929 patents
Utility
Methods and Apparatus for Controlling Plasma In a Plasma Processing System
18 Jan 24
Methods and apparatus for processing a substrate in a multi-frequency plasma processing chamber are disclosed.
John C. Valcore, JR., Bradford J. Lyndaker
Filed: 26 Sep 23
Utility
Metal Etch
18 Jan 24
A method for etching a metal containing material is provided.
Yiwen FAN, Wenbing YANG, Ran LIN, Samantha SiamHwa TAN, Timothy William WEIDMAN, Tamal MUKHERJEE
Filed: 6 Dec 21
Utility
Coated Conductor for Heater Embedded In Ceramic
18 Jan 24
Various embodiments herein relate to techniques for fabricating a platen for use in a semiconductor processing apparatus, as well as the platens and intermediate structures produced by such techniques.
Joel Hollingsworth, Ramkishan Rao Lingampalli, Pankaj Hazarika
Filed: 28 Sep 21
Utility
Collaborative Robot System on a Mobile Cart with a Chamber Docking System
11 Jan 24
A robot system for servicing a semiconductor tool includes a cart frame.
Vitali Brand, Kamesh Venkata Gadepally, Jiawei Zhao, Dan Marohl, Niraj Vaghela, Heng Liu, Alexander James Walker, Zachary Jake Blum, Matthew Christopher Clark, Jessica Jeana Kim
Filed: 2 Mar 21
Utility
Distribution System for a Process Fluid and an Electric Current for a Chemical And/or Electrolytic Surface Treatment of a Substrate
11 Jan 24
The disclosure relates to a distribution system (1) for a process fluid (18) and an electric current for an electrolytic surface treatment of a substrate (9), comprising a distribution body (2), a primary cathode (30), and a secondary cathode (3), wherein the distribution body (2) comprises several openings (4) for the process fluid (18) and the electric current, wherein the several openings (4) are arranged at a front face (10) of the distribution body (2), wherein the front face (10) is directed to the primary cathode (30), wherein the primary cathode (30) and the secondary cathode (3) are arranged to attract the electric current and to guide the electric current to the substrate (9) to be treated, wherein the secondary cathode (3) comprises several cathode pixels (13), wherein the several cathode pixels (13) are distributed in an array to be aligned with at least an area of the substrate (9) to be treated, and wherein the several cathode pixels (13) are individually controllable for adjusting a distribution of the electric current at the substrate (9).
Andreas Gleissner, Herbert Ă–tzlinger
Filed: 11 Nov 21
Utility
C-shroud Modification For Plasma Uniformity Without Impacting Mechanical Strength Or Lifetime Of The C-shroud
11 Jan 24
A confinement ring for use in a plasma processing chamber includes an upper horizontal section, a vertical section, and a lower horizontal section.
Pratik Mankidy, Jaewon Kim, Harmeet Singh, Ming Li
Filed: 14 Jan 22
Utility
Precursor Dispensing Systems with Line Charge Volume Containers for Atomic Layer Deposition
4 Jan 24
A precursor dispensing system includes a source, an ampoule, a first valve, a second valve, a line charge volume container and a controller.
Saangrut SANGPLUG, Aaron DURBIN, Murthi MURUGAIYAN, Aaron Blake MILLER, Huatan QIU, Gopinath BHIMARASETTI, Vikrant RAI, Vincent WILSON
Filed: 1 Dec 21
Utility
Backside Deposition and Local Stress Modulation for Wafer Bow Compensation
4 Jan 24
In A bow compensation layer deposited on a backside of a bowed semiconductor substrate may modulate stress to mitigate asymmetric bowing.
Yanhui Huang, Vignesh Chandrasekar, Shriram Vasant Bapat, Adriana Vintila
Filed: 19 Nov 21
Utility
Low Resistance Pulsed CVD Tungsten
4 Jan 24
Provided herein are methods of depositing tungsten (W) films without depositing a nucleation layer.
Yu PAN, Yao-Tsung HSIEH, Xiaolan BA, Juwen GAO
Filed: 16 Nov 21
Utility
Photoresist Development with Organic Vapor
28 Dec 23
Development of resists are useful, for example, to form a patterning mask in the context of high-resolution patterning.
Dries DICTUS, Chenghao WU, Eric Calvin HANSEN, Timothy William WEIDMAN
Filed: 3 Dec 21
Utility
Pedestal Including Seal
28 Dec 23
A pedestal assembly for a substrate processing system includes a pedestal including a pedestal plate with a plurality of gas through holes and a stem extending downwardly from the pedestal plate.
Christopher GAGE
Filed: 9 Nov 21
Utility
Tool for Preventing or Suppressing Arcing
28 Dec 23
A tool that suppresses or altogether eliminates arcing between a substrate pedestal and substrate is disclosed.
Yukinori SAKIYAMA, Karl Frederick LEESER, Vincent BURKHART
Filed: 8 Sep 23
Utility
Reflectometer to Monitor Substrate Movement
28 Dec 23
Various embodiments include a reflectometer and a reflectometry system for monitoring movements of a substrate, such as a silicon wafer.
Eric A. Pape, Dmitry Opaits, Jorge Luque, Jeffrey D. Bonde, Siyuan Tian
Filed: 11 Sep 23
Utility
MULTl-STATION TOOL WITH ROTATABLE TOP PLATE ASSEMBLY
28 Dec 23
Semiconductor processing tools with multi-station processing chambers are provided that include a rotational bearing mechanism that allows a top plate assembly thereof to be rotated during maintenance and service operations.
Karl Frederick Leeser, Adrien LaVoie
Filed: 26 Oct 21
Utility
Apparatuses and Methods for Avoiding Electrical Breakdown from RF Terminal to Adjacent Non-rf Terminal
28 Dec 23
An isolation system includes an input junction coupled to one or more RF power supplies via a match network for receiving radio frequency (RF) power.
Hyungjoon Kim, Sunil Kapoor, Karl Leeser, Vince Burkhart
Filed: 11 Sep 23
Utility
Process Kit De-bubbling
21 Dec 23
In some examples, an electroplating apparatus is provided for depositing a metal layer on a substrate.
James Isaac Fortner, Steven T. Mayer, Stephen J. Banik
Filed: 30 Nov 21
Utility
Ceramic Component with Channels
21 Dec 23
A method for forming a component for a plasma processing chamber is provided.
John Michael KERNS, David Joseph WETZEL, Lin XU, Pankaj HAZARIKA, Douglas DETERT, Lei LIU, Eric A. PAPE
Filed: 1 Nov 21
Utility
Apparatus for Processing a Wafer-shaped Article
21 Dec 23
An apparatus for processing a wafer-shaped article, the apparatus comprising: a support for supporting the wafer-shaped article; and a liquid dispenser for dispensing a processing liquid onto a surface of the wafer-shaped article supported by the support; wherein the liquid dispenser comprises a nozzle assembly, the nozzle assembly comprising: an inlet portion; a dispensing nozzle; and a static throttle between the inlet portion and the dispensing nozzle, the static throttle comprising a plurality of flow passages through which the processing liquid can flow from the inlet portion to the dispensing nozzle.
Karl-Heinz HOHENWARTER, Bhaskar BANDARAPU, Christian PUTZI
Filed: 14 Oct 21
Utility
Sublimation Control Using Downstream Pressure Sensing
14 Dec 23
A system to control gas flow includes an ampoule to store a solid precursor.
Marvin Clayton BREES, Davinder SHARMA, Panya WONGSENAKHUM
Filed: 17 Nov 21
Utility
Tunable Upper Plasma-exclusion-zone Ring for a Bevel Etcher
14 Dec 23
A tunable upper plasma exclusion zone (PEZ) ring adjusts a distance of plasma during processing in a processing chamber and includes: a lower surface that includes: a horizontal portion; and an upwardly tapered outer portion that is conical and that extends outwardly and upwardly from the horizontal portion at an upward taper angle of about 5° to 50° with respect to the horizontal portion, where an outer diameter of the upwardly tapered outer portion is greater than 300 millimeters (mm), and where an inner diameter where the upwardly tapered outer portion begins to extend upwardly is less than 300 mm.
Jack CHEN, Adam LIRON, Gregory SEXTON
Filed: 24 Aug 23