360 patents
Page 15 of 18
Utility
Inspection System with Grounded Capacitive Sample Proximity Sensor
14 Oct 20
A capacitive proximity measurement system may include a sensor electrode configured to be positioned proximate to a conductive measurement area on a test surface of a sample, a plate connector configured to provide an electrical connection between a system ground and a conductive plate parallel to the test surface, and a controller.
Yang Xie, Feilong Lin, Rushford A. Ogden
Filed: 1 May 19
Utility
Stochastic Reticle Defect Dispositioning
14 Oct 20
A system for stochastic reticle defect dispositioning is disclosed.
Moshe E. Preil, John J. Biafore, Alessandro Vaglio Pret
Filed: 18 Mar 20
Utility
Learnable Defect Detection for Semiconductor Applications
14 Oct 20
Methods and systems for learnable defect detection for semiconductor applications are provided.
Jing Zhang, Zhuoning Yuan, Yujie Dong, Kris Bhaskar
Filed: 1 Apr 20
Utility
Defect Candidate Generation for Inspection
14 Oct 20
Systems and methods for detecting defect candidates on a specimen are provided.
Martin Plihal, Erfan Soltanmohammadi, Prasanti Uppaluri, Mohit Jani, Chris Maher
Filed: 14 Oct 19
Utility
High power broadband illumination source
12 Oct 20
A system for generating broadband radiation is disclosed.
Oleg Khodykin, Ilya Bezel
Filed: 15 Jul 18
Utility
Semiconductor metrology based on hyperspectral imaging
12 Oct 20
Methods and systems for performing semiconductor measurements based on hyperspectral imaging are presented herein.
David Y. Wang, Alexander Buettner, Stilian Ivanov Pandev, Emanuel Saerchen, Andrei V. Shchegrov, Barry Blasenheim
Filed: 10 Jan 19
Utility
Algorithm selector based on image frames
12 Oct 20
Based on job dumps for defects of interest and nuisance events for multiple optical modes, detection algorithms, and attributes, the best combination of the aforementioned is identified.
Bjorn Brauer
Filed: 18 Apr 19
Utility
Metrology tool with combined X-ray and optical scatterometers
12 Oct 20
Methods and systems for performing simultaneous optical scattering and small angle x-ray scattering (SAXS) measurements over a desired inspection area of a specimen are presented.
Michael S. Bakeman, Andrei V. Shchegrov
Filed: 4 May 13
Utility
Photocathode designs and methods of generating an electron beam using a photocathode
12 Oct 20
A photocathode can include a body fabricated of a wide bandgap semiconductor material, a metal layer, and an alkali halide photocathode emitter.
Katerina Ioakeimidi, Gildardo R. Delgado, Michael E. Romero, Frances Hill, Rudy F. Garcia
Filed: 4 Dec 19
Utility
Methods and systems for co-located metrology
12 Oct 20
Methods and systems for performing co-located measurements of semiconductor structures with two or more measurement subsystems are presented herein.
David Y. Wang, Esen Salcin, Michael Friedmann, Derrick Shaughnessy, Andrei V. Shchegrov, Jonathan M. Madsen, Alexander Kuznetsov
Filed: 23 Jan 19
Utility
Automated Focusing System For Tracking Specimen Surface with a Configurable Focus Offset
7 Oct 20
An auto-focusing system is disclosed.
Xiumei Liu, Kai Cao, Richard Wallingford, Matthew Giusti, Brooke Bruguier
Filed: 30 Mar 20
Utility
Using Absolute Z-height Values for Synergy Between Tools
7 Oct 20
A semiconductor review tool receives absolute Z-height values for the semiconductor wafer, such as a semiconductor wafer with a beveled edge.
Sandeep Madhogarhia, Hari Sriraman Pathangi, Rohit Bhat
Filed: 30 Mar 20
Utility
System and method for fabricating semiconductor wafer features having controlled dimensions
5 Oct 20
A system and method are provided for fabricating semiconductor wafer features with controlled dimensions.
Farhat A. Quli
Filed: 7 Nov 18
Utility
Visualization of three-dimensional semiconductor structures
5 Oct 20
A semiconductor metrology tool inspects an area of a semiconductor wafer.
Aaron J. Rosenberg, Jonathan Iloreta, Thaddeus G. Dziura, Antonio Gellineau, Yin Xu, Kaiwen Xu, John Hench, Abhi Gunde, Andrei Veldman, Liequan Lee, Houssam Chouaib
Filed: 21 Feb 19
Utility
Hybrid design layout to identify optical proximity correction-related systematic defects
5 Oct 20
Defects can be identified using a hybrid design layout that includes a printable layer and a non-printed layer.
Allen Park, Ankit Jain
Filed: 25 Nov 18
Utility
Method for Measuring and Correcting Misregistration Between Layers In a Semiconductor Device, and Misregistration Targets Useful Therein
30 Sep 20
A method for measurement of misregistration in the manufacture of semiconductor device wafers, the method including measuring misregistration between layers of a semiconductor device wafer at a first instance and providing a first misregistration indication, measuring misregistration between layers of a semiconductor device wafer at a second instance and providing a second misregistration indication, providing a misregistration measurement difference output in response to a difference between the first misregistration indication and the second misregistration indication, providing a baseline difference output and ameliorating the difference between the misregistration measurement difference output and the baseline difference output.
Roie Volkovich, Renan Milo, Liran Yerushalmi, Moran Zaberchik, Yoel Feler, David Izraeli
Filed: 5 May 19
Utility
Die Screening Using Inline Defect Information
30 Sep 20
Embodiments herein include methods, systems, and apparatuses for die screening using inline defect information.
Alex Teng Song Lim, Ganesh Meenakshisundaram
Filed: 11 Jun 19
Utility
Prediction based chucking and lithography control optimization
28 Sep 20
Prediction based systems and methods for optimizing wafer chucking and lithography control are disclosed.
Bin-Ming Benjamin Tsai, Oreste Donzella, Pradeep Vukkadala, Jaydeep Sinha
Filed: 29 Jul 18
Utility
Semi-supervised anomaly detection in scanning electron microscope images
28 Sep 20
Autoencoder-based, semi-supervised approaches are used for anomaly detection.
Shaoyu Lu, Li He, Sankar Venkataraman
Filed: 20 Aug 18
Utility
Scanning electron microscope objective lens calibration using X-Y voltages iteratively determined from images obtained using said voltages
28 Sep 20
Objective lens alignment of a scanning electron microscope review tool with fewer image acquisitions can be obtained using the disclosed techniques and systems.
Ichiro Honjo, Christopher Sears, Hedong Yang, Thanh Ha, Jianwei Wang, Huina Xu
Filed: 8 Aug 17