ATOM - Earnings call transcript Q3 2024

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Mike Bishop

Hello, everyone, and welcome to Atomera's Third Quarter Fiscal Year 2024 Update Call. I'd like to remind everyone that this call and webinar are being recorded, and a replay will be available on Atomera's IR website for 1 year. I'm Mike Bishop with the company's Investor Relations.

As in prior quarters, we are using Zoom, and we will follow a similar presentation format with participants in a listen-only mode.

We will open with prepared remarks from Scott Bibaud, Atomera's President and CEO; and Frank Laurencio, Atomera's CFO. the questions. open will we call to Then

page If a remarks slide joining by Investor on may follow telephone, you Relations our presentation of Events Presentations you our and website. are the section on to accompany our

to will disclaims section note Factors begin, Annual during forward-looking securities of filings uncertainties risks to or herein to to during those XX-K most and obligation statements are These our make events, Regulation today's these everyone to is press on we otherwise session, Risk inherent G. in whether detailed federal expectations regards and uncertainties. prepared will Before These during which remind Commission, measures update forward-looking we February elsewhere defined non-GAAP measures are the financial company's be forward-looking Reconciliations such revisions with in that Securities required the the the by filed to on SEC Exchange we Q&A any as Report our make that and and release, XXXX. SEC the risks measures like conditions, non-GAAP with comparable Form included laws, this I'd Except in XX, by statements. of GAAP please Atomera call to contained reflect posted are today's in statements, discussing with specifically changes the website. call, remarks on or directly or subject as circumstances. Also, financial

call Now Bibaud. our ahead, President I to and over Scott the Go would to CEO, Scott. turn like

Scott Bibaud

in customers provide memory. right for Atomera today's call. and and I joining progress do activity, advancement. team are the technology comprehensive primary I'll technology last our where detailing customer have I and information segments most firing customer now efforts, can agreements. thanks all as is Today, our progress months and/or towards on busiest that and on cylinders development company our JDAs X as different afternoon, our with picture for Good feel been license the my in much positive making of significant by a partnerships, The

and segment, of over First, market growing innovations electrification. efficiency, the opportunity let's CHIPS. power driven rapidly is $XX for market The compute semiconductor over cost are savings by widely large In and a power infrastructure and drive and billion, is demands go pursued. to power this large XXXX, expected to power, and vehicle be being the MST

MST. Atomera with this smart opportunity and Of generation course, is their the supporting ST new segment in development the most power products ST. more over supporting our has recognize that into a visible incorporating would ST next been for like in been the in of their development year process we for which production. areas and Atomera I are has There where are insight investors of in main X now, exactly transition

validation achieves runs The silicon MST. real been integration been through first the has quickly correlation depend and required modeling has on is MSTcad The underway objectives. their silicon of performance number confirmed of over times. This simulations year for to silicon hardware multiple design with how between a and optimize ST on will work

to to Indeed, Second ST enhancing is that still compelling gross will qual as by deposition production production authorized go manufacturability say MST with on are area that we and track on that project of development I tools. great shape. ST's ST in in which throughput be revenue for that soon time, cooperating want factory we that to is going has expect to emphasize me this well we Atomera. royalties high development complete. as At are margin is are and

volts, this company or XX cannot it control. ST is segment. with not that entirely technology under the Atomera's I As comment only in MST-SPX prior applicable to on is X to except voltage from ST's ranges been say statements, schedule timing meaning improvements. with XX%-plus, players to typically is working When a that this we've a MST can we for there's them few demonstrate customer interesting legacy is performance applications. technology help will Since of variety knobs usually to different gain interest. big that many strong bring it's with relatively

And will We with part proposals in right hot to and enter discussions currently has led improvements provides centers. on a either multiple version license JDA about efficiency up the specifically production. One technology quarter, its to is into which market best can particularly outright this a of are customers the to our war power the to data segment. to or lead by we XXx, now has dissipation Traditionally, created devices. data server have potential bring XX that higher supply, address of that to finalized reduce fed efficiency due been just Atomera. improvements a In to new last volts compelling can SPX XX-volt AI-driven technology the for have further opportunity are power power factor volts. to centers standard this of of Accelerating by performance but XX-volt data with to a but starting, dramatic currently XX those racks chip need Atomera power for is demands it deliver to a centers. Introductions customers a optimistic and changing a are ultimately to

these market node leading more in epi. to technology $XXX a from billion work extensive use materials advanced edge, in the on engineering Manufacturing widths line transistors for and the have gate-all-around which lithography represents has particular at of at advanced primary solutions XXXX. about shifted focus we Next,

architecture to easier epi primary significantly more is shifts FinFET it This MST performance. triple. steps device from the makes trend add improved process device to flow deliver to to the to number gate-all-around, the steps of than epi As incorporated projected into

of device step. existing to it becomes insertion is technology slotted cost since architecture, to MST flow, critical the door the more epitaxy step introducing production an a component a our the As into more to incremental opens as epi easily being MST MST standalone compared

significant add, production advanced node technology believe to is easier benefits. an can we being where MST to addition area In provide our

particularly Robert the at in provide to formation as recent application, advanced phosphorus tool ECS this source PRiME the a presentation dopants, detailed structures, of Mears's Conference. can drain for Our block ability critical in

With tight today's newest one of market. solve will yields high and has of meet which believe a that to the production the impact channel on GPUs help in this incredibly we of problem, direct MST challenges, number to can cost have transistors, central the can manufactured the demands become lengths be and AI the obtaining

market, valued we Business production of more characteristics to the to in Similar multiple are drive device or a XXXX, this believe targets. memory the common for materials on to costs. the in advances background a in because over hyper-focused epitaxy drive the they billion to $XXX Head segment. relentless customers into here, to cost will Today to in can engineering meet smaller similar working platforms material new node segment, case, node benefit it's Our has node segment, they except introduce area. The logic this market gate-all-around, he growth meet sizes, even are to in low beginning with performance. is and Again, a compelling commodity has structure, advanced us lead but many yield we are Development deep platforms, advanced to with turning in at memory it advanced

while the epi epi and flows, the delivering gate-all-around, cost MST device benefits. incremental introduction adder performance to an becomes memory substantial cost into of Just with steps as the

long volumes semiconductor for we royalty. and with potential this it margin customers, space the is potential the of technology about huge with excited die cycles. real size, are our provides in paying believe for even working area. opportunity technology entire improvement And a performance, are in the very our industry, after because multiple this and We here at high we XX% Again, approximately customers us

a another believe is MST. advantage we we possible potential excellent with our Finally, RF-SOI technology to achieve is don't where segment for performance provide without

silicon will has MST to substrates. agreements or transformative negotiations JDAs segments, within can of Nanotechnologies that silicon which built near Center the through on continue license of Earlier Indeed, proven shown to customers can the State which the on on that to we technology. the hopeful next representing we've made We convert months. Recently, we few with announced that customers we stresses majority as to Integrated efforts an the these quality, agreement today University we the it Sandia we our this with shown substrates, agreement into be Texas improve further reduce In future. will with are proposals will Labs the RF-SOI each work crystal like GaN and an able on optimistic on induced believe devices those in supply work National are for at company, the be manufacture are slide. tests announce of for we during in physical active of

lower our are validate for sizes the to faster this and Sandia Now, expected, about to than of the a that because the rapidly-growing low-cost step and announcements work who wafer if lead dramatically hope believe manufacturers silicon we GaN business, larger technology help improvements silicon, GaN as will alleviate. high converted anyone engagement come GaN benefits. help will may interesting though. that into up the physical revenue is be valuable to time to higher experiencing be GaN and technology fabrication devices defects, Those no market quarter. manufactures market. Customer stress out it. bringing can developments electrical convert further yields periodically on last be us of wafers substrate GaN the with the to going future mistake, R&D our MST intensified lot is will to which A has in we devices, traditional particularly production. Make to into volume, the of with to The speed MST works with we on will take and

sense very than for with ever. need and is large stronger We that customers, lot are a I engaged the our technology of

multiple and specific demonstrate from to requested is to how effectiveness deals. MST's nodes JDA cut license recently we let we MST although are like. ongoing, slowly X has and wafer and negotiation quick Discussions already address company-wide give additional a with validate update this me chase data application, their technologies JDA is than in a would on more to So spanning runs can planning about moving the X a prior requirements. us

has licensee program transition wafers will fabless to both if and partner. Our believe And foundry their strong, it imminently. production we those lead a results with coming them out are

large life, ST the production, proposals about believe I with prospects is has long the to seen. today. in The is team with transformative have I've with Right others without towards nicely more customer an our we moving ST business ever projected engagements, these addition exaggeration, is which a now, negotiating Beyond Atomera which than engagement, are confirmed. we several excited outstanding enormous

directly tied even that deals which the doing and revenue the work executed announcing driver very it only to industry faster AI the semiconductor gate-all-around larger, in and industry memory cement segments GaN Our is I of we're also And the potential will is close The outlined to can infrastructure. our push, is rollout are than we with feel position. biggest a of time but be to major work today, with believe not other our segments. aligned we in

time on And be an of to us, will at in opportunities support So exciting the is to Atomera. front to can the we grow business. today need execute if all anticipated we

our will financials. review Frank Now

Francis Laurencio

Thank quarter the At announcing of of today, market summary for third XXXX. close the financials. issued our you, this And press our results slide we shows a Scott. the release

which periods million million $X.XX ended non-GAAP was or operating GAAP net QX and by a GAAP or R&D $X.X share, million and and million smaller increase third X operating increase a $X.XX was this sales compared QX, Sequentially, net Sequentially, this our marketing, quarter OpEx an the of quarter the due marketing lower. by due $XXX,XXX and in this million in increased results, decrease of non-GAAP XXXX, in expenses was QX to marketing loss loss which of in operating headcount. increased lower and due between $X.X expenses and million, expenses decreased operating and outsourced a with expenses. The decline in GAAP all XXXX. In $X.XX XXXX mainly in September net lower to the approximately with of in a of of our QX this sales mainly in loss compared we've our loss Semiconductor, $XXX,XXX in QX $X.X approximately G&A offset loss $XX,XXX for QX differences $XX,XXX expenses year, $X.X while a and to million in to months decline QX sales expenses per share. combined X closure year million, the $X.X net expenses in due due Revenues expenses, and GAAP of $X.X share, and QX are year. part the XXXX. XX, loss noncash $X in in year, to being QX to GAAP marketing TSI compares compensation QX as $XXX,XXX from was to due by of in XXXX, primarily in to $XXX,XXX expense. were $X.X $XXX,XXX XXXX, G&A per year $XX,XXX revenue. in of million, of to This from QX $XXX,XXX of The in expense of decline of were QX $XXX,XXX loss was increase $XXX,XXX of was in were of of in XXXX. in $X.X year, GAAP the QX slightly. Non-GAAP R&D net to XXXX. R&D presented million to was XXXX of each a in primarily R&D in XXXX stock our this in the over Sales declined year foundry, first And primarily increase and $X was and QX compared which Our expense reflecting

XXXX, equivalents, of and September of end to on million at $XX.X million cash, cash compared balance $XX.X the investments XXXX. was Our QX short-term XX,

quarter recent most cash the to the compared $X.X million in used in During of activities, quarter, first $X.X we million year. this of operating

price at share million. net approximately During sold QX, resulting of of shares proceeds our we an XXX,XXX $X.XX, ATM under facility approximately in $X.X average per

is and XXXX, consisted in We're approximately license be providing under MSTcad revenue QX in with control. occur this ST quarter, agreement was the revenue QX. we And ST's consistent As in remarks, expect Scott revenue. as they will we complete of outstanding. Revenue that timeline of QX our XX.X as the major XX, milestone next his the and process, will $XX,XXX with our beyond information normal shares in million said which, practice. The September guidance revenue same qualification our proprietary is had not when

$XX.X expense our non-GAAP to million of X to of for total $XX.XX full range million first $XX.XX incurred guidance, which OpEx us of for months has year, million, during the of year, expenses the Moving we track below this on provided most services. foundry a now, continue utilizing we expect quarter. the investments our last process you ways in sales can of and we guidance to I We're we explore marketing, planning but make to additional tell the effective in XXXX outsourced and operating

So our likely will call. in update million. in quarterly higher XXXX in year, be the this our non-GAAP than on million of this $XX We'll range OpEx $XX to provide more next color

Lastly, attending the but I on submitted or the NSTC. semiconductors, to decisions no related I'm National on and Technology that compound the been Symposium update especially Centers, yet. we Microelectronics proposal is timely since of our want from of July, our have today's In a to Act on work Semiconductor Annual and funding Washington, made quick other where GaN for the call efforts CHIPS Meeting topic This D.C., I'm joining a Commons give funding.

Act, announced departments. With for our is for turn the will compelling I late Everything government applications before various up CHIPS the QX remarks the are few call that, back the and summary a over questions. we QX. to We conference that next RFP many under to technology open of Scott the there call Scott? for in the will Atomera at be I'm phase or hearing funding and confirms opportunities expect

Scott Bibaud

hope story. have part momentum is the Thanks feeling. time a lot, to From exciting very I of of now today's the you Frank. call, we're Right that building a Atomera sense a be

several we engine the top by on Our in very your to It's Thanks, some industry base the take of build revenue ST support. out for with form hope questions. biggest our aligned and we that growth a being Mike, trends as technology of strong always, should the is with sought industry. perfectly will now as players foundation. And

Mike Bishop

right. Thank you, Scott. All

window, to them a you the call then to the to of could would feel to your Richard, relay Richard And unmute, button do and ask you management. right queries best the Zoom aggregate button, you from If to first you question question and free your Craig-Hallum. may bottom click my wish incoming pleased Shannon ask Alternatively, kindly at question, our question. Hand I now Q&A we may begin. you in of comes on Raise the type click will the live. if

Richard Shannon

see Let's my here. I one for guess is first Scott here.

just You idea be your a this of us closes. but made on prepared exactly Sounds I've situation. active could what a in before it the could wrong language Maybe months probably like Any statements very little remarks you in got on means. it more bit here, interesting about a conversations, technology and give number area? transformative detail

maybe detail but bit a there. complex, I'll more give follow-up. us a Sounds have little probably

Scott Bibaud

Yes.

transformative, a significant we with will production very for mean I So, could if what large provide really, us. this is say guys, I really into I potential by that interesting position revenue customer financial guess would these get a with

Just potential we if revenue, there, then company deliver look is will revenue, we've certainly great if could with working can very, them gross compelling at and for with that about margin for feel and high some We business time. for work us. and that large model be the you our a business been high very very

much But something in, proposals say I about. excited the into active that it's we've the proposals we those give of is it working been to mind for makes have we've of we timing. before, said can they're or the don't and past, say can't that companies one unless negotiations. This had really quite about gotten quite together I we've we're a outstanding As we've a sense. segment in that and meeting now while, the

Richard Shannon

up second. to Okay. I'm in maybe a ponder and going those follow here thoughts

in to very detail funnel. others down first you've want areas is area obviously here with I progress transformative seemingly into, moving across have that bigger a ask questions that the degree expected you're XX by people half potentially here and give like can far line in it's amongst announced Maybe We this and got and towards I be or about situation world finish bleeds think you any everyone a think, very in to top largest there. the point. to the question the amongst qualification. could semiconductor talk a good get companies an of that would ST funnel with first Micro I to see But the the you think which technology funnel, to you the seeing which you maybe that to timeframe are get if if that as think ones completion with

Scott Bibaud

Okay.

Let me do best my here.

require hopeful performance the run to with make to their need to So production. we're the progress in that and say the node. the forward We get make funnel, is where that I of is once work obviously, that ST they've to where them this go level very always into long We they X, in more lately Phase customers gate-all-around node segments. there'll X, customers of falls for technologies them change amounts category. in us companies, nodes. achieve the that The faster, that they X bit move engineers us and when about working they of to would a then we've move a a but with that of process get to X. point decision longer and push to and to memory, they with to that experiments they they're decide Phase to massive big pushing with, these customers a And and legacy that talking have they're they some thing there's them, through doing of the many one would we They believe believe making faster take Phase are they constantly say there's experiments they'll huge time teams one resources. ones get been longer many And have such we installed know And in ones they process those that. some Phase their are of good been take that ready X, new the But noticing market. their them. in into we're time. will like and and have The we've data, change, production. I we in today and Phase those fab, talk advanced be lot working so to in primarily on side because when for point any to we on at we're in do active of wafers that do the more more in production people about, ask technology

bit have now. we we have a of insight different So the that with that you work going right into underway gives the little many that customers

Richard Shannon

that. up Okay. I A of want the guess there, couple a Maybe I areas on Appreciate interesting Scott. insights on touch here. of to RF-SOI. let's technology couple follow

RF-SOI hearing that in update potential here, an overcome of much the of space? give and in or talked obstacles conclusion that forward be terms been the people potential pushed seems eventual are --at for that Maybe years least was technology that towards thinner wafers, factors in delay we've about goal to towards quarter my ball one that number how the other moving I in here there think us an you now. or two with about industry of has there a last would when been of advancement the going have significant to

Scott Bibaud

market. ready no just say announcements to to to this making to next and No, latest the announcements. will where regular I customers about, level is I on with has progress, we've that hopefully we've case performance these in working forward, to point results point we're is are making to would our the but that move the latest engineering good we're start wafers the of the the customers there, Soitec would that continuing and lead take thing technology in some where greatest of us getting they yet Earlier area. an unfortunately think the them just working to that so this wafers. agreement they talked identified type to that and bring And our --as with a to tests make more industry run use announced we could been thinner year, to sell And

Richard Shannon

the I last Two Okay. line questions of for here. jump will out me, and

see Let's here.

Sounds some guess the was question and made probably I to the the maybe --and is both going your more a alike. fabless here. side, on with And referring that I interesting this work like memory the comment side there's but But progress nodes advanced ongoing on both foundries the logic think you logic is and players here.

Scott Bibaud

On the advanced no. node,

the people we're For who the manufacture ideas. gate-all-around. manufacture they gate-all-around on let's part, days, working partners have, only foundry partner ago, that Years used would help foundry much with most as the as to you nodes, could to don't with and guys really is work their the with advanced upcoming these their to say. they influence But so complicated have fabless influence

the to targeting factories run who these be primarily we'd folks are the going so, CHIPS. have And that

Richard Shannon

Then JDA my hitting X last just on question, specifically.

your with Sounds you customer about relationship the to back being business Wasn't like here. to something the based groups moving some comments there's going been and whether there. engineering Maybe clear there's and specific good specifics there, in get please. if to trying touch on progress made getting some could to central of on forth me some

Scott Bibaud

validate with set we you the now that bring had a past. say level, really request the in to the with difference have out in address doing that some you slight give application. XX we've a the a to a to know, the can on central in that Today, technology you proved we're deliver X a for very data of that company technology, metrics that And engaged they of they first know pieces this. solution. that I is have from to them And requests of performance we at getting, certainly as they typical we I we it's do engineering And that we're all of say, our specific approval to then customer inquiries there's more a Yes. doubts. this specific very showing, of of for And what JDA and can actually blessing want their would lot would a use. application hey, data our work it people gave shown of course, the

now. And so we're that's right the in stage say I'd that

Mike Bishop

All right. Richard. Thanks,

a dive We Q&A just and have number the in in. questions of I'll on line, coming

recent first in to announcement related July? The the Labs is CHIPS Sandia is, the application about Act submitted

Francis Laurencio

it to No, technology. it's of take independent us is one. up demonstrate which another think because that, avenue that opens the for GaN I'll Yes. great I No, It's not.

did With one Act semiconductors. of other to was in MST relevant compound GaN, we opportunities, submit the CHIPS to also applications that but

wafer perform we actually electrically terms on to the found silicon that how, we basically, rapid a So give building get on actually on GaN substrates show in had that that better there. improve to a could we would MST program to proven ability But on created of had we by addition at the devices bit test improved. us stress out little in and benefits better on physical more the they building qualities something a on in because color all that's Sandia, would window silicon in they we under at and worked of quality of GaN physical GaN device you Texas State, when a had to those Sandia State, when being built was built access that. What a perform testing to Texas had with how start no

customers where to but prove Act nice about offering. make but us, seen opportunities thing compound is the is I can also last funding thing we've there. the spoken our other to and are GaN there is the several funding, the there and cost both commercial CHIPS more that have many you tell attractive at I And that what out us So for we GaN for no gone Sandia semiconductors opportunities for about should work

something separate. to But that's continue we'll they So pursue. are

Mike Bishop

customers the there's the all And questions currently in regarding for through in folks wondering in, proposals pipeline the are --if proposals the if And we phases example, they're pipeline. outstanding currently have and X are X.

Scott Bibaud

Pages X through X?

Mike Bishop

Phases.

Scott Bibaud

Phases.

are Okay. all they're that, Phase are in time. our work X, in They're doing that with we've been all would they are say current for some proposals of are I not in pipeline. our people Yes, with But some all not, yes, X. that customers Phase

Mike Bishop

And address Okay. funding plans want you cash questions and there Do about to Frank, then needs? the are outlook for for funding.

Francis Laurencio

Sure.

levels. in the fact our was we and given with what pretty did the months ATM than in the cash just more last we any XX balance seen my the a balance selling low GAAP we the to to quarter That's stock plan than we that have would We under You close requirement the cash a And historically with shareholders minimum didn't to want stock of to end not we in June. be at greater in financials accounting. obviously lower had ended under have to, of a of we comments at that diluting future. maintain the that program than of balance spend months number need always to the

that's So we always the will that to to extent stock that we when that. the we be conservative maintain. can relatively do balance the low, going And appears more be to price be

Mike Bishop

follow-up looks another you like question. Okay. Richard, have has did It Richard question? a

Richard Shannon

voltage is let me Very broadly well, the that -- with degree that's on what To familiar regarding here? you're that the of servers, that Scott. here. Scott, here. your to space to Yes, follow I guess in interesting end this And couple this related stop in comments XX-volt want across X just I power do. there, to versus a XX-volt actually, at ones to questions in of work more your we're going specific to reasonably I then range. on point, one the dynamics up doing prepared remarks range

Scott Bibaud

most in the it talking volts while as to industry in XX been high of had saw really about technology end interest the fact, although was for now. earlier volts, of XX we from probably that our little We've Yes. not volts. a SPX targeted been And the X high as

specifically XX-volt type for Now there XX the stuff being would that tied but But opportunity power the right say, this been the modified That big requirements. actually it's is, for to to specifically started the centers. other opportunity is be used for I a it's while, said, in of center we've think by XX-volt the volts. it now. And data structure about we yes, at talking transistor expanding I way, located SPX very same data

about excited starting -- it's from gotten a XX volts. will of talk rest results So good be the at to show it. around but it slightly really have we've this today. that to attractive that doing the it's really we're just but different is lower efficiency about customers stuff I and quite testing we're optimized I'm the people, little in improvements say, The voltage, I to the to family, the think very bit than it's

Richard Shannon

you're anything question, least I you've back to here, you timeframe to jump legacy license if is a concluded, get with other help to about legacy or moving to And in in accelerate of than Okay, nodes here excellent. nodes? discussions this is up relic at to newer following can just Or that seems more guess, any line of like yourself where there insert the the your I'll and earlier a here, and seem My forward response on out companies trend that. of to to Look is get forward that stop questions with trying one let is nodes to here. way? past to there. me with working you've hearing more do my here be delayed production into seen or

Scott Bibaud

to they're to we they the hasn't production, their it have say, that probably drive to a We some one to with some are get And right? It as that like. of belief companies to up and whole question companies development ST efforts we've as that start telling also, into have going think we outstanding accelerated but No, power, board when as as entering would a out happened developing has is been do of to believe happened, hoped that already it well, had in this, as proposals be make we that, customer got that with hits those now hasn't we it it at SPX our got would. And it's And okay, announced going and what on I that's that of a the have great quickly competitors we would example, people, across the big market, the space. performance. doing I it. for level because on bring was okay, we new When technology, going difference.

really we'll process the really working By if didn't history XXXX XXXX, XXXX. until work experiments. of new we to in end about get some then on think ST results goes did And node start you factory, ST, more them. a the we I or between back had shown my So with new the think of excellent COVID started building they and We belief. But with even before production. yes, That's them XXXX.

time they So go take production. decide that to it's long not once to a they

slightly part volume running the node to that been year. to a some that's another to time, change up come process maybe slower, that I but node going production. old high for to every in But doesn't legacy think an similar is make decision

And have to we that happen. to sometimes for so, wait

Richard Shannon

right. All Okay.

of I think that jump out makes sense. line. I will

Mike Bishop

relationship give question And is prepared two addressed more here. ST the is to progress? looks are add there comments, or how you could a comments right. one are All but the us in questions more the like generally you sense The of going and

Scott Bibaud

me a about few let it. Yes, things say

of First company excellent to work ST with. all, is

I invented think technology, on. is company our what they the running that SPX were which BCD is

other with executed well of products. to And as some the we've we're going the of best working enjoy with field inside constantly already I the obviously, the really and ST we so, be some type have been where Things experts well. in that And started land-and-expand able we've a forth technical think back with improving so be here. ST strategy also to groups working

And do to product. with And so, hopefully, we production could it's multiple get that business we even units. business to our the we'll into before to able first volume possible expand them be

with well very going them. are things So

Mike Bishop

XXXX? some question. were Okay. PRiME And results just you the silicon final one gate-all-around presented at comments on Can that provide

Scott Bibaud

Okay. quite doping a into high In where drain, that going be to gate-all-around They'd channel drain, go then at at explain -- the to It's it's me they technical, and a phosphorus PRiME and presented okay, let very but one all. or that of we it's source source any this. doped things like XXXX don't want into low won't so drain, it it the such can the if almost or dopant that circuit performance to the the enough, cause between free. at difficult a that channel. from is the highly channel actually are diffusing And Since small, diffuses it's doped, phosphorus which into yield. gate, keep device the least source structures and short

believe having phosphorus putting So either channel side flowing that performance. into shorting source that prevent the be by will and a we and that will MST product. We help that the between from lower or interface the at channel low-yield

So, manufacturing. will to higher number it lead when it performance. yield will even number one, they're believe, the in higher But to more transistors help, we manufacturers importantly, a gate-all-around of

that So, of in that's we're applications we several that to one gate-all-around customers. promoting have

be diffusion publicly, bring slides soon. Robert's may talked think it really case, in blocking from available benefit or that they any I that But that that about. will available publicly can are I conference show our

Mike Bishop

Scott, right, up wraps Q&A the I All session. think, that

with You may closing remarks. prepare

Scott Bibaud

All right, great. Yes.

forward alerts, up. look questions, our website, you to again of and posts who'll all I for Bishop, follow articles, to look say news, to investor our want Atomera. just please made for update be Please support, Should to blog contact happy First all, Thanks Mike the our on progress along next with within being to your which available, call. we and you to forward additional have atomera.com. are us thank hear continue joining

Mike Bishop

Thank you, And Conference that, Atomera Call. concludes with XXXX Scott. the that Third Quarter

Atomera (ATOM) 29 Oct 242024 Q3 Earnings call transcript