111 patents
Page 2 of 6
Utility
Methods for attachment and devices produced using the methods
11 Jul 23
Methods for attachment and devices produced using such methods are disclosed.
Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
Filed: 20 Jan 21
Utility
Encoding signals on flexographic printing plates to enable tracking and management
4 Jul 23
The present disclosure relates generally to signal encoding for flexographic printing plates.
Jay Kelly Sperry, Ryan W. Vest
Filed: 30 Jul 21
Utility
Engineered Materials for Electronics Assembly
11 May 23
A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.
Ranjit PANDHER, Niveditha NAGARAJAN, Girard SIDONE, Carl BILGRIEN
Filed: 20 Oct 20
Utility
Silver/tin electroplating bath and method of using the same
9 May 23
An electroplating bath for depositing a silver/tin alloy on a substrate.
Fengting Xu, Jean W. Chevalier, Ernest Long, Richard A. Bellemare, Michael M. Ryl
Filed: 2 Feb 22
Utility
Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures
11 Apr 23
This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS).
Nirmalya Kumar Chaki, Chetan Pravinchandra Shah, Barun Das, Supriya Devarajan, Siuli Sarkar, Rahul Raut, Bawa Singh, Anubhav Rustogi, Anna Jane Harris, Keith Paul Parsons, Jeffrey William Braham
Filed: 22 May 18
Utility
Method and system for thermal processing of flexo printing elements
11 Apr 23
The present disclosure is directed to a system and method configured for curing non-reactive photopolymer collected by an absorbent blotting material during thermal processing of flexographic printing elements.
Ryan W. Vest, Gary T. Markhart
Filed: 31 Aug 21
Utility
Method and System for Thermal Processing of Flexo Printing Elements
2 Mar 23
The present disclosure is directed to a system and method configured for curing non-reactive photopolymer collected by an absorbent blotting material during thermal processing of flexographic printing elements.
Ryan W. Vest, Gary T. Markhart
Filed: 31 Aug 21
Utility
Low-silver alternative to standard SAC alloys for high reliability applications
14 Feb 23
A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, and antimony.
Md Hasnine, Lik Wai Kho
Filed: 28 Jun 18
Utility
Multicorrosion protection system for decorative parts with chrome finish
31 Jan 23
The invention relates to a corrosion protection layer system for metal surfaces, said layer system comprising as the two top most layers: a) a discontinuous nickel-phosphorus layer and b) a chromium layer plated from a trivalent chromium electrolyte solution, as well as to a method of producing such a layer system.
Andreas Konigshofen, Ronny Kiefer
Filed: 6 Nov 20
Utility
Sintering Composition
24 Nov 22
A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.
Shamik GHOSHAL, Nirmalya Kumar CHAKI, Remya CHANDRAN, Manoharan VENODH, Bawa SINGH, Barun DAS, Niveditha NAGARAJAN, Rahul RAUT, Oscar KHASELEV, Ranjit PANDHER, Supriya DEVARAJAN, Anubhav RUSTOGI
Filed: 24 Sep 20
Utility
High Temperature Ultra-high Reliability Alloys
13 Oct 22
A lead-free solder alloy comprising: from 2.5 to 5 wt. % silver; from 0.01 to 5 wt. % bismuth; from 1 to 7 wt. % antimony; from 0.01 to 2 wt. % copper; one or more of: up to 6 wt. % indium, up to 0.5 wt. % titanium, up to 0.5 wt. % germanium, up to 0.5 wt. % rare earths, up to 0.5 wt. % cobalt, up to 5.0 wt. % aluminium, up to 5.0 wt. % silicon, up to 0.5 wt. % manganese, up to 0.5 wt. % chromium, up to 0.5 wt. % iron, up to 0.5 wt. % phosphorus, up to 0.5 wt. % gold, up to 1 wt. % gallium, up to 0.5 wt. % tellurium, up to 0.5 wt. % selenium, up to 0.5 wt. % calcium, up to 0.5 wt. % vanadium, up to 0.5 wt. % molybdenum, up to 0.5 wt. % platinum, and up 0 to 0.5 wt. % magnesium; optionally up to 0.5 wt. % nickel; and the balance tin together with any unavoidable impurities.
Pritha CHOUDHURY, Morgana RIBAS, Anil KUMAR, Raghu R. RANGARAJU, Siuli SARKAR
Filed: 28 Aug 20
Utility
Compositions and Methods for the Electrodeposition of Nanotwinned Copper
22 Sep 22
A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl.
Kyle M. Whitten, Stephan I. Braye, Jianwen Han, Pingping Ye, Thomas B. Richardson, Elie H. Najjar
Filed: 7 Jun 22
Reissue
Copper electrodeposition in microelectronics
6 Sep 22
An electrolytic plating method and composition for electrolytically plating Cu onto a semiconductor integrated circuit substrate having submicron-sized interconnect features.
Vincent Paneccasio, Jr., Xuan Lin, Paul Figura, Richard Hurtubise
Filed: 9 Jul 18
Utility
Method of making a film negative
6 Sep 22
A method of preparing a film negative including the steps of dispersing a UV ink in a desired pattern on a UV printing substrate; and curing the UV ink with a source of actinic radiation to crosslink and cure the UV ink and create the UV printed polymer layer in the desired pattern.
John Maneira
Filed: 4 May 21
Utility
Cobalt filling of interconnects in microelectronics
6 Sep 22
Processes and compositions for electroplating a cobalt deposit onto a semiconductor base structure comprising sub-micron-sized electrical interconnect features.
John Commander, Vincent Paneccasio, Jr., Eric Rouya, Kyle Whitten, Shaopeng Sun, Jianwen Han
Filed: 1 Apr 21
Utility
Method and Wet Chemical Compositions for Diffusion Barrier Formation
18 Aug 22
A method of forming a diffusion barrier layer on a dielectric or semiconductor substrate by a wet process.
Richard W. Hurtubise, Eric Yakobson, Shaopeng Sun, Taylor L. Wilkins, Elie H. Najjar, Wenbo Shao
Filed: 7 Feb 22
Utility
Advanced solder alloys for electronic interconnects
9 Aug 22
Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces.
Morgana de Avila Ribas, Pritha Choudhury, Siuli Sarkar, Ranjit Pandher, Nicholas G Herrick, Amit Patel, Ravindra M Bhatkal, Bawa Singh
Filed: 25 Jan 19
Utility
Sinter-ready Silver Films
4 Aug 22
A method of making a combined sinter-ready silver film and carrier (1) comprises the steps of: a) creating a carrier (2) comprising designed openings (5); b) casting a silver film layer (7) into the designed openings (5), for example casting a silver paste; and c) drying the carrier (2) and silver film layer (7) to form the combined sinter-ready silver film and carrier (1).
Oscar KHASELEV, Matthew James SIEBENHUHNER, Monnir BOUREGHDA, Mike MARCZI, Carl BILGRIEN
Filed: 5 May 20
Utility
Cobalt filling of interconnects
2 Aug 22
Compositions and methods of using such compositions for electroplating cobalt onto semiconductor base structures comprising submicron-sized electrical interconnect features are provided herein.
John Commander, Kyle Whitten, Vincent Paneccasio, Jr., Shaopeng Sun, Eric Yakobson, Jianwen Han, Elie Najjar
Filed: 5 Apr 21
Utility
Method of Recycling Used Printing Plates
28 Jul 22
A method of producing a granulated product from photopolymer printing plate materials.
Ryan W. Vest
Filed: 27 Jan 21