1170 patents
Page 41 of 59
Utility
Air-cavity module with enhanced device isolation
21 Sep 20
The present disclosure relates to an air-cavity module having a thinned semiconductor die and a mold compound.
Julio C. Costa, George Maxim, Dirk Robert Walter Leipold, Baker Scott
Filed: 16 Jan 18
Utility
Microelectronics package with self-aligned stacked-die assembly
21 Sep 20
The present disclosure relates to a microelectronics package with a self-aligned stacked-die assembly and a process for making the same.
Julio C. Costa, George Maxim
Filed: 4 Sep 17
Utility
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16 Sep 20
A microelectromechanical systems (MEMS) switch die having an N number of radio frequency (RF) MEMS switches, each having a anchored beam with a switch contact, a gate, and a terminal contact is disclosed.
Nadim Khlat, Marcus Granger-Jones
Filed: 14 Mar 19
Utility
zjx4a5m02n8fvr8dkdu8hmxqavlb3685et9888pmuks3vxg4d 47pa8yfutd
16 Sep 20
An envelope tracking (ET) circuit is provided.
Nadim Khlat
Filed: 10 Jul 19
Utility
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16 Sep 20
An envelope tracking (ET) amplifier apparatus is provided.
Nadim Khlat
Filed: 16 Jul 19
Utility
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16 Sep 20
A multi-mode envelope tracking (ET) target voltage circuit is provided.
Nadim Khlat
Filed: 10 Jul 19
Utility
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16 Sep 20
The present disclosure relates to a switchable power amplification structure including a first power amplifier (PA), a second PA, a front switching structure, and an end switching structure.
Carsten Hinrichsen, Søren Deleuran Laursen
Filed: 26 Aug 19
Utility
n81ye3xum1tdakixs6hzyfswv3zg osshp8p
14 Sep 20
An apparatus with a body layer disposed over a substrate is disclosed.
Baker Scott, George Maxim, Padmmasini Desikan
Filed: 6 May 19
Utility
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14 Sep 20
A semiconductor die, which includes a first semiconductor device, a first passivation layer, and a first interconnect bump, is disclosed.
Thomas Scott Morris, Michael Meeder
Filed: 26 Aug 18
Utility
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14 Sep 20
The present disclosure relates to a wafer-level package that includes a first thinned die having a first device layer, a multilayer redistribution structure, a first mold compound, and a second mold compound.
Julio C. Costa, Jon Chadwick, David Jandzinski, Merrill Albert Hatcher, Jr., Jonathan Hale Hammond
Filed: 21 May 17
Utility
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14 Sep 20
Embodiments of the disclosure relate to a multi-mode power management system supporting fifth-generation new radio (5G-NR).
Nadim Khlat
Filed: 11 Dec 18
Utility
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14 Sep 20
Bulk Acoustic Wave (BAW) resonators that include a modified outside stack portion and methods for fabricating such BAW resonators are provided.
Alireza Tajic, Paul Stokes, Ralph Rothemund, Gernot Fattinger
Filed: 11 Dec 16
Utility
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9 Sep 20
A method for manufacturing a self-biased circulator includes cooling a nanocomposite material to a magnetization temperature below 200 K, applying an external magnetic field to the nanocomposite material to form a magnetic nanocomposite material, providing the magnetic nanocomposite material in a semiconductor substrate, and providing one or more metal layers over the magnetic nanocomposite material to form a circulator.
Yu Cao, Yongjie Cui, Subrahmanyam V. Pilla
Filed: 29 May 19
Utility
com4d0wqut97bj99dz9az8t4yfvzdq
9 Sep 20
Adaptive multi-standard signal classification and synchronization is disclosed.
Andrew Fort
Filed: 30 Jun 19
Utility
m1bch9yddjlvfpcsi66j4 m3x7gb78r2ia1j9lxrey5ku2mqkhz6jyhbi3n
9 Sep 20
Laminate structures and configurations of fiducials for laminates structures for electronic devices are disclosed.
John August Orlowski, Stephen Craig Parker, James Edwin Culler, JR.
Filed: 14 Apr 19
Utility
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7 Sep 20
Microelectromechanical system (MEMS) switches that provide low contact resistance over a large number of open and close contact cycles are disclosed.
Nadim Khlat, Jonathan Hale Hammond
Filed: 29 Oct 18
Utility
v435kufcv12kgllir7c3oxdb8oyli0m9tj1rh4j6hgp6jzwf1fp
7 Sep 20
Aspects disclosed in the detailed description include an antenna on a device assembly.
Alexander Wayne Hietala, Julio C. Costa
Filed: 4 Nov 15
Utility
asjy9zc5vjq77djrmkxwhcg1vdoc1q33alzjy5iwydcyc33ggj
2 Sep 20
An offset corrected bandgap reference and temperature sensor is disclosed.
Bruce John Tesch
Filed: 27 Feb 19
Utility
lj9136djjnqa9r4f8khjc t2ae8ssxc0qmaiubgoiy2dro1ql3
31 Aug 20
A method for processing product wafers using carrier substrates is disclosed.
Jonathan Hammond, Jan Edward Vandemeer, Julio Costa
Filed: 12 May 15
Utility
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26 Aug 20
An envelope tracking (ET) integrated circuit (IC) (ETIC) is provided.
Nadim Khlat
Filed: 22 Aug 19