1170 patents
Page 39 of 59
Utility
Charge-pump tracker circuitry
9 Nov 20
Charge-pump tracker circuitry is disclosed having a first switch network configured to couple a first capacitor between a voltage input terminal and a ground terminal during a first charging phase and couple the first capacitor between the voltage input terminal and a pump output terminal during a first discharging phase.
Nadim Khlat, Michael R. Kay
Filed: 30 Dec 18
Utility
Low drop-out (LDO) voltage regulator with direct and indirect compensation circuit
9 Nov 20
A low drop-out (LDO) voltage regulator employs combined compensation methods for reduced capacitor area.
Bruce John Tesch
Filed: 10 Jul 19
Utility
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4 Nov 20
An envelope tracking (ET) integrated circuit (IC) (ETIC) is provided.
Nadim Khlat
Filed: 22 Oct 19
Utility
rxoh3mt7ibewp2l7m75yh93j65awa
28 Oct 20
Unwanted or parasitic capacitances may occur in MEMS switches.
Cornelius Petrus Elisabeth Schepens, Roberto Gaddi
Filed: 22 Apr 20
Utility
1mdgxpz9agbmmf3gy2vs9we3n92u2hu2q8eijcik6g2p
28 Oct 20
The present disclosure relates to a semiconductor package, which includes a carrier, a flip-chip die, a mold compound, and a heat spreader.
Robert Charles Dry
Filed: 9 Jul 20
Utility
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28 Oct 20
An envelope tracking (ET) apparatus is provided.
Nadim Khlat
Filed: 22 Oct 19
Utility
qob8q0bzi3r940aqnm95egi684 m8p8yow0i9m3czwqmldou9oxv
28 Oct 20
Antenna waveguide transitions for solid state power amplifiers (SSPAs) are disclosed.
Ankush Mohan, Soack Yoon, Dan Denninghoff
Filed: 13 Jul 20
Utility
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28 Oct 20
A radio frequency (RF) circuit is provided.
Vincenzo DiTommaso, Peter Richard Molnar, Jean Briot, Mudar AlJoumayly
Filed: 25 Apr 19
Utility
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28 Oct 20
A single-wire bus (SuBUS) apparatus is provided.
Alexander Wayne Hietala, Christopher Truong Ngo, Praveen Varma Nadimpalli
Filed: 22 Aug 19
Utility
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26 Oct 20
Spatial power-combining devices and, in particular, spatial power-combining devices with filtering elements are disclosed.
Ankush Mohan, Dan Denninghoff
Filed: 22 Mar 18
Utility
lkiuxejzhgql2ilfwe7x4aizethtdq45aao
26 Oct 20
An envelope tracking (ET) power amplifier circuit and related apparatus are provided.
Nadim Khlat
Filed: 15 Dec 19
Utility
ibutrwwutcj520h6pnq62o7km76 p1tjtcsdagl6
26 Oct 20
A multi-voltage generation circuit and related envelope tracking (ET) amplifier apparatus is provided.
Nadim Khlat
Filed: 6 Feb 19
Utility
q2718fmmwwsa451wtjayj19z9b2jyxh781ysaln6xr0eap
21 Oct 20
A hybrid bus apparatus is provided.
Christopher Truong Ngo, Alexander Wayne Hietala
Filed: 10 Oct 19
Utility
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21 Oct 20
A multi-bandwidth envelope tracking (ET) integrated circuit (IC) (ETIC) and related apparatus are provided.
Nadim Khlat
Filed: 1 Oct 19
Utility
15du7sas8zo0 5vo44h0kx
21 Oct 20
A multi-bandwidth envelope tracking (ET) integrated circuit (IC) (ETIC) is provided.
Nadim Khlat
Filed: 9 Oct 19
Utility
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19 Oct 20
The present disclosure relates to a shielded electronic module, which includes a module substrate, an electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a second mold compound over a bottom surface of the module substrate, and a shielding structure.
Thomas Scott Morris, Stephen Craig Parker, Jerry Holt, John Davisson, Rommel Quintero Nevarez
Filed: 17 Mar 19
Utility
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19 Oct 20
An apparatus is disclosed having a circulator having a transmit port, a receive port, and a tuner port with tuner circuitry coupled between the tuner port and an antenna port.
Charles Forrest Campbell
Filed: 17 Jan 19
Utility
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19 Oct 20
Antenna waveguide transitions for solid state power amplifiers (SSPAs) are disclosed.
Ankush Mohan, Soack Yoon, Dan Denninghoff
Filed: 10 Jul 18
Utility
8583nlhm1s5kpzrpq84mqv24glqpwyxcyp2no95m9n8c49e47rnbpf0
19 Oct 20
Radio frequency (RF) amplifier circuitry includes an input node, an output node, an amplifier, and bootstrap circuitry.
Marcus Granger-Jones, George Maxim, Jinsung Choi
Filed: 24 Mar 19
Utility
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19 Oct 20
A bulk acoustic wave MEMS resonator device includes at least one functionalization (e.g., specific binding or non-specific binding) material arranged over a top side electrode, with at least one patterned enhanced surface area element arranged between a lower surface of the top side electrode and the functionalization material.
Rio Rivas, Craig Andrus
Filed: 30 Oct 16