1170 patents
Page 45 of 59
Utility
Spatial power-combining devices and antenna assemblies
22 Jun 20
Spatial power-combining devices and antenna assemblies for spatial power-combining devices are disclosed.
Ankush Mohan
Filed: 15 May 18
Utility
Low distortion multiple power amplifier power supply
22 Jun 20
A PA power supply, which includes a first ET power supply, power supply control circuitry, a first PMOS switching element, and a second PMOS switching element, is disclosed.
Manbir Singh Nag, Michael R. Kay, Philippe Gorisse, Nadim Khlat
Filed: 30 Aug 18
Utility
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17 Jun 20
A method for operating a wireless receiver includes receiving wireless signals from a transmitter at a first antenna and a second antenna.
Andrew Fort, Bram Van den Bosch
Filed: 13 Dec 18
Utility
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17 Jun 20
An acoustic device includes a foundation structure and a transducer provided over the foundation structure.
Jyothi Swaroop Sadhu, Ralph Rothemund, Alireza Tajic
Filed: 5 Feb 19
Utility
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17 Jun 20
The present disclosure relates to a wireless device including a mobile industry processor interface (MIPI) bus, a baseband processing module, and a radio frequency (RF) front-end module.
Gangadhar Burra
Filed: 9 Sep 19
Utility
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15 Jun 20
A high isolation duplexer/quasi circulator with two quadrature couplers is disclosed.
Kelly M. Lear, Jeffrey D. Galipeau
Filed: 9 Apr 19
Utility
6efu5v41xfxtigz8r097qxroasuxjcgchwadyu56uep1l4qfb
10 Jun 20
A high isolation duplexer/quasi circulator with two quadrature couplers is disclosed.
Kelly M. Lear, Jeffrey D. Galipeau
Filed: 9 Apr 19
Utility
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10 Jun 20
Antenna structures for spatial power-combining devices are disclosed.
Ankush Mohan, Dan Denninghoff, Soack Yoon
Filed: 9 Dec 18
Utility
0oc4nkbyoyami5p13aht78mixb
8 Jun 20
The present disclosure relates to a wafer-level package that includes a first thinned die having a first device layer, a multilayer redistribution structure, a first mold compound, and a second mold compound.
Julio C. Costa, Jon Chadwick, David Jandzinski, Merrill Albert Hatcher, Jr., Jonathan Hale Hammond
Filed: 21 May 17
Utility
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8 Jun 20
The present disclosure relates to a packaging process to enhance thermal and electrical performance of a wafer-level package.
Julio C. Costa, Jan Edward Vandemeer, Jonathan Hale Hammond, Merrill Albert Hatcher, Jr., Jon Chadwick
Filed: 22 Oct 18
Utility
8nva5u1tsubtbvjcqdkr0256txx6ae4m
8 Jun 20
A radio frequency (RF) front-end circuit is provided.
Nadim Khlat
Filed: 4 Nov 18
Utility
57j7tq2zqhchr92pbhkhrp5efo
8 Jun 20
An envelope tracking (ET) system is provided.
Nadim Khlat, Andrew F. Folkmann
Filed: 4 Feb 18
Utility
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8 Jun 20
A power amplifier system is disclosed.
Baker Scott, Hideya Oshima, George Maxim, Dirk Robert Walter Leipold
Filed: 28 Jun 18
Utility
5pe4gwvf0n9vhnp4t9d8qz1z255msntcg6vvyh49l282
3 Jun 20
The present disclosure relates to a thermally enhanced package, which includes a carrier, a thinned die over the carrier, a mold compound, and a heat extractor.
Julio C. Costa, George Maxim
Filed: 28 Nov 18
Utility
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3 Jun 20
A monolithic microwave integrated circuit (MMIC) with embedded transmission line (ETL) ground shielding is provided.
Andrew Arthur Ketterson
Filed: 19 Nov 19
Utility
0v4ff528zb7f75ntmzzbxvt0x105fhck3pu7rcf1xptqfgf62
3 Jun 20
Monolithic microwave integrated circuits (MMICs) with backside interconnects for fanout-style packaging are disclosed.
Andrew Arthur Ketterson, Christo Pavel Bojkov
Filed: 2 Sep 19
Utility
427cp3tberbbwsmgorj6ujo3i0vmu8rewx7pgfgag31ovx1zeygbw01ph
3 Jun 20
Embodiments of electrostatic discharge (ESD) protection circuits are disclosed along with methods of providing ESD protection.
Kathleen Muhonen
Filed: 4 Feb 20
Utility
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3 Jun 20
A group delay optimization circuit is provided.
Nadim Khlat
Filed: 19 May 19
Utility
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3 Jun 20
Acoustic filtering circuitry includes an input node, an output node, a signal transmission path, a series acoustic resonator, and a shunt acoustic resonator.
Andreas Tag, Fabien Dumont
Filed: 25 Mar 19
Utility
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1 Jun 20
A radio frequency (RF) multiplexer includes, for example, a common port, a first port for a first frequency band, a second port for a second frequency band, and a third port for a third frequency band.
Sam Mandegaran
Filed: 23 Oct 19