1170 patents
Page 38 of 59
Utility
Microelectromechanical systems (MEMS) switching circuit and related apparatus
30 Nov 20
A microelectromechanical systems (MEMS) switching circuit and related apparatus is provided.
Nadim Khlat
Filed: 8 Jan 19
Utility
Active photonic device having a darlington configuration with feedback
30 Nov 20
Disclosed is an active photonic device having a Darlington configuration with a substrate and a collector layer that is over the substrate.
Kevin Wesley Kobayashi
Filed: 22 Oct 18
Utility
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30 Nov 20
A passive magnetic device (PMD) has a base electrode, a multi-port signal structure (MPSS), and a substrate therebetween.
Andrew Arthur Ketterson, Xing Gu, Yongjie Cui, Xing Chen
Filed: 14 Jan 20
Utility
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30 Nov 20
Improved structures for spatial power-combining devices are disclosed.
Christo Bojkov, Dylan Murdock, Robert Charles Dry
Filed: 14 Nov 18
Utility
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30 Nov 20
A radio frequency (RF) duplexer may comprise quadrature hybrid couplers and RF filters.
Sam Mandegaran
Filed: 20 Sep 17
Utility
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25 Nov 20
Electromagnetic shields for electronic devices, and particularly electromagnetic shields with bonding wires for sub-modules of electronic devices are disclosed.
Kelly M. Lear, Jeffrey Miller, Joseph Edward Geniac, Rommel Quintero
Filed: 20 May 19
Utility
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25 Nov 20
Disclosed is a switch branch structure having an input terminal, an output terminal, and a series stack of an N-number of transistors formed in an active device layer within a first plane, wherein a first one of the N-number of transistors is coupled to the input terminal, and an nth one of the N-number of transistors is coupled to the output terminal, where n is a positive integer greater than one.
Samuel Gibson
Filed: 13 Aug 20
Utility
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25 Nov 20
A high electron mobility transistor is disclosed.
Yongjie Cui, Yu Cao, Andrew Arthur Ketterson
Filed: 19 May 20
Utility
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25 Nov 20
A power amplifier system having a power amplifier with a signal input and a signal output and bias circuitry is disclosed.
Baker Scott, George Maxim, Toshiaki Moriuchi, Dirk Robert Walter Leipold
Filed: 19 May 19
Utility
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23 Nov 20
A method for manufacturing a self-biased circulator includes cooling a nanocomposite material to a magnetization temperature below 200 K, applying an external magnetic field to the nanocomposite material to form a magnetic nanocomposite material, providing the magnetic nanocomposite material in a semiconductor substrate, and providing one or more metal layers over the magnetic nanocomposite material to form a circulator.
Yu Cao, Yongjie Cui, Subrahmanyam V. Pilla
Filed: 29 May 19
Utility
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23 Nov 20
A guided surface acoustic wave (SAW) device includes a substrate, a piezoelectric layer on the substrate, and a transducer on the piezoelectric layer.
Shogo Inoue, Marc Solal
Filed: 15 Oct 17
Utility
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18 Nov 20
A single-wire peer-to-peer (P2P) bus apparatus is provided.
Christopher Truong Ngo, Nadim Khlat, Alexander Wayne Hietala
Filed: 5 Nov 19
Utility
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18 Nov 20
An envelope tracking (ET) amplifier apparatus is provided.
Christopher Truong Ngo, Nadim Khlat, Alexander Wayne Hietala
Filed: 5 Nov 19
Utility
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18 Nov 20
A power amplifier system is disclosed that includes a power amplifier having a first signal input, a first signal output, second signal input, and a second signal output.
George Maxim, Stephen James Franck, Michael F. Zybura, Baker Scott
Filed: 2 Aug 20
Utility
5bg7ppe7z583ztpxg928n8hbpcxqgq5d5fsi8354pgm99m5w5aatz
16 Nov 20
An electronics package includes a thermal lid over a flip chip component such that the thermal lid is in contact with a surface of a flip chip component and one or more thermal vias in a substrate on which the flip chip component is mounted.
Jonathan J. Fain, Mark C. Woods
Filed: 23 Apr 19
Utility
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11 Nov 20
The present disclosure relates to an air-cavity semiconductor package, which includes a thermal carrier, a ring structure, a package lid, and at least one semiconductor device.
Robert Charles Dry, Christine Blair
Filed: 7 May 19
Utility
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11 Nov 20
Compensation of on-die inductive parasitics in ladder filters through negative mutual inductance between ground inductors is disclosed herein.
Yazid Yusuf, Mudar Al-Joumayly, Gernot Fattinger
Filed: 5 May 19
Utility
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9 Nov 20
A method includes the steps of fabricating one or more semiconductor devices on a semiconductor wafer and depositing one or more conformal organic environmental protection layers over the semiconductor wafer using a vapor deposition process.
Christo Bojkov, Andrew Ketterson, Robert Charles Dry
Filed: 14 Jan 20
Utility
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9 Nov 20
A semiconductor device includes a first varactor diode and a second varactor diode.
Peter V. Wright, Timothy S. Henderson
Filed: 1 Aug 18
Utility
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9 Nov 20
Waveguide transition devices for power-combining devices are disclosed.
John Kitt
Filed: 18 Jul 18