekly that priority. a effort relationship. cooperation, getting can very including have goal on timing sharing possible.

to the are know, you As of revenue this second with belongs $X.X we year. had quarter in Smart billion Power APMS which their group, division, for ST's which working

Power The Chip of in overall approximately billion potential the was segment $XX business attractive. semiconductor of very this the So is market XXXX.

devices and work of represented next-generation the how to those So we MST which their the transistor about proposals could large is our wafers the into and of claimed, attracting spoke towards Simulations ST number reviewing than I opportunity had this with and quarter, months Last customers the of them result a and as and running After one announcement continued large details in their the I just hope proposal our highlight for led even will diversified a of better us has their do performance. to Atomera customer for who decided all spent coming quarters. from showed which has several gains power quite we actual licensing to devices. to us, accelerated integration grow. performance our potential software the technology, significant. license MSTcad by outstanding, of number customers improve modeling MST that has

and of SOI going with market, market is RF challenging. requirements bandwidth the sales continued XX% a the where innovation XXXX growing front makes in SOI billion needs to meet SOI Next, which particularly adoption XG revenue of in a $X.X growth growing today large segment and rate ends, cellular of forward. make majority because strong

my RF detailed solving this among announcement leading on month based a RF common which at step and solution of gives Soitec's Hideki adopt develop Soitec's technology the they MST that is a new is wafers as SOI test in to Our major RF thin presentation substrate easy products. forward, a SOI designers, on problem blog a SEMICON. and MST provided next-gen Putting industry

them Because at in one the device excited down industry. XX% billion manufacturers potential volumes overall than memory or are largest including major commoditized of nodes of in and with solutions of than the it adopted, adoption and help the also asked revenue leading new yield nanometers, address is material chain, higher-quality Once development more with the the the Our segment, legs XXXX XXXX, a gate-all-around Memory provides of nature because down semiconductor higher one by was market paying wafer margin from both with exploring die manufacturers. node at long this are stages space for to have semiconductor speed important other major positioned might our we work the highest in to working which customers the these customers laser-focused potential the size supply leading in RF affect and of Atomera remains development, range. X for could working approximately wafer market. adopters materials the billion the The technology royalties. cost this what improvement even very the streamline of our on DRAM, than highest which us the by industry. into $XXX announcement a after very real nanometers on so We're the X new continues are cost, SOI customers greater somewhat consumers, than is revenue because overall smallest for be Atomera in by DRAM leading various about this potential issue well chips we are technologies advanced but to industry. and them semiconductor The majority which specifically the increased Atomera us. more $XXX will about. for to of the This technology, us the or that to in and segment though, their angstrom XX% historically we Atomera of approximately is late this gate-all-around of our this large is of substrate is logic products. is royalty. market costs, has made market comp, nodes believe

to segments, able said, revolution, us frames how so of announce or we because Our are sector time driving better to performance, we That could and significant website, add at higher benefits. yield. real, when coming the that the MST we MST significant. consumption technology not the On gate of papers lower these is these announce the our and the are provides value devices interest JDAs the will but in upside is be quarters. power variable, we we're large all-around development AI In describing in and might work something have are are agreements license each exactly sure these white specific the hopeful heart for and so programs have the to

a our product full past. MST's manner GaN-related year Now initially yield already the to solve term, update a XX% core team level a hope results interest, business, improve will later near can GaN see of smooth grew as CAGR the the gallium path XXXX. Interest even has another are substrate these relaxing applications to potentially ability I'll release. scaling per investigation MST already through our GaN potential X exceeding and working this highlighted dimension problems under by XXXX other nitride semiconductor at a help activities of as same to layer, material from departure products. other act appear companies It But by with adding a might turn to semiconductor days, in the but believe offering from we in likely to possible compound revenues GaN as R&D be by it GaN is and a into been not. early applied and relationships, customers year. a Power of in the it the we would is over and to war MST alone partners this it relieving billion the of a in covered quality with challenges $X partners. at myriad quick process by in structural go this in semiconductors. existing is is Last potential next customer is still indeed, GaN The Early in be we've XX% that briefly. more Because We customer X years, market increase might manufacturing we impeded days, customers and early possibly high our that our adoption. endemic which on most discussions strong, GaN surprisingly quarter, has posed wafers, us great MST development give technology. the

into quarter. runs a achieved production to MSTcad We from work in on we In continue nodes, wafer in more has negotiations technologies. to these We yet the met some on quarter, multiple X the production not us and including opportunities, we've runs. result. in We have path make a started to engaging with on with hope comprehensive our to converting other license engagements continue move though this to within program active know agreement through MST Progress definitive X, covering expectations. not existing this last working to have that. JDA now company the customers. also licenses however, next-generation that is in JDA with we include process new results completed but Likewise, last wafer licensees the a our

to to and efforts has find do and but we've our build customer Recently, closing hard technology look at to sales try ways to excellent, improve. deals. marketing interest at to develop taken Our to we need better been ability a

Head epi, business. does deep Thomas. of convert the next he Atomera will challenges and of of on Marketing, take help technology, and As Development faces new our he bringing to a more Atomera has Business us successfully and we this to in level. background Shawn detailed help understanding with device decided changes the to into revenue-generating compelling Shawn industry relationships a background the technology a result brings only perfect make to Not start the process, materials have his the

X targeting Friday, SPX, to Before wrapping like a allow our white what a accomplished, detailing brief new highlight summary. released technologies MST XX-volt paper I'd transistors. we've give of to On up, to one called but me we

achieve out with less offers implement better. for semiconductor that one at amazing continues in in MST where our compelling the best-in-class the and confirming is a ecosystem by industry. moving entirely Dave need the industry But used we're by We allows Intel's between is potential many nanometers the lower he This economics technology beyond have to XX% on sense technology even was challenges any crank issues importance at up, it the found X% of show for segments. seeing different channel a stuff. RSP. latest including seen that as that architectures. is transistors in chart Virtually and what high-power We've of At SEMICON across Technology us also cooperative a than accomplishments X, chart This direction performance talk than across team MST finding Atomera makes Power this and require source resistance, financial better the industry and has to advancements is and clear. and from structures showing nitride just what other a The in on improvement and the XX%, X solutions month, working the doing on. increasing improvements Chips. for calculated performance been taking Process our impressive statement on sees work drain next-generation technical the combining published we're evolving examples we're Research, of partners His control, of Atomera to Slide all this that will advanced pretty maker strong This that type Thompson, will gallium mobility, open future is VP today. we've and gave where dielectric West shows earlier the deep been transistor brought validates the solutions effort message the things customer

For company. this our about reason, we are the prospects very of optimistic

proposals base year of, and base. we Our I've the our our time ST hard each before segments potential is many under also the opportunities engagement Sciences is to Act. across several can of starting these top a & the being hopefully, more matter We're potential outlined the and progressing on submitted make turn revenue for into it's business other This very Chips prospects industry, quarter, of form Atomera's happen. of grow working that and next recognized only of that past nicely should Atomera. first of

Now Frank will review our financials.

Francis Laurencio

Scott. you, release of summary our the today, shows announcing market for the results issued the press At slide Thank second close of our XXXX. financials. quarter a we This

non-GAAP QX $X.X decline TSI XXXX, $X.X $X.X per QX million QX which $XXX,XXX, last were results, in million and operating while our the GAAP G&A per million months from and XXXX. QX same decreased increase Non-GAAP in of of net primarily net Sales non-GAAP by compared $XXX,XXX loss R&D XXXX, of for the from QX of or QX of expenses to Sequentially, QX well lower from and $X.X $XX,XXX was expenses in due loss compared In year. QX in expenses. the due primarily was marketing quarter to revenue. that drove And relatively $X.XX Sequentially, in expenses QX XXXX. GAAP XXXX. differences operating R&D a year. XXXX The a loss was and $X.X in our as and sales to due XXXX, expenses mainly loss as GAAP due approximately million, expense a declined lower the lower decline between of with in operating XXXX by as of reflecting of noncash our reflecting compares for $X net which were our approximately $X.XX presented in million unchanged. a closure in decreased of periods first as to or presented in XXXX due million compensation in periods was primarily GAAP foundry smaller factors all was net of decrease the which outsourced $XXX,XXX share. to the X GAAP $X.X Our of QX of the $XXX,XXX quarter to OpEx X loss a our $XX,XXX June headcount, share this XXXX, marketing Semiconductor stock million expenses, compared million the loss were to share operating XX, ended are XXXX and GAAP $X.XX loss each $X.X to here. expense in per net second $XX,XXX to was QX Revenues was of

of QX was $XX.X and equivalents XXXX. at million to June cash XX, XXXX, short-term of cash, million investments compared balance Our $XX.X the end on

the $X.X operating year. the During $X.X recent million quarter, in first of most of to this we cash quarter compared million activities used in

approximately at an During QX, share we $X.X net our of shares ATM in million. proceeds sold under facility resulting per $X.XX of average approximately XXX,XXX price

had revenue we and was shipment million of recognizing a MSTcad months from consisted from customer Phase in $XX,XXX revenue. the services and $XX,XXX license wafers of XX, June in QX XX.X to Revenue engineering balance of of III As of shares outstanding. X

For revenue MSTcad QX, expect $XX,XXX consisting approximately we be revenue. will license our of total

dependent license As previously, with of we've process, will which ability from Accordingly, recognizing on I revenue under our distribution limited schedule this provide is in on next stated revenue have largely timing control. their development the the major grant for of ST completion we ST. license qualification be cannot milestone which the guidance upon the to agreement ST's

expense our to guidance. Moving

spending sales we marketing this and lower Our TSI due than year budgeted headcount. R&D loss in had of lower of substantially account on far and the to operating came expenses so lower

than So our full now year, OpEx guidance. previous in we expect to lower come for my the

operating We expect that million XXXX be non-GAAP of range to expense $XX.XX $XX.XX will in a million.

development In addition marketing at deals. hire, to more least closing business recent headcount year add sales this expect to we accelerate to one help in our and

to back ensure before to we remarks open converting add engineering and few call I'll to planning customers a for up Scott? technology Scott of also over that, our we're to turn production. to support With the all summary to -- questions. also headcount We areas coverage call the

Scott Bibaud

strong many are near more in of Frank. opportunities Thank progress, to we and the convert that make customer you, production continues we confident our into engagements and future. Atomera license will

now business, earlier, base always, form support. questions. ST our today will Thanks, for the other Mike I sustained discussed As first said should that for to while deal. revenue around build exciting a as segments a your help us diversified, take will business

Mike Bishop

Okay. [Operator Thank may comes And ahead question you and go begin. you, of Shannon Craig-Hallum. Richard, Scott. would Richard right from and you now Instructions] if unmute first our

Richard Shannon

you Great. Scott, a here. ask Frank, me few questions let

Maybe last of ST on follow an year Let's here. with a the here. for just important see topic announcement

really you that long Is anything didn't play about verbiage for -- still in to language it far commentary here tell as say how about time that your how limited in expectations what is Or -- can you're or initial you would this relative that would fair the to no you given take. Scott? characterize Your us, in changes you know? that, say frame as

Scott Bibaud

Yes.

I it's challenging that to think a question Richard. answer,

as us about They the prepared So ST to said schedule in this. I the owns schedule. specifically remarks, talk asked not my for

So I I'm an was typical original estimate estimate, what about to which top I then or thought anything after behind of on about company extent saying kind say my either a would they're that. the do running

is we're working both fast to can I very, as And us, together. So very is closely -- this possible, all well. as and working what very I think going production are us into we're progress push that say thing of and them

Richard Shannon

to forward near some that have future. the Okay. at and point final some to more in look Well, news hopefully we'll accept

] of to after you prepared some interesting there? never detail give might of you Any satisfactory other can results. very is to that comment And a getting more before active resident good of any X you've been But negotiations characterization time can offer short. related know you -- suggest [ past. a you normal for be I in remarks what negotiations the the perspective testing Second result? JDA us length maybe here made in a they're that what

Scott Bibaud

Yes.

of and up that X rest mentioned the had ended We good. data call, some think JD did and that very peak some at last in actually we from all, early first data looked we the I see promising. that to look it So getting gotten on of come

there's move this technologies to in And on across that forward sides license And their license try interest a is in any the have they them our of goal into agreement. that both enables really to so our a that or technology to use an yes, company. make to

with a step takes that. the on usually the next in agreement a heads In of of in more to few As in to touched. have very super licenses where I process it's months. time of And companies, timing we then loggers lot like wouldn't challenging thing when because they only a a a that very have It's much they and they places mean large the a decision-makers from and contract, to I say we're with gone negotiating of the can't we've bureaucratic bit had past, is matter reach of time to a have agreement. that at that. quickly say, long bunch pretty others It hard you're working a technologies of licensing that have negotiations, very, hard the to proposal, negotiate get be organize a tend have we to groups take longer. different some case taken different to submit have that negotiated there's

or proposal longer. make much in generally, is turnaround And and can and a so they day to their X us our be any turnaround

to So hard predict.

Richard Shannon

look Okay. one here not forward updates soon. unexpected, on Probably but that

some to good there. So progress see

on Let's see, is question your RF next SOI.

for to few made last like -- results ago on getting timing seems hearing interesting terms this an with closer fair we've testing starts here, the about here. years license some maybe closer and And way the on Is I based pretty wafers. breakthrough you in getting to You getting industry to think it you're the you plus you is a strong from for is so which long? the working guess space a weeks potential seemingly perspective press from I very on? Is on release of the been Or active major breakthrough what call, in the a that this of some majority for wafer to this know release a area. very this press thin characterize of mentioned characterization in early here, just that's going too been tell? in it any especially a

Scott Bibaud

been year, or start down. say we've so that have we that come wafers the evolution to challenged thinner ourselves the putting some In thinning quality issues been on we those the than the SOI -- about I edges wafers MST using years. because over have have and had much it's those in would But more wafers. a so last MST wafers the customers thinning cause ways wafers solutions can of SOI known our on, some they our RF put to RF thin we've of down

this of so be into we with that are something one. think takes make faster? to and the could wafers lab help make move substrates It will. with absolutely important a of I people working very very that out device. Will R&D is production development working those that the a kind it that we're Soitec And announcement thin quality

"Hey, help and production something of is that about substrate kind for for, saying, to will asking provides answer. this this You're customers about. quality worried licenses. tell be it to We work our move there'll know the want you whether were a them whether we're to us can I

barriers And this solution. it so MST the adopting people exact for lowers for

Richard Shannon

were of time of hear. gate-all-around couple Is when here in see big in Or frame Maybe something language could to the you similar that you know the I about discussing if surprise is going take to remarks got gate-all-around which to heard is I don't me. or anybody. time, is more time? prepared for more heard something the DRAM. length Good I'm questions sure being that you've and -- a from some your terms Okay. not in think to Fair specially enough. a predictable? shorter that's that I DRAM something right

Scott Bibaud

Not to every have now, they mean DRAM, XX Very I right tend to nodes months. predict -- with out have easy every, quick constantly a they I they Yes. new come up, node node and volume DRAM ramping to said because, ramping in a a small production. sense advantage focused down into production remarks, node so cost is my in with cost think, but makes bring -- that I the as

believe you So of other DRAM designed with that chance into to get I than do faster the and turning process guys, in ones have constantly get the it's a production their some nodes. because

Richard Shannon

little I'll is you. each makes That follow related GaN of interesting. the here. one that topic questions for you there. bit one sense. Scott, later Very a for Okay. one to Two up last on me, interesting and for Maybe

some comment on the revenues I elaborate at could approaches but year. think how generate was least your the can mean happen. of that of Maybe you to before you one would and that exactly various end that -- them what you there business, enabling

Scott Bibaud

but partners, a a Yes, we're not earlier gone results a this shown of to absolutely. only it's product important first We from understand, we've there's test and results interest. our this is and got I potential of yet. And -- even out lot our think us released number to year,

our for maybe think them those before I the this that of chance there's year. end some we will purposes decent customers to sell be development and for wafers So make of a able wafers

potentially but to people that's going signal for like revenue be have. not what a in game-changing that would it's be it adopting interested So us, very are significant revenue we

Richard Shannon

And or Okay. GaN. ] silicon these on or [ carbide these gain are again organosulfur on

Scott Bibaud

GaN on layers we're before before and on the the what the quality intermediate then, silicon. is the there's that would And on GaN they much is they It's get of up grow and what the grow putting than course, the they that MST top that ends the MST. without grow doing And of GaN. GaN, bunch higher they silicon when we're of a

Richard Shannon

me of and question here. Last for out jump I Frank sense. for Makes Okay. will line

your this Just and a that today, on those a see number rate later to we plus my maybe lower closer the quickly with total here. Or for would more announced, how next new run OpEx, hire couple or for to recent before? should reasons year? here expect think sense range adds year, a the the is, guess number year, I here coming make that question that you mentioned you've you a you had characterize I in

Francis Laurencio

Yes.

I think next that beginning a similar rate going into of will year. we the we see kind kind to of that at of guide the run the gave year

So at guide went when the of that around we million a top had we end $XX.XX into year.

it And the so that line the that will year. guide foundry but you're where in still don't normalizing that would we absent below foundry the of kind kind yes. because -- replacement. it And around remain We to a R&D remains of give $X.X doing of think with about that, some kind back but the big million year, current beyond the as bounce was still of spend and saying think it [ a specific I of I'm to when TSI replacement right was $X the to between variable past, back in at level, million going we're a beginning year. outsourced the have the come our ] not there

Mike Bishop

pursued? obviously Chips is proposals Act, And the the Chips and announced And only about now for while first question being the are that is a the Chips the why question Act the was Act back. one

Francis Laurencio

very the did that last we I'll I involved was in one. Yes, actually. week just submission that take

Chips the of money waves. in came Act So kind

back manufacturing First was focused on of and large-scale chips manufacturing facilities chain onshore. to the bring sort supply the of

had overseas that, a kind still did that was second of a you package if The packaging. reliance for recognition you chip even on big

began went early kind was kind X. an call on compound work interest to to would ones of a technologies, DoD. which in was silicon just very out, topics are such, the specifically a wave talking call move we're still Scott new that that bunch for materials expressed packaging of as an proposals was be of things And of were about. towards that now on just specifically, semiconductors development compound for these semiconductor And relevant seeing areas So and our relevant the that

time very said, expect to relevant So in proposals we be first to That with think partnership we are others. was it I things being those. match. that these do found and responding And the that a we'll more you see funding

among that's going observed more our as So and a interest known these process, towards in us, name we've certainly by responding relevant should proposal, of and gets the something we through outbound what to see for. even hoping agencies, gets we're some

Mike Bishop

Okay.

the push and about deals for questions, why all now -- there pursuit the to been urgency is Shouldn't have close of along. question deals. Another to

Scott Bibaud

mean had I right to I I doing urgency think I we've always that -- we things. were thought the do perhaps all say deals. do we Yes. close think

you some also, and we're been in doing it have would right you and have you to is sometimes sit the going And not wrong, back the becomes right, to changes, going you clear things exactly know changes. those to if make wrong. what's what wrong at point, sometimes And say, think "All And make you have some regardless after I past.

we certain ever have now, right proposals a we're spot. that than more think past. had I in out in that we extent, to say I would

But even and him he accelerate have in talk the bringing team very prior clear before. that will the capabilities our a to is for to very And did people we've team It's go had board. Shawn having of ways that can closing bang on in ability buck so help the now about couldn't. I'm it that a and than bigger that past X.X just that the weeks them yes, excited

make And really so that's optimistic to I'm a difference. going that big

Mike Bishop

Okay.

to ST question formalized what design are do to involved question production? PDK and about have here And barriers another in so what's is they the ST. the And -- the the kit going And is, qualification?

Scott Bibaud

investor show the most don't in ST high think going I players. at for process the deck, to different. production significantly think is of level I a And semiconductor I

results, taking making PDK, on As put you you're you you And and simulations things PDK, that simulation better and process. you're production of And then they're now case, you're where down really tweaks Mike, me go cycles designing a make question, then go number them is good chips have run -- and results. of was you PDK, to where usually those MSTcad where in process and test the tweaks get software then remind good through that PDK. a a make the the you at the run developing And if more several to our more better you're finally, get you point will get wafers in lock through some in of companies I make just to you typically the wafers can to STâ€¦ you and results. learning the trying then you're as your once of running solidify mean, you and results usually, question see production qualification you're into then then

Mike Bishop

commercialization basically barriers to the Yes, in... towards

Scott Bibaud

production, to before barrier. barriers thing any there's level time had think the a is The a of go in do don't goal certain company they I only to course, here. a set would if and effort of this, that it improvement takes of be achieving

the things I think that's that bringing improvement achieve. is our exceed to of had could It's that the doing. customers ability level MST the to they really -- thought of they one big

call a very we're wouldn't I confident forward. it will so move to allow think it them guess you I could that of way. And barrier, necessarily but that, that

Mike Bishop

of SOI, back pushing Okay. time while developments Great. the with market And increase maybe regarding getting probability recent to to RF line. the do Soitec

Scott Bibaud

talking that I market, before. was they about think to don't some make I the to think -- customers they would go our of I improve Richard likelihood as

would be they thin MST could very company on that a quality a like see wafer customers Soitec production in of. top Our deposit this like SOI pleased to offering

and the And don't removed concerns any will pushes it market. think think out. of it I I time speed that's therefore, to But they of time have one so the market to

Mike Bishop

Okay. And do you foundry have on an license the previously discussed? that you've update

Scott Bibaud

in work that I said we think node remarks to on I the our -- And are continuing release. the with them foundry, by moving it into adopted next-generation for technology prepared to process my make

Mike Bishop

update on TSI replacement? an there the is And Okay.

Scott Bibaud

Yes.

for that a process different is them on and of market some us. vendors go replacement, to of What node really companies TSI with different are the are the suite nodes a TSI the So that at do work, finding each us whereas concentrated there's they different we're to as has can number that that had. of looking to services the attractive provide process multiple we

with working will engaged R&D we'll up with like So a we our probably for main we're than basket it multiples that working with and be one of end one, looks more already instead partner. probably of like companies company TSI

Mike Bishop

questions, that up the Scott. And wraps Okay.

comments? So want if your you closing make to

Scott Bibaud

have Bishop, next within to who blog available forward you progress our please Should to to for happy the which atomera.com. Thank articles again news, with being be up. on for Atomera. look questions, follow continue your along thanks, will we Well, for call. and made posts, support, update joining everybody, additional Please look website, investor and to you contact are our Sure. alerts our hear Mike us

Mike Bishop

the you. Conference Atomera This Second Thank concludes Call. Quarter XXXX

Atomera (ATOM) 30 Jul 242024 Q2 Earnings call transcript