ATOM - Earnings call 4 2023 | Atomera Incorporated

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Mike Bishop

Okay. We'll start. Hello, everyone, and welcome to Atomera's Fourth Quarter and Fiscal Year 2023 Update Call. I'd like to remind everyone that this call and webinar are being recorded, and a replay will be available on Atomera's website for 1 year. I'm Mike Bishop with the company's Investor Relations.

we're format and listen-only with quarters, a will mode. prior presentation similar participants in using we Zoom, follow As in a

President open the We Scott to questions. Laurencio, prepared with call CFO. and Atomera's Atomera's will will Frank CEO; we remarks Then and open Bibaud, from

If joining on of section our you Relations page by may presentation a slide Presentations you accompany Events our and website. are our to remarks telephone, follow on the Investor

today's President any and to Scott call prepared like These measures report required obligation as of website. company's Before forward-looking contained specifically, the changes will or the the ahead, to filed Securities also to our call, the non-GAAP Exchange included measures that note comparable SEC its financial posted Go most or we we filed during XXXX, be would over make in turn with XX-Q November of everyone Commission, to is revisions on call, I'd to forward-looking CEO, Except these today's securities will on to we statements in events, with reflect regard and like as measures to Reconciliations discussing which XX-K in risks Bibaud. financial forward-looking whether report in circumstances. elsewhere non-GAAP that, remind X, such to And to Regulation with Scott. SEC release, Q&A G. please are our are annual detailed begin, otherwise remarks the and February GAAP press the our XX, directly Also, These update laws, on statements. herein uncertainties. quarterly expectations defined those subject uncertainties with disclaims and by Atomera inherent on SEC conditions, risks during by this federal make and that Factors with I Risk and the Form during session, Form statements, filings are or section on the XXXX.

Scott Bibaud

XXXX Good afternoon, at I announced and the welcome believe that the execution our to deal Atomera's that was XXXX, fourth Year and major we catalyst where consider year, back quarter our first Fourth when we will mission drove will success that it and of Update Call. Full our most where business be became Quarter obvious. look

addition, and strong in R&D In customers in partners will commercial results that ultimately excellent we've seen licenses. and from more result advances

but the and first, We view details, give of status let you will industry dive Atomera. flex to into a the me how

the was strongest industry, and XXXX characterized in know, growth in cutbacks by the in not semiconductor year some negative you plans As slowdown spending. CapEx

the environment, is usually case this interest activity lots. we in plenty of R&D saw new in fab type capacity of design run to As increased and

growth artificial optimism much we as are XXXX, more intelligence As we seeing start driven enter new to capabilities emerge. by prospects

big ways. that news In We customers' but the time announced we really will to flow are benefits expect our last are commercial quarter Agrate, in of several to agreement was a new in at the license Atomera of year, in Italy. our case installation with fab April STMicro's important name, technology the STMicroelectronics for company you our was which of development is to happy see adopt see for improve, cash MST. the Obviously, fab to we this rates, modest since the This customers ideal business utilization prospects. our still

First, truly they customers MST brings it the capabilities. appreciate when value to our that business its and validates model

take respected an industry is production. it MSC decides a to to when to certainly IDM participants Second, important signal large

they same considering. criteria, their going are primarily on Although are decisions are management feels the path leading more always engineering comfortable other companies technical if that down

with customers shown here. as our represented have We to in phases, always MST production out X

could that before in rough year, a our install. waiting installation last We call, Phase happen and completed. ST items includes we quarterly X great been process we boxes to update installation felt with out start and approximation Last after the the at productization. This shows ST, slide of quite both a modifications that are For representing it some where for would equipment happen did. period were short we certain the have

look steps in the more Let's at detail. remaining

we MST CAD. call new Our triggered tool which progress since IP truly November In which tool MST on after to developing Engineering own necessary May, start we simulation includes critical using provided ST remarkable. early a been our last Since complete, TCAD, EPI called upgrades last has announced XX. update with wafers, been the November, also has process ST our team their a the manufacturing were making milestone revenue

deposition Although revenue Christmas. able manufacturing pass to we've ST their the high-quality triggered will process could was MST to which fab, point will their is technology be own can at with our milestone. EPI guided PDK, wafers team a has on more take time that we us design January, development be learning in-house, that installation to get the their their used MST Because ST up of that they this entire the process process manufacturing providing EPI allowed should grow ST helping and quick. which it. validation. or the electrical optimized formal cycles technology created in satisfied months, completed both accomplishment always transistor and on fully MST This the When their all second optimize silicon for to in kit, integration. ST, wafers trained which criteria to acceptance In now lots team freeze before they of MST is they've stage spent a installation started X this

PDK X. be clear, consider through effort from this entire part installation to to of be we Phase Just

latest features. available, on new design engineers until pent-up greatest designer, new this is getting PDK new with the and off PDK designs experience, a chip a becomes a like the chip For my newest demand will hold creating software all starts. In for

in the being prior complete. developed chips So parallel be we expect with Qual even out may case, will some process in qual to this and multiple take that

time, several It's to us installation, taped next to Despite percentage believe PDK they designs and many start announced years. rates. imagine, forecast you their designs we significantly. of will will be MST-based delay of be the first market on this believed timing applications holds. as volume new and still because for years, generating that the fab sectors can transaction, enter ramp will difficult will the based to over chip in get these this we in years in But different will X.X SDM increase starting at we and designs could production out different X For and commercialization the in When royalties.

out our control, are ensure to is successful laser-focused is production MST execution as this everything we on we as ST's doing as of possible. of much rapid Although of can ramp and

as is to the getting priority top production. Our company more under other same customers a path

So now me there. let some provide updates

is working get those end-of-year program in this continue, which As needs. showing we putting under the applicability can but X a are you of spoke the our priority and a down going you quickly. the largest this moving can pipeline, lot very meet holidays business ST with JDA hood. more X, but working our the will still on a we there's see growth we together us, installation, but we excellent I had high In for both Phase results one slowed BUs. their call, to from discussions, to reflecting arrangement, assure its Development last are we efforts about our customer customer on more are the and

area. results to Good their be JDA should here We way fab. way a X with the experiments continue still are excited through the license for the in making about this our customer, agreement which pave

use LNA's. with The and CAD diffusion business. customer also features control team on more around Atomera's customers enter The also busy nodes. also which nanosheet manufacturers, in addition, and March, Conference wafer to both and MST RF advanced give of on suited interest to discussions work it for into in been technologies. in improvements and partnerships. with our is large underway. same And momentum a SPX every and atomic viewed is our about agreement performance. end can QX, MST enhance to surface SP RF to license is as of San our control, needed nodes challenges it, in MST conference, SOI necessary. a strong, differentiating improvement how new at runs co-authored those with and manufacturer some demand we started deliver in with to in voltage devices players as have performance and MST great Interest SP our higher a shows provide work a random uniquely these provide happens the the be Recently, another opportunities been upcoming is scattering being trend should for switches Interest latest well. being forum technology invited ever in will for to the of substrate multiple which engagements the which to in our gate has to MST driving has signed Soitec this the which area level higher the is the been different new the of for to created SPX be semiconductor their fluctuation, our all both active in starting stimulating are is working exciting. offerings. us roughness caused seeing Chinese with were demand IEDM on focused more technology lead start transistors. multiple low which to QX, these we advanced performance tailwind in the of IEDM and excellent A and in advanced December and At nodes, remains this on an than In at and established new potential which in we're paper, how have Jose working area on memory spreading SOI has space, we control are used focus segment, are for customer with details reduction these node ultimately providing State In has geometries we an companies open the has raised, continues University the MST growing.

and Finally, how different of developments for will memory, it's MST I questions extensive. quarter, more And artificial spoke MST AI can about a we fast-evolving which you demand tell to about deliver. drive can related help of lot kinds intelligence. in get is I how Last the

MST bring where area chiplets. huge will in value is Another

value, The architecture enormous technology AI commercially. of you new is which them It's should interposer. huge. on optimum provides and that fact architecture, that we its beauty turned become The solutions. for which so a of believe the creating to with XXXX single-chip meet new collects I difficult year will this number these algorithm silicon process As to can nodes in have boosts role as a the this may chiplet a MST know, industry by adoption. has reacted demands the each performance MST developed smaller chiplets corner we brings the a all for become look at be driver different when that back problem

with first in made followed we've progress success. upon ST, for be will Our the by production the Atomera's trigger great license looked as QX

of horizontally In new each growth technology apparent addition advances MST I'm increases. leads tool day. even every existing that and technology tell to ways to strong of driver work the here truly come that customer is team a potential imagined penetration of is that using and brilliant product enterprise, hard future our optimistic customers at delivering more I target licensees for haven't covering customers as Atomera an understand as execution into is we ever we even our become hands has its which potential. MST the up in This on technical our our is across than ST, at they with start to more, and made thing serious type that you, amazing about successful and should this quarter of One a become the our more it can segments.

Now Frank financials. our review will

Francis Laurencio

summary our release XXXX of in Fab. full-year today, press announcing acceptance at and XXXX. which fourth Revenue issued slide was with resulted the of you, market we ST At recognized Thank quarter a and was the Scott. and financials. This our of in $XXX,XXX, from our MST all installation QX results shows close technology

and million increase loss million from in an in XXXX. XXXX, which was $X.X year-on-year Our share which of $XX.X a compared and to expenses spending The driver due year loss approximately to December payroll approximately as and approximately was in was metrology, the the administrative related of compared marketing $XXX,XXX well cash approximately to per increased XXXX, General as $X.XX net increase higher payroll increase which in higher by higher and a XXXX, expenses, Sales $X.X as increased on short-term was increased income and to million $X.X expenses $XX.X share were by rates R&D expenses reflecting services, on of net due due XXXX higher million was or of investments. GAAP biggest interest million operating or mainly legal expenses by $XX.X GAAP per fees. ended $XXX,XXX. million XX, in for $XXX,XXX the and $X.XX outsourcing, foundry Other costs. other to XXXX. $XXX,XXX net of million $XX.X higher

per $X.XX $X.XX to QX was XXXX of net to third net million In $X.X in share. Turning revenue. million was GAAP results. quarter share or loss was GAAP XXXX, our $X.XX net to loss QX per loss lower per compared QX a $X.X our The or million the due was compared loss of XXXX, which QX share. QX also in net quarterly to $X

While $X.X GAAP winding increases were million in in flat expenses R&D expenses, preceding $X.X a in XXXX. of presented GAAP QX to for basically offset and million XXXX XXXX. was activities to Non-GAAP loss this $XX.X to in was results, and expenses quarter due down differences TSI, And R&D compares in compared $X XXXX were and net million $XX.X with expenses in periods expenses. G&A compensation loss as and primarily in at operating $X.X to to the due stock GAAP the sales increased million at of declined marketing. and by million operating all million as non-GAAP are between primarily in due noncash which The approximately XXXX our

QX. XXXX, December million $XX.X of compared Our $XX.X balance of million at the $XX.X end on XX, investments end XXXX to and cash, cash the at and equivalents, short-term of was million

per price million shares of we cash at average of During QX the those X.X price in approximately last in ATM $XX.X sold and were year, used of shares our $X.XX activities, average we an sold Of operating amounts, XXX,XXX approximately at $X.XX. under million facility an share.

As of XX.X December shares XX, million we outstanding. XXXX, had

next payments QX, to mentioned, ST products Scott sales and milestones with X revenue. first to license them result under we MST. agreement license, As license distribution met The in grant of be in license which will ST resulting $XXX,XXX the Those sell will the to of will during enable our manufacture rights both royalty Atomera.

the able the not $X our over details have rights. While grant of the are target we financial additional total terms this we are contract, consistent payments model. a with of million, list to fees increasing ST model, share as Under price with upfront customers license

TCAD As of when guidance MS which of QX ratable on entry the ST's I'm distribution will that our license only that revenue licensing. providing will timing Scott not control. consist Phase revenue. recognizing Accordingly, remarks, into his XXXX timing the recognition is largely recognize is of in we of on for expect revenue X, the I explained under grant

Moving to our expense guidance.

XXXX non-GAAP $XX.X in will expect range our of to OpEx million, and expenses million. Our $XX for $XX be that in non-GAAP we XXXX, million operating the were

with While due range has semiconductor financial wider as prior foundry And in possible the in provided good been in to result, this talks a but moving progress a previous calls, for XXXX. from to from services, new is in expenses in foundry.Our with than TSI We're QX year. declined uncertain of yet. this I making work impact quarters R&D a TSI of wrapped providers January our nothing replacement up is finalized this

will we QX to as one-time foundry, remarks in expect the foundry call over visibility. when transition we from update work turn we more to R&D a back fees few a further the decline Scott With I we new up guidance XXXX interruption will to and that, incur to our questions. to for cause call have summary before the expense While we some QX, open will Scott?

Scott Bibaud

Thanks, Frank.

and As past made in you quarter XXXX. great we can progress towards this commercialization see,

get also to power stage. our incredibly the into are an customers in but to everything potential quickly, working portfolio who of production other commercial valuable to doing are take We have ST we we

we Mike, matter for now solidify we that questions. take of it's time a deals will potential confident team only Merus announce will that Our license further of is business the that future. before can the

Mike Bishop

Scott. Richard comes Thanks, Richard, question Okay. Instructions] first of now ahead. our please from right Craig-Hallum. And [Operator Shannon go

Richard Shannon

STMicro any Thanks, I of them. some frame all think Frank, me get of very couple it, Mike, thanks, want getting to time of to like talking here, don't having. congratulations want X.X you're there, frame to I here. skis could end for lower and interesting much about questions the of my you've read Scott and It get your productization success to about engagement Scott. because ahead there's and don't sounds out time great just indels the that your to been to on work year related I be a of with just to that years that, here. at into but call X on the too here, reason the thoughts of but want Maybe

Scott Bibaud

Yes.

As a timing actually haven't the schedule they're that given hit. I we said, of predict They it. trying us to can't

very installed However, and since the these up out and installation we they last made in experience, say just progress inside our they did we've Once the can couple wafer have moving I crank possibility months, quickly. very turn is will new the really did in fast. the someone's of experiments -- engines quick we the MST fab, of is literally

to from I May, could date is would say X on there's chance the I'm a So, years our holding earlier would announcement but be it last say. end. some still there chance, to I the X.X

Richard Shannon

And schedule Or process? bringing process characterize expect up what that Is the -- the STMicro, from kind gotten we means? of that? any a Sengupta I any the any would that way Atomera is Okay. can normal, of there guess? When that specifics to normal you deviations create from say what you have you

Scott Bibaud

a in from normal analytic I normal time put for it taking an development III. they're privy it of III frame time this know -- case. of am they That remember being people they to development lot they this. node. what in may customers, now done I Phase ago, there's think I of for most process like they're a a they not will don't a shelf work did the that consider have kind product anything of deviation kind and to that's their they a of some our for this said, as But and have Phase IV, when the get And long brand-new Phase done. that they're ST, it for on work doing

So, results work good is to their I their results designs. they get spread to run, so have good they first get their very and components in going to goal more to across lot can try I in more mean, but places, MST they're do some -- think on of a

Richard Shannon

We've before for do people that they the pull I'll to back factory -- other before Or in you to think talked the And Fair And announced this and topic April companies refer in just a accelerator you're this Maybe question effect you you out the catalyst halo any the need last I then? this that about since adopt do about follow-on characterize the on want you I trigger? the production Okay. can MST. key actually be to could having. but guess an this discussions of see year, as enough. me coming STMicro day chips of is guess driving talked to a here. of it

Scott Bibaud

I that's see catalyst. and on model is it nobody to what conversations say, and already the now, In because definitely ever doing past, business we're our could us, an before. from to then discussing them, with But It's recognize that go there. in and great from they they we has ST say yes, this customers like we'd done accelerator

why should it's a changer. it? do we big So do you really So, think game

Richard Shannon

there. hear to Great Okay.

it example the of you now Is this the ST large and with this separate effect? word You halo of this for is was Or TCAD I before manufacturer. used publicized? license in quarter and even last talked an -- think terms you have started about analog MS --

Scott Bibaud

definitely example think I halo the an it's effect. of

the the installation did Of seeing convince doing hope to step course, first with ST, we them. announced it ST an of to going that the and guys moving we were these MSTcad to we in to take has I next license. level. them But and kind actual caused along work And actually is before

Although we announced that's what we but that hope haven't trajectory. yet, is the

Richard Shannon

follow-on to what my as so co-opted speak, topic, internally of question next like public kind you both plus that those could license are you here, you any which the Well, steps characterize events, this on Okay. just mentioned. is

Scott Bibaud

the an standard mean starting TCAD, I is I what it. productization talked about Yes. if work to for into ST, TCAD adds they for effort are TCAD of at stuff MST with add-on look their that the An you all MS a

of of So, want the of -- our for customers, would industry, the piece manufacturers before decision. are for make a run some physical then results in majority to they on would move silicon see silicon. the I semiconductor industry, they a it to actual a any decision to first -- want they their be and say the of to in But players simulations make

paths, seriousness. I very a exclusively to It's integrating and process and not And paths. dedicate good a both on expensive really it seats both they're a support that deal them to We're to the into technology. Synopsys on it's few working so, prepared your shows engineers doing think TCAD few small MST

someplace goes is good. And so that hope we

Richard Shannon

assuming I'm this and use analog working current would Is since somebody like this internally And manufacturer Atomera described else something that as as perhaps a they is large customer. engaged a Okay. with fair? opposed to you that install

Scott Bibaud

customer. Atomera think work an don't would I with Yes. they engaged

the they're as IDM, is they company use so light, fab even globe are capacity. foundry as inside every they think an if outside well probably in I today some

could Yes. go direction, but... in either these guys So

Richard Shannon

to here. want to Okay. a I'll line couple to I'm but Two GDX and ask related here, of quick get sure there here. questions, others just are questions a

there, in I detect do progress X some And the over made years, want gotten was maybe you characterize X it's correct? it hopeful. think you're just this can I I and words you so last didn't been you don't to discussions that with you've like imminent units gone anything cycles with your just some in put but them, mouth, through business there. Sounds learning think, at dynamics certain know think -- in point than them past I other more you've the

Scott Bibaud

that think more Yes. side continuing of in we've lot goal discussions results them. the of a that's kind can't those discussions, and data. has done in of got but types we over shown slow with And exactly yet. MST. haven't to didn't at And are lot we lot holidays, details business things of the I technical Christmas even everything. way, and some And with are work I big can them started end mean on stuff that a of give of the be these do we And them We've year with the setting by We them don't things completed company happening of obviously, for things unusual. the no, with them certainly that show of the quarter. but where and in done are fourth a we reorgs every take to the on down, that time. we discussions compensation

bit a feel the year. definitely like distracted of end the were so, at they And I

make we'll so started it really to to try hopefully, better we now. And And progress January, up. ramped in get back

Richard Shannon

And last line jump Okay. on question, the here. enough. I'll the Fair

back with I like license heard like much customer, think, fabless unnamed haven't a I since. in XXXX RF or that, them about an signed You something

You that characterize any bridge specific talked recently? customer does RF overlap every SOI the RF like of in past... in engagement sounds had in doing And with the you what some announcement has the today about that Maybe been quarter SOI just on since what mentioned general. commentary or

Scott Bibaud

Yes.

that we're continuing still of Sorry. them, RF remarks probably overlaps. very customer good quite that but prepared in my work, in We're with have and that about. that with hope future. job the turns is still with working that particular excited We're could It something we a into something better connecting our is done doing SOI development definitely and customer.

Mike Bishop

Acree next Our Cody Benchmark. from comes question of

Cody Grant Acree

your expecting the for the on we what Frank, first on clear just progress QX, year. if ratable for this you STMicro Can license. Congrats guidance quarter? really be clear on you you're be can said

Francis Laurencio

No, I I was to TCAD. license talking referring Yes. was not revenue STMicro. to MS from

that's large -- are yes, and So those not amounts.

we've details, a into of didn't this largest think MS in So, the TCAD from past, but quarter I was had revenue I in the $XX,XXX. single go from under

a STMicro. this but range. separate still of it's from So, is kind that that's in larger engagement, Yes,

Cody Grant Acree

Any I understand next in -- year. push, the come that that impact later delay? impact delay on will with is your lumpiness, but business or the TSI? on any R&D this year, But there

Scott Bibaud

delay. us and everything in We customer certainly to our it would quick installed any see turns wafers the a don't doing business impact go kind, of from now of in any whether None they're be -- with R&D ST, that through either. disflow customers MST to been testing. was us solely TSI sending wafers internal would for that for But do for to deposition, fab. able to have TSI vehicle be never their a

has no impact it And customers. so, on

a on would with seeing some but In prolonged X impact R&D, yes, work foundry us, years inability of higher We actually had in quarters we're not terms that. XXXX than we much with first had the TSI. of to longer-term have in the spend previous

and kind were of additional winding we few able testing that and increases TCAD for can Now but got was they down that wafers faster were use QX, run calibration. to into internal kind a of quite we -- part we as turnaround, and for of anticipate that price

that's new close keeping And foundry. now. plenty And we so very in us are up a busy discussions signing with

to commercially hurt us that's anticipate all. that don't at So, we going

Cody Grant Acree

with engagement a more in this about Excellent. you new prepared that the bit you SPX, mentioned Scott, And maybe can remarks. talk SP MST, and your engagement

Scott Bibaud

Yes, sure say I'm I can about what else it. not

TCAD. you MS just what maybe can about license means So to talk it

into of TCAD MST wants is a the product their top could sits a of bring. of to kind it gives added our that do comprehensive to MST Synopsys' people particular TCAD on software, and analysis could So customer MS package how This software get line. analyze performance that

them. And fairly so big for it's means installation a that

And so be we're to and bit we're level to monthly of it, use them quite to providing able at them. a a charging support

voltage frequently that, Now they SP how what's make the we better. in tricks that higher SPX experts and we case to to do so figured who they out at is will use -- packaged technology but are can that for or product, the then product they their MST look how use customers -- our aren't MST going

their tricks voltage out existing change them those. higher all and China. where the to a this into I going development bit that we'll is ships get performance designs how then can So, seeing We're of in more of their the to trade train to trend about talked put and higher more. little they levels

definitely, to their fabs. lower better higher for make And those players so compete the of trying many Chinese existing with costs so with performance portfolios, then are either the

Cody Grant Acree

that lastly, around DRAM this And then strategy. Are in just mentioned a Or interest in you you plausibility? some map material? DRAM are chiplet seeing the increased engagements more is road just

Scott Bibaud

more that DRAM. be architectures, doing related in architectures now. there. technology. could We're to to to about But responsive help still yet, some demands. of chiplets, to like people memory used of don't make have on for to we've discussions talking with announce companies we're how to MST memory any the It's not are to people memory anything talking other them a while would work even specifically but needs manufacturers we to in just Now it We chiplets change we're talking number AI is been memory about something there and I little think DRAM but definitely a

soon. into that we're but we will that haven't So R&D hope something again, yet things turn a working number announced in of we that on

Cody Grant Acree

characterize you these yet? fairly Would stage as early

Scott Bibaud

Our say, is DRAM work other is work, the not but stage, manufacturers would of early I some with stage, earlier yes.

Mike Bishop

A this line Scott, the with are that of into Smart going prepared came questions you couple year? in SIC Soitec on Q&A STMicro involved here. Are -- the comments. mentioned question Technology in is, you tech with production the you

Scott Bibaud

Yes.

for a of So we have years. been working with number Soitec

RF SOI percentage that's by say, good there As you a bring to we about SOI I that talking long delivered is guys a benefits time. know, we've and delivered market And -- the Soitec. RF the for would most been of

works been them to product have that theirs. we with ensure with our working well So

announced the be that engagement any not We you're would asking with certainly but who a us about SOI them interested in using have Soitec. a working or kind of of very RF customer, customer be like we with joint both partnership kind would question any hope any STMicro, with and

Mike Bishop

comment All the that? right. marketing a to the increase you Do expenses fourth sales quarter. want you, and address Frank. was about in And There one for in

Francis Laurencio

$XXX,XXX Yes. of in This as which of an areas across all QX, revenue had saw, operating you we expenses. milestone. is actually of important the kind applies But

across of things all impact that we One as that expenses the is achieve we departments certain milestones. our bonus the annual accrue

company, time overall in not an accrual though and other Otherwise, the of traveling can I marketing quarter. accrual certainly travel, quarter. spotty. a QX, with lot milestone customers. anything increased and sales across into every so that always bonuses like this be that certainly of that very the wouldn't amount important travel a is to of And than lot of just the But linear in spent bonus and year which read There's more we

Mike Bishop

a the was request year. provide we there's if last Act the And for on put an could you And Scott, Act. update wondering, that an for I CHIPS and update the out Chips Okay. about -- news

Scott Bibaud

Yes.

the national last many for provides what Of of a really we CHIPS development and they're Act semiconductor the talking ways course, center tailwind -- establishment that we about. mean talked the us think about especially year in I new

that, lot know, chipset State Arizona building been RFQs early has that CHIPS about and you involved it's rounds out thing the University. is a -- other involvement out, gotten have the about about the we our our fabs. putting of So, with Arizona been Act people to is But as of in in announcement

in First, the doing the some on other big get then levels, companies, are government building work engaged lot of those, for be eligible we areas. fabs, work We and the to weren't companies. we at medium-sized for but CHIPS Act could so eligible different with a really

again, you but something so nothing would that announce to we're And tell on. that's working that, there, I

Mike Bishop

Shannon up. Richard, Richard has I did have -- question? And a his Okay. you see hand follow-up another

Richard Shannon

ultimately situation get the in that to work workflow your the on I'll done Thank DRAM in power how thanks a the relative consistent and around And of He turn I update dynamics maturity kind Cody's last on asked you've and or advanced characterizing going with did, I there and want of it cetera. and to different and I'm But throw DRAM for nodes. you. work here. other like space, reask the to answer areas is other SOI, that Mike. question RF topic. Scott, at et

Scott Bibaud

Yes.

the doing SOI. exactly of and power it's interesting. It's not that think RF work we're same in type I

a few me address Let things.

a prove small advanced prove are us nodes, that that do can can really we to process deliver it that it geometries effective. that and have, it First, new that we do in the so capabilities be develop required to the R&D tiny when working has film they and at you're the sizes if with our to still

we've would we some have advanced of what really so, them We've towards other in past, papers white think we were that bring in able done that with did very the who've some customers need maybe And some about working -- that, I node are guided the papers some they solutions. things and even conjunction to useful. out put us if we some also and

but there mobility different and is which is they're the quite surface in are This happen electron flow. of mechanisms sending them, scattering the that roughness they electrons when improvements. across scattering One impede transistors technical, of

runes -- that roughness gotten proved to mechanisms surface very most least improvement a scattering. to that's get MST solution is process very gotten small a the one is very, surface lot the geometries, we at and worse difficult you or As of scattering very actually has rare

attention fluctuation dopant a at imagine the of few you transistor, atoms that's actually, a in random fluctuation. participants. on out the put from And about lot calls that's we and industry white the And earlier paper, so something little earnings a fall, I talked bit garnering then Again, several process problem. is very on that's wrong your and dopants small if you a place a a real only have you into and moving nodes, feature silicon open wide can have

big So, for the I to that that also mean, -- I can one that -- those advantages also of all sorry, scattering. we mean, tamp memory is almost of and random the true makers. for true down is are of that in help MST things separate

working dealing they with Now that in similar incredibly the having advanced same areas problems the memory geometries are they're I makers the with nodes. with not just But are tiny that talked about.

part question. So answer your one let me little of other

first One can meaning those doesn't make about of into rest wafer integrated something that be flow. that run It things use of integrate an would we therefore, solutions the them to wafer, the has get the revenue. areas easier they is that that, it to and a have some on start faster talking on kind about interesting be to to potential of that implemented of wafer the starting be we all, MST like in can things. blanket of to process the When our time

manufacturers. success an some gives wafer the opportunity it easy providers. were of some we really the us do industry into a are who players semiconductor Secondly, partner getting us with to give that in then if at might And to able that, channel

well. and and they sometimes where for can nodes of in RF use use temperature most the SOI for people So, manufacturing true as much solutions, that's types lower processes, these advanced

Mike Bishop

All right.

about if more and the here, Smart products. So, one it's and than at is going that be the in question STMicro Power last Q&A line from used MST to

Scott Bibaud

there announce STMicro yet, is to a big nothing obviously. Yes, company.

is do the try technology installation I out of it think and things one new with in they can they're other learning about on this just their our technologies. fab

be else delighted good that for if behavior. them. And and it was something decided we would will tried of that type we certainly be out they So, encouraging

Mike Bishop

proceed to any comments. closing All right. you Well, if want with Scott?

Scott Bibaud

available, efforts Well, Bishop, for shared toward I'm on just along next website, Mike our have support, continue technology we for commercialization follow with and right. contact our news, our happy development to us posts, and you you again alerts want are thank past update Should forward you articles, All which atomera.com. to pleased questions, be this have Please up. I with look all to year. will to your look and to joining blog please additional Sure. for today. investor who you call. Thank our

Mike Bishop

Scott, you, the concludes Thank this conference and call. Atomera

Atomera (ATOM) 13 Feb 242023 Q4 Earnings call transcript