10908 patents
Page 22 of 546
Utility
Dynamic distributed training of machine learning models
24 Oct 23
In an example, an apparatus comprises a plurality of execution units comprising at least a first type of execution unit and a second type of execution unit and logic, at least partially including hardware logic, to analyze a workload and assign the workload to one of the first type of execution unit or the second type of execution unit.
Altug Koker, Abhishek R. Appu, Kamal Sinha, Joydeep Ray, Balaji Vembu, Elmoustapha Ould-Ahmed-Vall, Sara S. Baghsorkhi, Anbang Yao, Kevin Nealis, Xiaoming Chen, John C. Weast, Justin E. Gottschlich, Prasoonkumar Surti, Chandrasekaran Sakthivel, Farshad Akhbari, Nadathur Rajagopalan Satish, Liwei Ma, Jeremy Bottleson, Eriko Nurvitadhi, Travis T. Schluessler, Ankur N. Shah, Jonathan Kennedy, Vasanth Ranganathan, Sanjeev Jahagirdar
Filed: 24 Apr 17
Utility
Asset caching in cloud rendering computing architectures
24 Oct 23
Systems, apparatuses and methods may provide for technology that sends a first message via an input output (IO) link, wherein the first message includes a first rendering asset and an identifier (ID) associated with the first rendering asset.
Changliang Wang, Mohammad R. Haghighat, Yong Yao, Xiaocheng Mao, Yifei Xue, Bin Yang, Jia Bao, Raul Diaz
Filed: 20 Dec 19
Utility
5ki4mxpsp32l9svkrl62b3ypbdq4nxflsacv
24 Oct 23
One embodiment provides for a method of transmitting data between multiple compute nodes of a distributed compute system, the method comprising creating a global view of communication operations to be performed between the multiple compute nodes of the distributed compute system, the global view created using information specific to a machine learning model associated with the distributed compute system; using the global view to determine a communication cost of the communication operations; and automatically determining a number of network endpoints for use in transmitting the data between the multiple compute nodes of the distributed compute system.
Dhiraj D. Kalamkar, Karthikeyan Vaidyanathan, Srinivas Sridharan, Dipankar Das
Filed: 10 Aug 21
Utility
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24 Oct 23
An apparatus and method for dynamic provisioning, quality of service, and prioritization in a graphics processor.
Abhishek R. Appu, Joydeep Ray, Altug Koker, Balaji Vembu, Pattabhiraman K, Matthew B. Callaway
Filed: 31 May 22
Utility
j4fbzr3xyk37szyjaxvd1g8qlvmhissixmvuaqtqkofs7oezbf
24 Oct 23
A sensor calibrator comprising one or more processors configured to receive sensor data representing a calibration pattern detected by a sensor during a period of relative motion between the sensor and the calibration pattern in which the sensor or the calibration pattern move along a linear path of travel; determine a calibration adjustment from the plurality of images; and send a calibration instruction for calibration of the sensor according to the determined calibration adjustment.
Ignacio Alvarez, Cornelius Buerkle, Maik Sven Fox, Florian Geissler, Ralf Graefe, Yiwen Guo, Yuqing Hou, Fabian Oboril, Daniel Pohl, Alexander Carl Unnervik, Xiangbin Wu
Filed: 27 Mar 20
Utility
795 y7uk8dui4a2lvzqgq5r1h1gsqi1e7l8r3ptbspzt5cqg
24 Oct 23
Embodiments are generally directed to compression in machine learning and deep learning processing.
Joydeep Ray, Ben Ashbaugh, Prasoonkumar Surti, Pradeep Ramani, Rama Harihara, Jerin C. Justin, Jing Huang, Xiaoming Cui, Timothy B. Costa, Ting Gong, Elmoustapha Ould-ahmed-vall, Kumar Balasubramanian, Anil Thomas, Oguz H. Elibol, Jayaram Bobba, Guozhong Zhuang, Bhavani Subramanian, Gokce Keskin, Chandrasekaran Sakthivel, Rajesh Poornachandran
Filed: 10 Jan 23
Utility
amkz0pbiwu854yptwjukssato
24 Oct 23
A mechanism is described for facilitating depth and motion estimation in machine learning environments, according to one embodiment.
Koba Natroshvili, Kay-Ulrich Scholl
Filed: 26 May 21
Utility
l4rr7a70oqq6cdrsdg7rs3iiiml7krbiqxu3d k5c0l9d5sgm
24 Oct 23
Embodiments herein describe techniques for a semiconductor device including a carrier wafer, and an integrated circuit (IC) formed on a device wafer bonded to the carrier wafer.
Ehren Mannebach, Aaron Lilak, Rishabh Mehandru, Hui Jae Yoo, Patrick Morrow, Kevin Lin
Filed: 19 Mar 19
Utility
co3qnd8ltt0wwohou057hgbs qkrgvziv501d6s
24 Oct 23
Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate.
Peng Li, Kelly P. Lofgreen, Manish Dubey, Bamidele Daniel Falola, Ken Hackenberg, Shenavia S. Howell, Sergio Antonio Chan Arguedas, Yongmei Liu, Deepak Goyal
Filed: 8 Jul 19
Utility
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24 Oct 23
Embodiments disclosed herein include electronic packages and methods of forming such electronic packages.
Ravindranath Mahajan, Debendra Mallik, Sujit Sharan, Digvijay Raorane
Filed: 4 Mar 19
Utility
5kor2m93wp8wffgf0sxx2dwyknjrzvd7lhixo051lo08msh071 z2x0h3n
24 Oct 23
A glass substrate houses an embedded multi-die interconnect bridge that is part of a semiconductor device package.
Srinivas V. Pietambaram, Tarek Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik, Robert L. Sankman
Filed: 1 Oct 21
Utility
fup8bf54kv8a07u7ps94fsvdhec72qodgsbygqrz0
24 Oct 23
Integrated circuit (IC) packages having a through-via interposer with an embedded die, as well as related structures, devices, and methods, are disclosed herein.
John S. Guzek
Filed: 14 Jan 21
Utility
67l97gxzbz7hspj9htofllzbumbluaziqrn3mocgt8ikxi
24 Oct 23
The technique described herein includes a device to address the electrical performance (e.g. signal integrity) degradation ascribed to electromagnetic interference and/or crosstalk coupling occur at tightly coupled (e.g. about 110 μm pitch or less) interconnects, including the first level (e.g. the interconnection between a die and a package substrate).
Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Kooi Chi Ooi, Min Suet Lim
Filed: 25 Jun 19
Utility
an31tfz5yg6vz901aapeqqrp9z2350vvl5drzf0vkqkp59z wv
24 Oct 23
An offset interposer includes a land side including land-side ball-grid array (BGA) and a package-on-package (POP) side including a POP-side BGA.
Russell K. Mortensen, Robert M. Nickerson, Nicholas R. Watts
Filed: 30 Jun 22
Utility
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24 Oct 23
A device is disclosed.
Aaron Lilak, Rishabh Mehandru, Willy Rachmady, Harold Kennel, Tahir Ghani
Filed: 28 Jun 19
Utility
ou4zm9vq0mhzqssn7xd2oylcm
24 Oct 23
Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact are described.
Biswajeet Guha, William Hsu, Chung-Hsun Lin, Kinyip Phoa, Oleg Golonzka, Tahir Ghani
Filed: 17 Dec 19
Utility
t3w qcc2wc0qh1po24mta1lbkqpuyztvawwluj7pe3ijar
24 Oct 23
Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures.
Tahir Ghani, Byron Ho, Michael L. Hattendorf, Christopher P. Auth
Filed: 24 Mar 22
Utility
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24 Oct 23
Described is an apparatus which comprises: a first layer comprising a semiconductor; a second layer comprising an insulating material, the second layer adjacent to the first layer; a third layer comprising a high-k insulating material, the third layer adjacent to the second layer; a fourth layer comprising a ferroelectric material, the fourth layer adjacent to the third layer; and a fifth layer comprising a high-k insulating material, the fifth layer adjacent to the fourth layer.
Uygar E. Avci, Joshua M. Howard, Seiyon Kim, Ian A. Young
Filed: 15 Dec 21
Utility
thg9y2tpbqjtn91e65fcslxe1meco5nucioi8ilhxk4yw1b83x6zs7sky
24 Oct 23
Gate-all-around integrated circuit structures having asymmetric source and drain contact structures, and methods of fabricating gate-all-around integrated circuit structures having asymmetric source and drain contact structures, are described.
Biswajeet Guha, Mauro J. Kobrinsky, Tahir Ghani
Filed: 5 May 22
Utility
p6x16465xzw912xk1fsv68ezmx3q9dvu02j4
24 Oct 23
Light emitting devices employing one or more Group III-Nitride polarization junctions.
Han Wui Then, Sansaptak Dasgupta, Marko Radosavljevic
Filed: 19 Nov 21