929 patents
Page 5 of 47
Utility
Metal Oxide with Low Temperature Fluorination
21 Sep 23
A method for providing a component for using in a plasma processing chamber is provided, wherein the component has a plasma facing surface.
Eric A. PAPE, Robin KOSHY
Filed: 6 Jul 21
Utility
Systems and Methods for Extracting Process Control Information from Radiofrequency Supply System of Plasma Processing System
21 Sep 23
A first radiofrequency signal generator is set to generate a low frequency signal.
Ranadeep Bhowmick, Alexei Marakhtanov, Felix Leib Kozakevich, John Holland
Filed: 28 Jun 21
Utility
Optimizing Edge Radical Flux In a Downstream Plasma Chamber
21 Sep 23
A showerhead for a processing chamber in a substrate processing system includes an upper portion having a lower surface and an upper surface and a faceplate.
Andrew Stratton BRAVO, Pilyeon PARK, Serge KOSCHE, Julien Augustin MONBEIG, Mark KAWAGUCHI, Stephen WHITTEN, Shih-Chung KON
Filed: 14 Dec 21
Utility
Plasma Uniformity Control Using a Static Magnetic Field
21 Sep 23
A system for performing a plasma process on a wafer is provided, including: a chamber configured to receive a wafer for plasma processing and having an interior defining a plasma processing region in which a plasma is provided for the plasma processing of the wafer; a first magnetic coil disposed above the chamber and centered about an axis perpendicular to a surface plane of the wafer and through an approximate center of the wafer; a first DC power supply configured to apply a first DC current to the first magnetic coil during the plasma processing, the applied first DC current producing a magnetic field in the plasma processing region that reduces non-uniformity of the plasma.
Alexei Marakhtanov, Bing Ji, Ken Lucchesi, John Holland
Filed: 2 Nov 21
Utility
Subtractive Copper Etch
21 Sep 23
A method for atomic layer etching copper or copper alloy over a substrate in a plasma processing chamber comprising a plurality of cycles is provided.
Wenbing YANG, Ran LIN, Samantha SiamHwa TAN, Mohand BROURI, Yang PAN
Filed: 12 Aug 21
Utility
Ultrathin Atomic Layer Deposition Film Accuracy Thickness Control
21 Sep 23
Methods for depositing ultrathin films by atomic layer deposition with reduced wafer-to-wafer variation are provided.
Jun Qian, Hu Kang, Adrien LaVoie, Seiji Matsuyama, Purushottam Kumar
Filed: 22 Mar 23
Utility
Copper Electrodeposition Sequence for the Filling of Cobalt Lined Features
21 Sep 23
In one example, an electroplating system comprises a bath reservoir, an anode in the bath reservoir, and a direct-current power supply.
Jeyavel Velmurugan, Bryan L. Buckalew, Thomas A. Ponnuswamy
Filed: 25 May 23
Utility
Metal-based Liner Protection for High Aspect Ratio Plasma Etch
21 Sep 23
High aspect ratio features are formed in a substrate using etching and deposition processes.
Gregory Clinton Veber, Shuang Pi, Taner Ozel, Eric A. Hudson, Qing Xu, Merrett Wong, Amit Mukhopadhyay, Walter Thomas Ralston
Filed: 22 Feb 22
Utility
Electron Excitation Atomic Layer Etch
21 Sep 23
Disclosed are apparatuses and methods for performing atomic layer etching.
Ivan L. Berry, III, Thorsten Lill, Andreas Fischer
Filed: 21 Mar 23
Utility
Apparatus for Processing a Wafer-shaped Article
21 Sep 23
Apparatus for processing a wafer-shaped article, the apparatus comprising a support configured to support the wafer-shaped article during a processing operation; wherein: the support comprises a support body and a plurality of gripping pin assemblies adapted and positioned relative to the support body for gripping the wafer-shaped article, wherein each of the gripping pin assemblies is rotatable relative to the support body between a gripping configuration in which the gripping pin assemblies grip the wafer-shaped article, and a non-gripping configuration in which the gripping pin assemblies do not grip the wafer-shaped article; each of the gripping pin assemblies protrudes from a respective hole in the support body; and a sealing member is positioned between at least one of the gripping pin assemblies and the respective hole, the sealing member being configured to restrict infiltration of a processing liquid used in the processing operation into the hole.
Michael BRUGGER, Burkhart SCHIER, Michael DULLER
Filed: 7 Apr 21
Utility
Thin Shadow Ring for Low-tilt Trench Etching
21 Sep 23
A thin shadow ring for a substrate processing system includes an annular body having an inner diameter and an outer diameter.
David SETTON, Ambarish CHHATRE, Justin Charles CANNIFF, Dan MAROHL, Craig ROSSLEE
Filed: 30 Jul 21
Utility
Combined Self-forming Barrier and Seed Layer by Atomic Layer Deposition
21 Sep 23
An electrically conductive structure in an integrated circuit (IC) includes recessed features in a dielectric layer filled with metal.
Kyle Jordan Blakeney, Yezdi Dordi
Filed: 10 Aug 21
Utility
Photoresists Containing Tantalum
14 Sep 23
The present disclosure relates to a film formed with a tantalum-based precursor, as well as methods for forming and employing such films.
Eric Calvin Hansen, Chenghao Wu, Timothy William Weidman
Filed: 16 Jul 21
Utility
Distributed Plasma Source Array
14 Sep 23
A substrate processing system includes a processing chamber including a window.
Neil M. P. BENJAMIN, Roger PATRICK
Filed: 10 May 21
Utility
Low Resistance Gate Oxide Metallization Liner
14 Sep 23
Methods and apparatuses for forming low resistivity tungsten using tungsten nitride barrier layers are provided herein.
Lawrence Schloss, Anand Chandrashekar, Juwen Gao, Stephanie Noelle Sandra Sawant-Goubert, Yu Pan
Filed: 29 Jul 20
Utility
Integrated Dry Processes for Patterning Radiation Photoresist Patterning
14 Sep 23
Methods for making thin-films on semiconductor substrates, which may be patterned using EUV, include: depositing the organometallic polymer-like material onto the surface of the semiconductor substrate, exposing the surface to EUV to form a pattern, and developing the pattern for later transfer to underlying layers.
Jengyi Yu, Samantha S.H. Tan, Mohammed Haroon Alvi, Richard Wise, Yang Pan, Richard Alan Gottscho, Adrien LaVoie, Sivananda Krishnan Kanakasabapathy, Timothy William Weidman, Qinghuang Lin, Jerome S. Hubacek
Filed: 15 Mar 23
Utility
Self-limiting Growth
14 Sep 23
Provided herein are methods and apparatuses for forming metal films such as tungsten (W) and molybdenum (Mo) films on semiconductor substrates.
Joshua Collins, Griffin John Kennedy, Hanna Bamnolker, Michal Danek, Shruti Vivek Thombare, Patrick A. van Cleemput, Gorun Butail
Filed: 1 May 23
Utility
Removable Showerhead Faceplate for Semiconductor Processing Tools
7 Sep 23
Showerheads for semiconductor processing operations are disclosed that have removable faceplates and various features that provide additional benefit in the context of removable faceplates.
Manjesh Shankarnarayana, Bin Luo, Eric H. Lenz
Filed: 4 Jun 21
Utility
Substrate Processing Systems Including Gas Delivery System with Reduced Dead Legs
7 Sep 23
A gas delivery system includes a 2-port valve including a first valve located between a first port and a second port.
Ramesh CHANDRASEKHARAN, Antonio Xavier, Frank Loren Pasquale, Ryan Blaquiere, Jennifer Leigh Petraglia, Meenakshi Mamunuru
Filed: 12 May 23
Utility
Pulsing RF Coils of a Plasma Chamber In Reverse Synchronization
7 Sep 23
Systems and methods for pulsing radio frequency (RF) coils are described.
Juline Shoeb, Tom A. Kamp, Alexander Miller Paterson
Filed: 1 Jul 21