997 patents
Page 49 of 50
Utility
Constant-voltage generating apparatus and measuring apparatus
28 Oct 19
A constant-voltage generating apparatus including a plurality of constant-voltage circuits connected in series is provided.
Hiroyuki Yoshimura
Filed: 28 Sep 17
Utility
Article dispensing apparatus
28 Oct 19
An article dispensing apparatus includes: one article discharging apparatus; and another article discharging apparatus, the one article discharging apparatus and the other article discharging apparatus being capable of being combined in a back-to-back manner.
Shirou Takeuchi
Filed: 21 May 17
Utility
Semiconductor module with reinforcing board
28 Oct 19
A semiconductor module includes a semiconductor chip; an insulating circuit board that has on one of principal surfaces of an insulating substrate a circuit member electrically connected to the semiconductor chip, and a first metal member disposed in the other principal surface of the insulating substrate; a second metal member that is disposed on a side of an outer edge of the first metal member and is at least partially disposed further toward an outer side than the insulating substrate; a molding resin portion that seals the semiconductor chip, the insulating circuit board, and the second metal member such that a portion of the first metal member and a portion of the second metal member are exposed; a cooler; a first bonding member that bonds the cooler and the first metal member; and a second bonding member that bonds the cooler and the second metal member.
Akira Morozumi, Hiromichi Gohara, Takafumi Yamada
Filed: 9 Mar 16
Utility
Semiconductor device
28 Oct 19
In a semiconductor device, first to fourth circuit patterns are formed on an insulating substrate in a case.
Takashi Katsuki
Filed: 2 Jan 17
Utility
Bonding pad structure of a semiconductor device
28 Oct 19
Hidekazu Tanisawa, Shinji Sato, Fumiki Kato, Hiroshi Sato, Kenichi Koui, Hiroki Takahashi, Yoshinori Murakami
Filed: 18 Oct 17
Utility
Semiconductor device
28 Oct 19
A semiconductor device including: drift regions formed on a semiconductor substrate; gate trench portions extending in predetermined extending directions from a semiconductor substrate upper surface; first and second mesa portions being in direct contact with one and the other sides of a gate trench portion side wall respectively; accumulation regions being in direct contact with the gate trench portions, above the drift regions, and having doping concentration higher than drift region concentration; a base region being in direct contact with the gate trench portions, above the accumulation regions; emitter regions being in direct contact with the one side wall of a gate trench portion on a semiconductor substrate upper surface in the first mesa portion, and having doping concentration higher than drift region concentration; and electrically floating second conductivity type floating regions provided spaced from the gate trench portion below the base region in the second mesa portion is provided.
Tatsuya Naito
Filed: 20 Jun 18
Utility
Switched-mode power supply circuit
28 Oct 19
A switched-mode power supply circuit that performs a burst-mode operation to stop and restart switching is provided, including: a power supply that supplies DC voltage; a switching element that controls the switching; a first comparator that detects an output voltage of the switched-mode power supply circuit; a storage element that stores an output of the first comparator according to a timing of controlling the switching; and a determination unit that measures a time period for which at least one of an output of the first comparator or an output of the storage element continues to be higher than the predetermined voltage, and if the measurement is not reset within a predetermined elapsed time, determines that the switched-mode power supply circuit is in an overvoltage state, wherein the switched-mode power supply circuit resets the measurement at a timing corresponding to a switching stop timing in the burst-mode operation.
Hiroshi Maruyama
Filed: 27 Aug 18
Utility
Power fluctuation mitigation system
28 Oct 19
A power fluctuation mitigation system for use in a power supply system that supplies AC power to a load includes an inverter unit including a first converter connected to an AC power supply to perform DC/AC conversion, a DC intermediate condenser, and an inverter connected to the first converter through the DC intermediate condenser to perform DC/AC conversion, and a power fluctuation mitigating device including a second converter connected to the AC power supply to perform AC/DC conversion, a capacitive storage device configured to be charged by an output of the second converter, and a charging unit to charge the DC intermediate condenser with power stored in the capacitive storage device, wherein the charging unit supplies power from the capacitive storage device to the DC intermediate condenser upon occurrence of fluctuation in an output of the inverter unit occurring in response to fluctuation in the load.
Kouji Yutani, Hiroyuki Yamano, Reiri Kin, Toshiyuki Tsukamoto
Filed: 25 Dec 17
Utility
Wiring board manufacturing method and wiring board manufacturing device
28 Oct 19
A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.
Kenji Tsukada, Masatoshi Fujita, Yoshitaka Hashimoto, Akihiro Kawajiri, Masato Suzuki
Filed: 13 Nov 14
Utility
Component mounting machine and tape peeling recovery method for component mounting machine
28 Oct 19
A component mounting machine includes a feeder device that has a tape feeding mechanism that feeds out a carrier tape that stores components in respective component storage sections, and a tape peeling mechanism that has a tape peeling blade that carries out peeling, and a component transfer device that has a mounting head that holds a suction nozzle, and a head driving mechanism, the component mounting machine further provided with a peeling start determination section of determining whether or not the peeling starts before the suction nozzle starts a suction operation, and a recovery function section of carrying out a recovery operation in which the recovery function section returns the leading end of the carrier tape temporarily to the front of the tape peeling blade and feeds out the carrier tape again in a case where it is determined that peeling is not started.
Akira Takahashi, Toshimitsu Honda
Filed: 17 Mar 15
Utility
Component mounting machine
28 Oct 19
Provided are a first component holding tool operating device which operates one component holding tool which is positioned at a first position set on one circumference among the plurality of component holding tools for holding and disengaging a component, and a second holding tool operating device which operates one component holding tool which is positioned at a second position set on the circumference among the plurality of component holding tools for holding and disengaging the component.
Hidetoshi Ito, Yoshihiro Yasui
Filed: 30 Oct 13
Utility
Mounting deviation correction apparatus and component mounting system
28 Oct 19
In a case in which mounting deviation is occurring in a component which is mounted onto a solder surface of a board, a pad jig is pushed against the component, and the mounting deviation of the component is corrected through a friction force between the pad jig and the component by causing the pad jig to move in a horizontal direction.
Koji Shimizu
Filed: 12 Mar 14
Utility
Reel holding device
28 Oct 19
A reel holding device is provided.
Hiroyasu Ohashi, Takuya Nagaishi
Filed: 2 Mar 15
Utility
Electronic component bonding device and electronic component mounter
28 Oct 19
An electronic component bonding device includes multiple pressing tools that apply pressure to a die on the bonding section of a circuit board, the multiple pressing tools are supported on a support block via a following mechanism so as to be able to be inclined in any direction around 360 degrees, and a driving mechanism that moves the support blocks vertically is provided.
Masaki Murai, Toshihiko Yamasaki, Toshinori Shimizu
Filed: 21 May 15
Utility
Automatic detection device and automatic detection method for tape
28 Oct 19
Xiao Dong Chi
Filed: 11 Dec 14
Utility
Method of manufacturing semiconductor device
21 Oct 19
A method of manufacturing a semiconductor device includes: forming, on a surface of an n-type semiconductor layer, an impurity source film containing both aluminum and beryllium; and forming a p-type impurity-doped layer in the n-type semiconductor layer by irradiating the impurity source film with first laser light to simultaneously introduce the aluminum and the beryllium into the n-type semiconductor layer.
Kenichi Iguchi, Haruo Nakazawa
Filed: 5 Jun 18
Utility
Power converter and power converter for railroad vehicle
21 Oct 19
In each of a plurality of semiconductor element groups of a power converter, a second semiconductor switching element and a third semiconductor switching element are shifted from each other in a second direction such that at least a portion of fins with which the second semiconductor switching element overlaps as viewed in a direction orthogonal to surfaces of coolers is different from fins with which the third semiconductor switching element overlaps as viewed in the direction orthogonal to the surfaces of the coolers.
Masamitsu Takizawa, Nobuyuki Kobayashi, Yoshio Mori, So Nakamichi, Kohei Matsui
Filed: 24 Oct 18
Utility
Method of manufacturing semiconductor device
21 Oct 19
An n-type region and a p-type region of a first parallel pn layer are arranged parallel to a base front surface, in a striped planar layout extending from an active region over an edge termination region.
Isamu Sugai, Takeyoshi Nishimura
Filed: 30 Jan 19
Utility
Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device
21 Oct 19
An interlayer insulating film is patterned, contact holes are formed, and in the contact holes, a source contact portion forming an ohmic contact with the silicon carbide body is formed.
Naoyuki Ohse, Mina Ryo, Takuya Komatsu
Filed: 31 Jan 17
Utility
Silicon carbide semiconductor substrate, method of manufacturing silicon carbide semiconductor substrate, semiconductor device and method of manufacturing semiconductor device
21 Oct 19
A silicon carbide semiconductor substrate, including a silicon carbide substrate of a first conductivity type, a buffer layer of the first conductivity type and an epitaxial layer of the first conductivity type.
Takeshi Tawara, Hidekazu Tsuchida, Tetsuya Miyazawa
Filed: 25 Jun 18