10908 patents
Page 20 of 546
Utility
Product design for test to enable electrical non-destructive test for measuring multi-chip interconnect defects
31 Oct 23
A semiconductor stack, including a carrier and a semiconductor device arranged above the carrier; non-releasable interconnections electrically and mechanically connecting the semiconductor device and the carrier; a first contact on at least one of the carrier or the semiconductor device: a second contact on at least one of the carrier or the semiconductor device; an electrical connection structure electrically conductively coupling the first contact and the second contact with each other via at least one non-releasable interconnection of the non-releasable interconnections; and wherein the electrical connection structure comprises a plurality of test diode circuits integrated in at least one of the carrier and the semiconductor device, wherein each of the test diode circuits comprises one or more diodes.
Chad Roberts, George J. Morales, Oscar Mendoza, Kartik Ramanujachar, Michael S. Chun, Anthony Zisko
Filed: 29 Aug 22
Utility
Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions
31 Oct 23
A heat exchange module, comprising an array of microchannels, where the array of microchannels extends in a first direction, and are separated from one another by a first sidewall.
Nicholas Neal, Je-Young Chang, Jae Kim, Ravindranath Mahajan
Filed: 11 Jan 19
Utility
Core-shell particles for magnetic packaging
31 Oct 23
A package substrate may include a build-up layer.
Brandon Marin, Whitney Bryks
Filed: 27 Jun 18
Utility
Integrated circuit structures in package substrates
31 Oct 23
Disclosed herein are integrated circuit (IC) structures that may be included in package substrates.
Sanka Ganesan, William James Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael James Hill, Zhenguo Jiang
Filed: 19 Jul 21
Utility
Microelectronic structures including bridges
31 Oct 23
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods.
Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia, Debendra Mallik
Filed: 16 Jun 20
Utility
Substrate integrated thin film capacitors using amorphous high-k dielectrics
31 Oct 23
Embodiments include an electronic package that includes a dielectric layer and a capacitor on the dielectric layer.
Aleksandar Aleksov, Thomas Sounart, Kristof Darmawikarta, Henning Braunisch, Prithwish Chatterjee, Andrew J. Brown
Filed: 4 Oct 22
Utility
Wirebond and leadframe magnetic inductors
31 Oct 23
A microelectronics package, comprising a substrate comprising a first bondpad and a second bondpad over a dielectric.
William J. Lambert, Omkar Karhade, Martin Rodriguez, Gregorio R. Murtagian
Filed: 21 Aug 18
Utility
Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control
31 Oct 23
Embodiments include semiconductor packages and methods to form the semiconductor packages.
Xavier F. Brun, Kaizad Mistry, Paul R. Start, Nisha Ananthakrishnan, Yawei Liang, Jigneshkumar P. Patel, Sairam Agraharam, Liwei Wang
Filed: 22 Aug 19
Utility
High aspect ratio source or drain structures with abrupt dopant profile
31 Oct 23
Integrated circuit structures having source or drain structures with abrupt dopant profiles are described.
Ryan Keech, Anand S. Murthy, Nicholas G. Minutillo, Suresh Vishwanath, Mohammad Hasan, Biswajeet Guha, Subrina Rafique
Filed: 24 Sep 19
Utility
Chassis for an electronic device, electronic device, antenna module, and method for fabricating an electronic device
31 Oct 23
A chassis for an electronic device is provided.
Jayprakash Thakur, Maruti Tamrakar, Sagar Gupta, Harry G. Skinner, Prakash Kurma Raju
Filed: 24 Sep 21
Utility
Snap button fastener providing electrical connection
31 Oct 23
Embodiments are generally directed to a snap button fastener providing electrical connection.
Hans-Joachim Barth, Bastiaan Elshof, Jan Proschwitz
Filed: 23 May 22
Utility
Wireless charging device for electronic device
31 Oct 23
Systems and methods may provide for wireless charging device of an electronic device powered by a rechargeable battery.
Gregory A. Peek, Mark R. Francis, Torrey W. Frank
Filed: 15 Mar 21
Utility
Programmable logic device virtualization
31 Oct 23
A device includes a programmable logic fabric.
David Alexander Munday, Randall Carl Bilbrey, Jr., Evan Custodio
Filed: 11 Apr 22
Utility
Methods, systems, articles of manufacture, and apparatus to decode zero-value-compression data vectors
31 Oct 23
Methods, systems, articles of manufacture, and apparatus are disclosed to decode zero-value-compression data vectors.
Gautham Chinya, Debabrata Mohapatra, Arnab Raha, Huichu Liu, Cormac Brick
Filed: 27 Mar 20
Utility
Orbital angular momentum (OAM) mode multiplexing transmission system
31 Oct 23
Orbital angular momentum (OAM)-based multiplexing includes accessing distinct data streams to be multiplexed and transmitted according to a corresponding plurality of OAM modes.
Hossein Alavi, Harry G. Skinner, Adesoji J. Sajuyigbe
Filed: 15 Sep 21
Utility
Resources selection for feedback based NR-V2X communication
31 Oct 23
Devices and systems of sensing, resource selection and control signaling for feedback-less and feedback-based NR-V2X sidelink communication are described.
Alexey Khoryaev, Sergey Panteleev, Mikhail Shilov, Andrey Chervyakov
Filed: 8 Mar 22
Utility
Technologies for timestamping with error correction
31 Oct 23
Technologies for timestamping data packets with forward error correction is disclosed.
Yoni Landau, Janardhan Satyanarayana, Assaf Benhamou, Mark Bordogna
Filed: 20 Sep 22
Utility
Scalable traffic management using one or more processor cores for multiple levels of quality of service
31 Oct 23
Packets are differentiated based on their traffic class.
Jasvinder Singh, John J. Browne, Tomasz Kantecki, Chris Macnamara
Filed: 27 Feb 19
Utility
Technologies for flexible and automatic mapping of disaggregated network communication resources
31 Oct 23
Technologies for dynamic allocation of network communication resources includes a resource manager server to allocate a set of network communication resources to a compute device through an expansion bus switch that is coupled to the compute device and to the network communication resources.
Francesc Guim Bernat, Antonino Albarran, Jaime Sanz, Raghu R. Kondapalli, Alexander Bachmutsky
Filed: 1 Dec 22
Utility
Apparatus and method for buffer management for receive segment coalescing
31 Oct 23
Packets received non-contiguously from a network are processed by a network interface controller by coalescing received packet payload into receive buffers on a receive buffer queue and writing descriptors associated with the receive buffers for a same flow consecutively in a receive completion queue.
Linden Cornett, Noam Elati, Anjali Singhai Jain, Parthasarathy Sarangam, Eliel Louzoun, Manasi Deval
Filed: 2 Mar 20