111 patents
Page 4 of 6
Utility
Copper Deposition in Wafer Level Packaging of Integrated Circuits
16 Dec 21
An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor; and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin).
Thomas Richardson, Kyle Whitten, Vincent Paneccasio, JR., John Commander, Richard Hurtubise
Filed: 12 Aug 21
Utility
Silver/Tin Electroplating Bath and Method of Using the Same
9 Dec 21
An electroplating bath for depositing a silver/tin alloy on a substrate.
Fengting Xu, Jean W. Chevalier, Ernest Long, Richard A. Bellemare, Michael M. Ryl
Filed: 5 Jun 20
Utility
Dielectric ink composition
7 Dec 21
The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed.
Narahari Pujari, Jayaprakash Sundaramurthy, Siuli Sarkar, Ravindra M. Bhatkal
Filed: 14 May 18
Utility
Gold Plating Bath and Gold Plated Final Finish
2 Dec 21
An autocatalytic gold bath capable of depositing gold from solution onto a substrate, wherein the substrate has one or more metal layers thereon.
Roger Bernards, Emely Abel-Tatis
Filed: 27 May 20
Utility
Chromium-free plating-on-plastic etch
16 Nov 21
The present invention relates to a chrome free etch for plating on plastic processes, wherein plastic surfaces are contacted in a first etching step with an etching solution at least comprising Mn(IV)-ions and, in a second etching step, with a solution at least comprising Mn(III)- and Mn(VII)-ions prior to the metal plating step.
Frank Noffke, Christoph Werner, Andreas Königshofen
Filed: 22 Nov 17
Utility
Stretchable Interconnects for Flexible Electronic Surfaces
11 Nov 21
A conductive paste and method of manufacturing thereof.
Narahari PUJARI, Bawa SINGH, Ravi BHATKAL, Siuli SARKAR, Anubhav RUSTOGI
Filed: 22 Jul 21
Utility
Leveler compositions for use in copper deposition in manufacture of microelectronics
9 Nov 21
Vincent Paneccasio, Kyle Whitten, Thomas B. Richardson, Ivan Li
Filed: 4 Nov 19
Utility
Method of Making a Film Negative
4 Nov 21
A method of preparing a film negative including the steps of dispersing a UV ink in a desired pattern on a UV printing substrate; and curing the UV ink with a source of actinic radiation to crosslink and cure the UV ink and create the UV printed polymer layer in the desired pattern.
John Maneira
Filed: 4 May 21
Utility
Sintering paste
2 Nov 21
A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent.
Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
Filed: 1 Mar 19
Utility
Cobalt Filling of Interconnects
28 Oct 21
Compositions and methods of using such compositions for electroplating cobalt onto semiconductor base structures comprising submicron-sized electrical interconnect features are provided herein.
John Commander, Kyle Whitten, Vincent Paneccasio, JR., Shaopeng Sun, Eric Yakobson, Jianwen Han, Elie Najjar
Filed: 5 Apr 21
Utility
Leveler Compositions for use in Copper Deposition in Manufacture of Microelectronics
7 Oct 21
Vincent Paneccasio, JR., Kyle Whitten, Thomas B. Richardson, Ivan Li
Filed: 15 Jun 21
Utility
Stretchable interconnects for flexible electronic surfaces
5 Oct 21
A conductive paste and method of manufacturing thereof.
Narahari Pujari, Bawa Singh, Ravi Bhatkal, Siuli Sarkar, Anubhav Rustogi
Filed: 29 May 20
Utility
Cost-effective lead-free solder alloy for electronic applications
21 Sep 21
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony.
Md Hasnine, Lik Wai Kho
Filed: 28 Jun 18
Utility
Copper deposition in wafer level packaging of integrated circuits
21 Sep 21
An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor, and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin).
Thomas Richardson, Kyle Whitten, Vincent Paneccasio, Jr., John Commander, Richard Hurtubise
Filed: 20 Sep 17
Utility
Methods for Attachment and Devices Produced Using the Methods
16 Sep 21
Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
Filed: 20 Jan 21
Utility
Lead-free and antimony-free tin solder reliable at high temperatures
17 Aug 21
A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.
Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh
Filed: 28 Apr 15
Utility
Low Pressure Sintering Powder
12 Aug 21
Shamik Ghoshal, Nirmalya Kumar Chaki, Poulami Sengupta Roy, Siuli Sarkar, Anubhav Rustogi
Filed: 30 Apr 21
Utility
Cobalt Filling of Interconnects in Microelectronics
22 Jul 21
Processes and compositions for electroplating a cobalt deposit onto a semiconductor base structure comprising sub-micron-sized electrical interconnect features.
John Commander, Vincent Paneccasio, JR., Eric Rouya, Kyle Whitten, Shaopeng Sun, Jianwen Han
Filed: 1 Apr 21
Utility
Multilayered Metal Nano and Micron Particles
8 Jul 21
Shamik Ghoshal, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Ranjit Pandher, Bawa Singh
Filed: 14 Jan 21
Utility
Carbon-Based Direct Plating Process
1 Jul 21
A method of preparing a non-conductive substrate to allow metal plating thereon.
Roger Bernards, James Martin, Jason J. Carver
Filed: 16 Mar 21