10908 patents
Page 67 of 546
Utility
Method, apparatus and system to perform action recognition with a spiking neural network
16 May 23
Techniques and mechanisms for processing differential video data with a spiking neural network to provide action recognition functionality.
Narayan Srinivasa
Filed: 19 Dec 17
Utility
Three-dimensional oscillator structure
16 May 23
Embodiments may relate to a structure to be used in a neural network.
Dmitri E. Nikonov, Elijah V. Karpov, Ian A. Young
Filed: 18 Dec 21
Utility
tyfr5jabdb242gxcbnomuidovaecz
16 May 23
Described herein are magnetic core inductors (MCI) and methods for manufacturing magnetic core inductors.
Junnan Zhao, Ying Wang, Cheng Xu, Kyu Oh Lee, Sheng Li, Yikang Deng
Filed: 28 Sep 17
Utility
tjbosp6h3o4q1nzc0i 370ct78wfiwumky0mx618fcdvjk7bmi9i3jkqf
16 May 23
Embodiments herein relate to systems, apparatuses, processing, and techniques related to patterning one or more sides of a thin film capacitor (TFC) sheet, where the TFC sheet has a first side and a second side opposite the first side.
Rahul Jain, Andrew J. Brown, Prithwish Chatterjee, Sai Vadlamani, Lauren Link
Filed: 29 Jun 18
Utility
lnghjanngpv6denv8rl05qvn4k
16 May 23
A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.
Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Syadwad Jain, Nachiket R. Raravikar
Filed: 9 Jun 21
Utility
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16 May 23
Integrated circuit assemblies, electronic systems, and methods for fabricating the same are disclosed.
Chia-Pin Chiu, Robert Sankman
Filed: 29 May 19
Utility
8w5spdvdz8td68gwujojiy70rtz7i
16 May 23
An electronic device comprises an integrated circuit (IC) die.
Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Wai Ling Lee, Tat Hin Tan
Filed: 28 Jan 22
Utility
nig1xs5tpue800s2lbush1z9ya58ik2fqsp7vf5f8j704
16 May 23
A semiconductor structure is disclosed.
Florence Pon, Yi Xu, Min-Tih Lai
Filed: 13 Dec 18
Utility
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16 May 23
An example via contact patterning method includes providing a pattern of alternating trench contacts and gates over a support structure.
Mohit K. Haran, Daniel James Bahr, Deepak S. Rao, Marvin Young Paik, Seungdo An, Debashish Basu, Kilhyun Bang, Jason W. Klaus, Reken Patel, Charles Henry Wallace, James Jeong, Ruth Amy Brain
Filed: 27 Oct 21
Utility
uv9g4oliodrv8ly1mvudutu8gn714atggyt5pp7zz65djlu3xj8il5zw2
16 May 23
Disclosed herein are via-trace structures with improved alignment, and related package substrates, packages, and computing device.
Jeremy Ecton, Hiroki Tanaka, Kristof Kuwawi Darmawikarta, Oscar Ojeda, Arnab Roy, Nicholas Haehn
Filed: 2 Apr 18
Utility
jx4vi3f04efbpiofse6yvkb4ah60z1abedu3dme
16 May 23
Embodiments herein describe techniques for a semiconductor device having an interconnect structure including an inter-level dielectric (ILD) layer between a first layer and a second layer of the interconnect structure.
Travis W. Lajoie, Abhishek A. Sharma, Van H. Le, Chieh-Jen Ku, Pei-Hua Wang, Jack T. Kavalieros, Bernhard Sell, Tahir Ghani, Gregory George, Akash Garg, Julie Rollins, Allen B. Gardiner, Shem Ogadhoh, Juan G. Alzate Vinasco, Umut Arslan, Fatih Hamzaoglu, Nikhil Mehta, Ting Chen, Vinaykumar V. Hadagali
Filed: 28 Jun 19
Utility
mxwcgnnsexpog4sxsnorzt0al5c2 p9n1wmymneyli0qzxymdptx83d6m
16 May 23
Embodiments disclose electronic packages with a die assembly and methods of forming such electronic packages.
Khang Choong Yong, Eng Huat Goh, Min Suet Lim, Robert Sankman, Telesphor Kamgaing, Wil Choon Song, Boon Ping Koh
Filed: 7 May 19
Utility
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16 May 23
Techniques and mechanisms for high interconnect density communication with an interposer.
Adel Elsherbini, Shawna Lift, Johanna Swan, Gerald Pasdast
Filed: 29 Nov 21
Utility
kqn8w7ll1hjvk9sbk8x69xt7edy1exhk0ou9iry91aqrm
16 May 23
A method is disclosed.
Wilfred Gomes, Mark Bohr, Rajabali Koduri, Leonard Neiberg, Altug Koker, Swaminathan Sivakumar
Filed: 28 Dec 18
Utility
ocziusy5pe14d0iftkr6l12d9zunej1da
16 May 23
Embodiments may relate to a microelectronic package that includes a die and a backside metallization (BSM) layer positioned on the face of the die.
Shenavia S. Howell, John J. Beatty, Raymond A. Krick, Suzana Prstic
Filed: 17 Jun 19
Utility
4ltz7bam8ekxrqw9e6c8yls 30mxljpfft45nszkl709j
16 May 23
Methods/structures of forming substrate tap structures are described.
Christopher J. Jezewski, Radek P. Chalupa, Flavio Griggio, Inane Meric, Jiun-Chan Yang
Filed: 28 Dec 16
Utility
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16 May 23
A substrate for an electronic device may include a first layer, a second layer, and may include a third layer.
Brandon C Marin, Shivasubramanian Balasubramanian, Rahul Jain, Praneeth Akkinepally, Jeremy D Ecton
Filed: 26 Jan 21
Utility
gekw4vuhawx14skpg0s1at04jifubktxbj
16 May 23
An apparatus is provided which comprises: a first set of one or more metal pads on a first substrate surface, the first set of one or more metal pads to couple with contacts of an integrated circuit die, a second set of one or more metal pads on the first substrate surface, the second set of one or more metal pads to couple with semiconductor surfaces of the integrated circuit die, one or more thermal regions below the first substrate surface, wherein the one or more thermal regions comprise thermally conductive material and are coupled with the second set of one or more metal pads, dielectric material adjacent the one or more thermal regions, and one or more conductive contacts on a second substrate surface, opposite the first substrate surface, the one or more conductive contacts coupled with the first set of one or more metal pads, and the one or more conductive contacts to couple with contacts of a printed circuit board.
Feras Eid, Johanna Swan
Filed: 29 Sep 17
Utility
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16 May 23
An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface.
Mihir Oka, Kartik Srinivasan, Wei Tan, James Mellody
Filed: 27 May 21
Utility
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16 May 23
Embodiments include diode devices and transistor devices.
Nicholas Thomson, Ayan Kar, Kalyan Kolluru, Nathan Jack, Rui Ma, Mark Bohr, Rishabh Mehandru, Halady Arpit Rao
Filed: 20 Jun 19